JPH04102378A - Manufacture of light emitting diode device - Google Patents

Manufacture of light emitting diode device

Info

Publication number
JPH04102378A
JPH04102378A JP22036490A JP22036490A JPH04102378A JP H04102378 A JPH04102378 A JP H04102378A JP 22036490 A JP22036490 A JP 22036490A JP 22036490 A JP22036490 A JP 22036490A JP H04102378 A JPH04102378 A JP H04102378A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
hole
substrate
end part
breadthwise
hexagonal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22036490A
Inventor
Toshinori Nakahara
Katsuya Ota
Original Assignee
Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Abstract

PURPOSE: To control dicing size accuracy well within ±0.1mm by connecting and cutting two tops of hexagonal through-holes arranged successively lengthwise and breadthwise on a substrate one by one.
CONSTITUTION: A plurality of recessed parts 2 which are arranged lengthwise and breadthwise in pairs parallel to a highly heat resistant resin substrate 1 and a hexagonal through-hole 3 are formed. An end part of a first metallic layer 4 is provided to a bottom of the recessed part 2 and extends as far as a rear 7 passing through a top surface of the substrate 1 and the hole 3; extension direction thereof is toward a central direction. An end part 9 of a second metallic layer 8 is provided to a bottom of the recessed part 2 apart from the end part 5, passes through the top surface 6 and the hole 3 and extends as far as the rear 7; extension direction thereof is opposite to the first metallic layer 4. A size of the hole 3 is (a) of 1.8mm and (b) of 0.8mm. An LED 10 is fused on the end part 5. Dicing is carried out as A1A2A3... breadthwise and B1B2B3B4... lengthwise in transverse direction of the substrate 1 using two tops of the hexagonal holes 3 parallel to one side of the recessed part 2 as a marker one by one and a device 13 is completed.
COPYRIGHT: (C)1992,JPO&Japio
JP22036490A 1990-08-21 1990-08-21 Manufacture of light emitting diode device Pending JPH04102378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22036490A JPH04102378A (en) 1990-08-21 1990-08-21 Manufacture of light emitting diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22036490A JPH04102378A (en) 1990-08-21 1990-08-21 Manufacture of light emitting diode device

Publications (1)

Publication Number Publication Date
JPH04102378A true true JPH04102378A (en) 1992-04-03

Family

ID=16749981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22036490A Pending JPH04102378A (en) 1990-08-21 1990-08-21 Manufacture of light emitting diode device

Country Status (1)

Country Link
JP (1) JPH04102378A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670797A (en) * 1994-12-06 1997-09-23 Sharp Kabushiki Kaisha Compact light-emitting device with sealing member and light-transmitting resin seal
JP2002064226A (en) * 2000-06-28 2002-02-28 Agilent Technol Inc Light source
US6686609B1 (en) * 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
JP2005183993A (en) * 2003-12-19 2005-07-07 Lumileds Lighting Us Llc Led package assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670797A (en) * 1994-12-06 1997-09-23 Sharp Kabushiki Kaisha Compact light-emitting device with sealing member and light-transmitting resin seal
US5814837A (en) * 1994-12-06 1998-09-29 Sharp Kabushiki Kaisha Compact light-emitting device with sealing member
US5882949A (en) * 1994-12-06 1999-03-16 Sharp Kabushiki Kaisha Method of making compact light-emitting device with sealing member
JP2002064226A (en) * 2000-06-28 2002-02-28 Agilent Technol Inc Light source
US6686609B1 (en) * 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
JP2005183993A (en) * 2003-12-19 2005-07-07 Lumileds Lighting Us Llc Led package assembly

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