TWI447961B - Light emitting diode packaging structure - Google Patents

Description

Light-emitting diode package

The present invention relates to light emitting diodes, and more particularly to a light emitting diode package having a side electrode covered by a plating layer.

The light-emitting diode lead frame is an important component for the light-emitting diode to carry the light-emitting chip, to provide the light-emitting chip to the external electrode, to improve the luminous efficiency, and to improve the heat dissipation of the chip. The manufacture of the LED constellation is usually carried out by metal stenting, metal stent plating, metal stent embedding and forming, and the lead frame is finally displayed on the metal plate in an array. Also, since the light-emitting diode product must finally be detached from the material plate to be displayed, the metal must be cut off, and the metal part of the light-emitting diode body is formed.

According to the application requirements of the terminal products, the lead frame has a positive light-emitting form in which the light-emitting surface is parallel to the soldering surface, and a side-emitting form in which the light-emitting surface and the soldering surface are perpendicular. Classified by arrangement, the lead frame array plate has a continuous plate-connected material plate and a separate display separate plate.

When the lead frame of the light-emitting diode is formed of a thermosetting plastic, it must be fabricated by a transfer molding method. The use of the plate-type material plates in which the lead frames are closely arranged, and the light-emitting diodes in the packaging process, the final separation of the monomers is required by the cutting process, so that the metal is cut by the cutting on each of the single-cut surfaces. Raw material section. Since the metal cross section is not covered by the conductive and anti-oxidation coating, in the application of the terminal product, the metal in the region has the risk of not being connected with the solder, and the electrical resistance is caused by the oxidation of the metal, resulting in electrical detection. An abnormality has occurred.

Generally, the electrode system is disposed at the bottom of the light emitting diode package. However, in order to meet various lighting design and aesthetic requirements, it is also necessary to be able to provide electrodes on the side walls of the LED package. However, as described above, the LED component and the metal lead frame are separated by a cutting process, and the cut surface of the metal lead frame is the exposed surface of the side electrode of the sidewall type LED package. Therefore, the exposed area of the side electrodes of the LED package is mainly determined by the thickness of the lead frame. If the exposed area of the side electrodes is to be increased, the total thickness of the LED package will be increased, and the amount and cost of the metal material will be greatly increased.

In addition, in order to maintain the electrical characteristics of the light-emitting diode, at least one plating layer is usually applied to the electrode. However, the coating step of the plating layer is usually performed before the cutting process is performed. Therefore, the exposed surface of the side electrode forming the sidewall type LED package via the cutting process cannot be covered by the plating layer. The surface of the side electrode is the original material of the lead frame, such as bare copper. Bare copper is susceptible to oxidation, and after a long period of time, the electrical characteristics of the light-emitting diode cannot be known by testing these side electrodes. In addition, the solder is less likely to adhere to the bare copper surface. Therefore, it is difficult for the side electrodes of the single-element of the light-emitting diode to be soldered to other package substrates or large devices.

Accordingly, what is needed in the industry is a novel light-emitting diode lead frame and method of fabricating the same that enables a light-emitting diode single element to have a side electrode that is protected by a plating layer and has a large area.

The embodiment of the present invention provides a light emitting diode package, comprising: a lead frame comprising: a first electrode having a first functional area, and a first extended area extending from the first functional area; and a second electrode having a second functional region, and a second extension region extending from the second functional region; a cup-shaped insulator covering the first electrode and the second electrode, the inner side of the cup insulator Forming a light-emitting recess to expose the first functional area and the upper surface of the second functional area, and the outer bottom portion of the cup-shaped insulator partially exposes the first extended area and the second extended area; a spacer block, The first electrode and the second electrode are physically separated at a bottom of the light-emitting groove; and a plating layer partially covering the first electrode and the second electrode surface.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

The invention will be followed by a number of different embodiments to implement different features of the invention. The compositions and configurations in the specific embodiments are described below to simplify the present invention. These are not intended to limit the invention. In addition, repeated element symbols may be present in various examples of the present description in order to simplify the description, but this does not represent a particular connection between the various embodiments and/or the drawings. In addition, a first element that is "above", "above", "below" or "on" a second element may include the first element in the embodiment being in direct contact with the second element, or may also comprise There are other additional elements between the first element and the second element such that the first element is not in direct contact with the second element.

FIG. 1A is a perspective view showing a light emitting diode package according to an embodiment of the invention. Fig. 1B is a top view showing the light emitting diode package in accordance with Fig. 1A. Fig. 1C is a bottom plan view showing the light emitting diode package in accordance with the embodiment of Fig. 1A. Fig. 1D is a side view showing the second electrode of the light emitting diode package in accordance with Fig. 1A.

Referring to FIG. 1A, a light emitting diode package according to an embodiment of the invention may include a lead frame composed of a first electrode 104 and a second electrode 110, wherein the first electrode 104 and the second electrode 110 may be used respectively. As the two electrodes of the light-emitting diode 150. The first electrode 104 and the second electrode 110 are made of the same material as the lead frame array substrate, such as copper, and the surface thereof may be covered by the plating layer 108. The plating layer 108 can be selected from the group consisting of gold and silver. The LED package is finally separated from the lead frame array substrate, so that the first electrode 104 and the second electrode 110 can be separated from the lead frame array substrate by metal stamping or cutting.

The first electrode 104 can include a first functional region 104A and a first extension region 104B extending from the first functional region 104. The second electrode 110 can include a second functional area 110A and a first extended area 110B extending from the first functional area 110A. The cup insulator 124 can be disposed on the first electrode 104 and the second electrode 110 and cover the first electrode 104 and the second electrode 110. The inner side of the cup-shaped insulator may form a light-emitting recess to expose the upper surface of the first functional area 104A and the upper surface of the second functional area 110A. In one embodiment, the LED array 150 can be disposed in the light-emitting recess, and can respectively be the first conductive line 152 and the second conductive line 154 and the first functional region 104A and the second electrode 110 of the first electrode 104. The second functional area 110A is electrically connected. The spacer block 130 may be disposed at the bottom of the light emitting recess and physically isolate the first electrode 104 and the second electrode 110. For example, referring to FIG. 1B, from above, the cup-shaped insulator 124 covers the peripheral portion of the upper surface of the first functional region 104A and the second functional region 110A, and the light-emitting recess located inside the cup-shaped insulator 124 exposes the first portion. An inner portion of the upper surface of the functional area 104A and the second functional area 110A. The cup-shaped insulator 124 may be a thermosetting resin, and the cup-shaped insulator 124 may comprise a thermosetting resin such as an epoxy resin, a silicone, or a combination thereof. The thermosetting resin has better high light and heat resistance than the thermoplastic resin, and has higher design flexibility and higher initial reflectance than the ceramic material and the ruthenium substrate. The cup insulator 124 can be formed by a buried incident process. The spacer block 130 is formed of the same material as the cup insulator 124.

In addition, in addition to the fact that the first and second wires are electrically connected to the first electrode and the second electrode, in another embodiment of the present invention, for example, see FIGS. 4A and 4B, respectively. A schematic perspective view and a top view of the LED package are shown. The LED array 450 can span the spacer block 130 to be simultaneously positioned on the first functional region 104A of the first electrode 104 and the second functional region 110A of the second electrode 110. Therefore, the LED wafer 450 can also be designed to be in direct contact with the first functional region 104A of the first electrode 104 and the second functional region 110 of the second electrode 110, or in a flip chip manner (eg, using solder, not shown) The display is electrically connected to the first functional area 104A of the first electrode 104 and the second functional area 110A of the second electrode 110 without using a wire.

Continuing to FIGS. 1A through 1D, the first extension 104B of the first electrode 104 can be located on the outside of the first functional region 104A and have at least a portion exposed to the outside of the cup insulator 124. The exposed portion of the first extension region 104B can be, for example, located on the outer side of the cup insulator. The second extension 110B of the second electrode 110 may have at least a portion exposed to the outside of the cup insulator 124, and the exposed portion may be located at the bottom of the same side of the cup insulator 124 as the exposed portion of the first extension 104B. The first extension region 104B and the second extension region 110B can serve as side electrodes of the LED package. In addition, in an embodiment, the first electrode 104 and the second electrode 110 may respectively include a first recess 106 and a second recess 112, and the first recess 106 and the second recess 112 may be respectively located in the cup. The outer bottom of the same side of the insulator 124, and the height of the first recess 106 and the second recess 112 are smaller than the thickness of the first functional area 104A and the second functional area 110A. For example, the first recessed portion 106 may be located at a corner of the LED package, and the second recessed portion 112 may be located at another corner of the LED package. The two corners are respectively located in the LED package. Both ends on one side. The first recess 106 can be a recess having a circular arc side wall 104B'. Similarly, as shown in Fig. 1D, the second recessed portion 112 may be a recess having a circular arc side wall 110B'. The size and shape of the first recessed portion 106 and the second recessed portion 112 can be arbitrarily changed according to the design requirements of the LED package.

In the LED package provided by the embodiment of the invention, the first electrode 104 and the second electrode 110 are obtained by a LED package cutting process, and the cutting position is located in the first extension region 104B and the second extension region. 110B. Therefore, the surfaces of the portions of the first extension region 104B and the second extension region 110B (eg, the side surfaces other than the first recess portion and the second recess portion) are exposed surfaces not covered by the plating layer 108, for example, Bare copper surface. However, it is worth noting that the first recessed portion 106 and the second recessed portion 112 are located in the first extension region 104B and the second extension region 110B, but the surface thereof is still covered by the plating layer 108. In other words, except that the surface of the first extension region 104B and the second extension region 110B are exposed surfaces covered by the unplated layer 108, the remaining surface portions of the first electrode 104 and the second electrode 110 are plated. Covered by 108. For example, see Fig. 1C, which shows a bottom view of the light emitting diode package shown in Fig. 1A. Viewed from a bottom view, a portion of the sidewalls of the first electrode 104 and the second electrode 110 are covered by the cup insulator 124 and physically separated by the spacer block 130. The bottom surface of the first electrode 104 (including the first functional region 104A, the first extension region 104B) and the bottom surface of the second electrode 110 (including the second functional region 110A and the second extension region 110B) are all provided by the plating layer 108. cover. In addition, the surfaces of the first recessed portion 106 and the second recessed portion 108 are also covered by the plating layer 108.

Referring to Figure 1E, there is shown a bottom plan view of a spliced leadframe array web in accordance with an embodiment of the present invention. The leadframe connection structure may comprise a plurality of interconnected light emitting diode package bodies. For example, the LED package shown in FIGS. 1A to 1D can be cut by the lead frame structure to obtain one of the cells. The area A may be an area defined by a plurality of parallel cut lines S and a plurality of parallel cut lines S'. The cutting lines S and S' can be substantially vertical. Therefore, after the cutting line S is cut, the enlarged view of the area A is as shown in FIG. 1C. A plurality of cup insulators 124 may be disposed on the lead frame structure and wrap around the periphery of the lead frame structure and fill the gaps of the lead frame structure.

It is worth noting that there may be depressions at the intersection of the cutting lines S and S' (shown in Figure 1E extending into the paper). This depression may for example be a circular arc depression, which may be formed by metal stamping. In an embodiment, the recesses may be shared by adjacent LED packages, and the depth (ie, the height of the recesses in FIG. 1A) may be less than the thickness of the tab-type lead frame array sheets (ie, The thickness of the first electrode and the second electrode in FIG. 1A). For example, as shown in FIG. 1E, the recessed portions 106 are shared by each of the four light emitting diode packages, and the recessed portions 112 are shared by every four of the light emitting diode packages. Therefore, after being cut, the first recessed portion 106 and the second recessed portion 112 may be respectively located at two bottom corners of the LED package body (region A). Moreover, the recesses 106, 112 may be formed prior to forming the plating layer 108 and thus may be covered by the plating layer 108. Therefore, the recesses 106 and 112 can still be covered by the plating layer 108 after being cut.

Therefore, by forming the recesses 106 and 112, the side electrodes of the single-element of the light-emitting diode can be protected by the plating layer 108. Furthermore, the recesses 106 and 112 have an increased surface area compared to the plane. Therefore, the light emitting diode package provided in accordance with an embodiment of the present invention has a side electrode protected by a plating layer and having a large area. It should be noted that the structure of the LED package as shown in FIGS. 1A to 1D can also be realized in the separate lead frame array material, which only needs to be before the cutting lines S and S' before forming the plating layer. The recess can be formed at the intersection.

2A to 2E are diagrams showing a light emitting diode package according to another embodiment of the present invention, wherein FIG. 2A is a perspective view showing a light emitting diode package according to another embodiment of the present invention. 2B is a top view of the LED package according to FIG. 2A, FIG. 2C is a bottom view of the LED package according to FIG. 2A, and FIG. 2D is a diagram according to FIG. 2A. Side view of the second electrode of the diode package. The technical features of the present embodiment and the foregoing embodiments are substantially the same as those of the foregoing embodiments, and thus the detailed description thereof will not be repeated. Accordingly, the same reference numerals are used to refer to the This embodiment differs from the previous embodiment in that the first recessed portion and the second recessed portion are recesses having beveled side walls.

Referring to FIG. 2A, the LED package provided in accordance with an embodiment of the present invention may include a lead frame that may include a first electrode 204 and a second electrode 210. The first electrode 204 can include a first functional region 204A and a first extension region 204B extending from the first functional region 204. The second electrode 210 can include a second functional area 210A and a first extended area 210B extending from the first functional area 210A. The first electrode 204 and the second electrode 210 are made of the same material as the lead frame array substrate, such as copper, and the surface thereof may be covered by the plating layer 208. The plating layer 208 can be selected from the group consisting of gold and silver. The LED package is finally separated from the lead frame array substrate, so that the first electrode 204 and the second electrode 210 can be separated from the lead frame array substrate by metal stamping or cutting.

The cup insulator 224 may be disposed on the first electrode 204 and the second electrode 210 to cover the first electrode 204 and the second electrode 210. The inner side of the cup insulator may form a light emitting groove to expose the upper surface of the first functional region 204A and the upper surface of the second functional region 210A. The LED substrate 250 can be disposed in the light emitting recess, and can be electrically connected to the first functional region 204A of the first electrode 204 and the second functional region 210A of the second electrode 210 by the first conductive line 252 and the second conductive line 254, respectively. Sexual connection. The spacer block 230 can be disposed at the bottom of the light emitting recess and physically isolate the first electrode 204 and the second electrode 210.

The first extension 204B of the first electrode 204 may be located on the outer side of the first functional region 204A and have at least a portion exposed to one of the outer bottoms of the cup insulator 224. The second extension 210B of the second electrode 210 may have at least a portion exposed to one of the outer sides of the cup insulator 224, and the exposed portion may be located at the bottom of the same side of the cup insulator 224 as the exposed portion of the first extension 204B. The first extension region 204B and the second extension region 210B can serve as side electrodes of the light emitting diode package. In one embodiment, the first electrode 204 and the second electrode 210 may respectively include a first recess 206 and a second recess 212, and the first recess 206 and the second recess 212 may be respectively located in a cup insulator. The outer bottom of the same side of 224. In addition, the heights of the first and second recesses 206, 212 may be smaller than the thickness of the first functional area 204A and the second functional area 210A. For example, the first recessed portion 206 and the second recessed portion 212 may be respectively located at opposite ends of the same side of the LED package. The first recess 206 can be a recess having a beveled sidewall 204B'. Similarly, as shown in Fig. 2D, the second recess 212 may be a recess having a beveled sidewall 210B'. The size and shape of the first recessed portion 206 and the second recessed portion 212 can be arbitrarily changed according to the design requirements of the LED package. The surface of the portion of the first extension 204B and the second extension 210B is an exposed surface covered by the unplated layer 208 (eg, a side surface other than the first recess and the second recess), such as a bare copper surface. . The first recessed portion 206 and the second recessed portion 212 are located in the first extension region 204B and the second extension region 210B, but the surface thereof is still covered by the plating layer 208.

Referring to Fig. 2E, there is shown a bottom plan view of a leadframe splicing structure in accordance with another embodiment of the present invention. The LED package shown in FIGS. 2A to 2D can be cut by the lead frame structure to obtain one of the cells. The area A may be an area defined by a plurality of parallel cut lines S and a plurality of parallel cut lines S'. A plurality of cup insulators 224 may be disposed on the lead frame structure and wrap around the periphery of the lead frame structure and fill the gaps of the lead frame structure. There may be a depression at the intersection of the cutting lines S and S' (the display in Fig. 2E extends into the paper). The recesses 206 and 212 can be, for example, square or trapezoidal depressions that can be formed from metal stamping. In an embodiment, the recesses 206, 212 may be shared by their adjacent LED packages, and the depth (ie, the height of the recess in FIG. 2A) may be less than the thickness of the tab-type lead frame array. (i.e., the thickness of the first electrode and the second electrode in Fig. 2A). For example, as shown in FIG. 2E, the recessed portion 206 is shared by every four LED package bodies, and the recess portion 212 is shared by every four LED packages. Therefore, after being cut, the first recessed portion 206 and the second recessed portion 212 may respectively be located at two bottom corners of the LED package body (region A). Moreover, the recesses may be formed prior to forming the plating layer and thus may be covered by the plating layer 208, and after being cut, the recesses 206 and 212 may still be covered by the plating layer 208 and may be used as the plating layer 208 Cover the side electrodes.

It should be noted that the structure of the LED package as shown in FIGS. 2A to 2D can also be realized in the separate lead frame array material, which only needs to be before the cutting lines S and S' before forming the plating layer. The recess can be formed at the intersection. Therefore, by forming the recesses 206 and 212, the side electrodes of the single-element of the light-emitting diode can be protected by the plating layer 208. Furthermore, the recesses 206 and 212 have an increased surface area compared to the plane. Therefore, the light emitting diode package provided in accordance with an embodiment of the present invention has a side electrode protected by a plating layer and having a large area.

Referring to FIGS. 3A to 3E, there is shown a light emitting diode package according to still another embodiment of the present invention, wherein FIG. 3A is a perspective view showing a light emitting diode package. Figure 3B shows a top view of the LED package in accordance with Figure 3A. Fig. 3C is a bottom plan view showing the light emitting diode package in accordance with Fig. 3A. Fig. 3D is a side view showing the second electrode of the light emitting diode package in accordance with Fig. 3A. The technical features of the present embodiment and the foregoing embodiments are substantially the same as those of the foregoing embodiments, and thus the detailed description thereof will not be repeated. Accordingly, the same reference numerals are used to refer to the The difference between this embodiment and the foregoing embodiment is that the heights of the first recessed portion and the second recessed portion are greater than the thicknesses of the first functional region and the second functional region.

Referring to FIG. 3A, a light emitting diode package according to an embodiment of the present invention may include a lead frame that may include a first electrode 304 and a second electrode 310. The first electrode 304 can include a first functional region 304A and a first extension region 304B extending from the first functional region 304. The second electrode 310 can include a second functional area 310A and a first extended area 310B extending from the first functional area 310A. The composition of the first electrode 304 and the second electrode 310 can be cut by a lead frame structure as described in FIG. 3E (discussed later), and a majority of its surface can be covered by the plating layer 308. The plating layer 308 can be selected from the group consisting of gold and silver. The cup insulator 324 may be disposed on the first electrode 304 and the second electrode 310 to cover the first electrode 304 and the second electrode 310. The inner side of the cup-shaped insulator may form a light-emitting recess to expose the upper surface of the first functional region 304A and the upper surface of the second functional region 310A. The LED substrate 350 can be disposed in the light-emitting recess, and can be electrically connected to the first functional region 304A of the first electrode 304 and the second functional region 310A of the second electrode 310 by the first wire 352 and the second wire 354, respectively. Sexual connection. The spacer block 310 can be disposed at the bottom of the light emitting recess and physically isolate the first electrode 304 and the second electrode 310.

The first extension 304B of the first electrode 304 may be located on the outer side of the first functional region 304A and have at least a portion exposed to the outside of one of the cup insulators 324. The exposed portion of the first extension 304B can be, for example, located at the bottom of one of the outer sides of the cup insulator. The second extension 310B of the second electrode 310 may have at least a portion exposed to one of the outer sides of the cup insulator 324, and the exposed portion may be located at the bottom of the same side of the cup insulator 324 as the exposed portion of the first extension 304B. The first extension region 304B and the second extension region 310B can serve as side electrodes of the light emitting diode package. In one embodiment, the first electrode 304 and the second electrode 310 may respectively include a first recess 306 and a second recess 312, and the first recess 306 and the second recess 312 may be respectively located in the cup insulator The outer bottom of the same side of the 324, and the height of the recess is greater than the thickness of the first functional area 304A and the second functional area 310A. For example, the first recessed portion 306 and the second recessed portion 312 may be respectively located at two ends of the same side of the LED package, and the first recessed portion 306 and the second recessed portion 312. The first recess 306 can be a recess having a curved sidewall 304B'. Similarly, as shown in Fig. 3D, the second recessed portion 312 has a recess that bends the side wall 310B'. The size and shape of the first recessed portion 306 and the second recessed portion 312 can be arbitrarily changed according to the design requirements of the LED package. The surface of the portion of the first extension region 304B and the second extension region 310B is an exposed surface covered by the unplated layer 308 (eg, a side surface other than the first recess portion and the second recess portion), such as a bare copper surface. . The first recessed portion 306 and the second recessed portion 312 are located in the first extension region 304B and the second extension region 310B, but the surface thereof is still covered by the plating layer 308.

Referring to Fig. 3E, there is shown a bottom plan view of a leadframe splicing structure in accordance with yet another embodiment of the present invention. The LED package shown in FIGS. 3A to 3D can be cut by the lead frame structure to obtain one of the cells. The area A may be an area defined by a plurality of parallel cut lines S and a plurality of parallel cut lines S'. A plurality of cup insulators 324 may be disposed on the lead frame structure and cover the periphery of the lead frame structure and fill the gaps of the lead frame structure. There may be a depression at the intersection of the cutting lines S and S' (the extension shown in Fig. 3E extends into the paper). This depression may for example be a square or trapezoidal depression, which may be formed by metal stamping. In one embodiment, the recesses may be shared by their adjacent light emitting diode packages, and the depth (i.e., the height of the recesses in FIG. 3A) may be greater than the thickness of the metal plate leadframe.

For example, as shown in FIG. 3E, the recessed portions 306 are shared by every four LED packages, and the recesses 312 are shared by each of the four LED packages. Therefore, after being cut, the first recessed portion 306 and the second recessed portion 312 may be respectively located at two bottom corners of the LED package body (region A). Moreover, the recesses 306, 312 can be formed prior to the plating layer 308 and thus can be covered by the plating layer 308, and after being cut, the recesses 306 and 312 can still be covered by the plating layer 308 and can be used as a plating layer The side electrodes covered by 308. It should be noted that the LED package structure as shown in FIGS. 3A to 3D can also be implemented in a separate lead frame array material, which only needs to be before the cutting lines S and S' before forming the plating layer. The recess can be formed at the intersection.

Therefore, by forming the recesses 306 and 312, the side electrodes of the single-element of the light-emitting diode can be protected by the plating layer 308. Furthermore, the recesses 306 and 312 have an increased surface area compared to the plane. Therefore, the light emitting diode package provided in accordance with an embodiment of the present invention has a side electrode protected by a plating layer and having a large area.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.

104. . . First electrode

104A. . . First functional area

104B. . . First extension

104B’. . . Curved side wall

106. . . First depression

108. . . Plating

110. . . Second electrode

110A. . . Second functional area

110B. . . Second extension

110B’. . . Curved side wall

112. . . Second depression

130. . . Spacer block

124. . . Cup insulator

150. . . Light-emitting diode

152. . . First wire

154. . . Second wire

204. . . First electrode

204A. . . First functional area

204B. . . First extension

204B’. . . Beveled side wall

206. . . First depression

208. . . Plating

210. . . Second electrode

210A. . . Second functional area

210B. . . Second extension

210B’. . . Beveled side wall

212. . . Second depression

230. . . Spacer block

224. . . Cup insulator

250. . . Light-emitting diode

252. . . First wire

254. . . Second wire

304. . . First electrode

304A. . . First functional area

304B. . . First extension

304B’. . . Bending side wall

306. . . First depression

308. . . Plating

310. . . Second electrode

310A. . . Second functional area

310B. . . Second extension

310B’. . . Bending side wall

312. . . Second depression

330. . . Spacer block

324. . . Cup insulator

350. . . Light-emitting diode

352. . . First wire

354. . . Second wire

450. . . Light-emitting diode

FIG. 1A is a perspective view showing a light emitting diode package according to an embodiment of the invention.

Fig. 1B is a top view showing the light emitting diode package shown in Fig. 1A.

Fig. 1C is a bottom plan view showing the light emitting diode package shown in Fig. 1A.

Fig. 1D is a side view showing the second electrode of the light emitting diode package shown in Fig. 1A.

Figure 1E shows a leadframe splicing structure in accordance with an embodiment of the present invention.

FIG. 2A is a perspective view showing a light emitting diode package according to another embodiment of the present invention.

Fig. 2B is a top view showing the light emitting diode package shown in Fig. 2A.

Fig. 2C is a bottom plan view showing the light emitting diode package shown in Fig. 2A.

Fig. 2D is a side view showing the second electrode of the light emitting diode package shown in Fig. 2A.

Fig. 2E is a view showing a lead frame connecting plate structure in accordance with another embodiment of the present invention.

FIG. 3A is a perspective view showing a light emitting diode package according to still another embodiment of the present invention.

Fig. 3B is a top view showing the light emitting diode package shown in Fig. 3A.

Fig. 3C is a bottom plan view showing the light emitting diode package shown in Fig. 3A.

Fig. 3D is a side view showing the second electrode of the light emitting diode package shown in Fig. 3A.

Figure 3E shows a leadframe splicing structure in accordance with yet another embodiment of the present invention.

FIG. 4A is a perspective view showing a light emitting diode package according to still another embodiment of the present invention.

Fig. 4B is a top view showing the light emitting diode package in accordance with Fig. 4A.

104. . . First electrode

104A. . . First functional area

104B. . . First extension

104B’. . . Curved side wall

106. . . First depression

108. . . Plating

110. . . Second electrode

110A. . . Second functional area

110B. . . Second extension

112. . . Second depression

124. . . Cup insulator

130. . . Spacer block

150. . . Light-emitting diode

152. . . First wire

154. . . Second wire

Claims (13)

A light emitting diode package includes: a lead frame comprising: a first electrode having a first functional area, and a first extended area extending from the first functional area; and a second electrode having a second functional area, and a second extension area extending from the second functional area; a cup-shaped insulator covering the first electrode and the second electrode, and forming a light-emitting groove on the inner side of the cup-shaped insulator Exposing the first functional area and the upper surface of the second functional area, and the outer bottom of the cup-shaped insulator partially exposes the first extended area and the second extended area; a spacer block is disposed at the bottom of the light-emitting groove Physically isolating the first electrode and the second electrode; and a plating layer partially covering the first electrode and the exposed second electrode surface. The light emitting diode package of claim 1, wherein the exposed first extending region and the exposed second extending region respectively have a first recessed portion and a second recessed portion. The light-emitting diode package of claim 2, wherein the first recessed portion and the second recessed portion are respectively located at an outer bottom portion of the same side of the cup-shaped insulator. The light-emitting diode package of claim 2, wherein the first recessed portion and the second recessed portion are respectively located at outer bottoms of both ends of the same side of the cup-shaped insulator. The light emitting diode package of claim 4, wherein the first recessed portion and the second recessed portion comprise a circular arc side wall, a sloped side wall or a bent side wall. The light emitting diode package of claim 5, wherein the first recessed portion and the second recessed portion are formed by stamping. The light-emitting diode package of claim 1, wherein the plating layer is selected from the group consisting of gold and silver. The illuminating diode package of claim 1, further comprising a light emitting diode chip disposed on the first and second functional regions in the illuminating recess. The illuminating diode package of claim 1, further comprising a light emitting diode chip disposed on the first or second functional area in the illuminating recess. The light emitting diode package of claim 8, wherein the light emitting diode chip is electrically connected to the first functional area and the second functional area. The illuminating diode package of claim 9, wherein the illuminating diode chip is electrically connected to the first functional area and the second functional area by wires. The light-emitting diode package of claim 1, wherein the cup-shaped insulator further comprises a thermosetting resin. The light-emitting diode package of claim 12, wherein the thermosetting resin comprises an epoxy resin, a silicone resin, or a combination thereof.