JPS6157620A - 有機溶媒可溶性の感光性ポリイミド - Google Patents

有機溶媒可溶性の感光性ポリイミド

Info

Publication number
JPS6157620A
JPS6157620A JP18156784A JP18156784A JPS6157620A JP S6157620 A JPS6157620 A JP S6157620A JP 18156784 A JP18156784 A JP 18156784A JP 18156784 A JP18156784 A JP 18156784A JP S6157620 A JPS6157620 A JP S6157620A
Authority
JP
Japan
Prior art keywords
polyimide
photosensitive polyimide
aromatic
solution
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18156784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231103B2 (enExample
Inventor
Kohei Nakajima
中島　紘平
Kazuaki Nishio
一章 西尾
Toshiya Koyama
俊哉 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP18156784A priority Critical patent/JPS6157620A/ja
Publication of JPS6157620A publication Critical patent/JPS6157620A/ja
Publication of JPH0231103B2 publication Critical patent/JPH0231103B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP18156784A 1984-08-30 1984-08-30 有機溶媒可溶性の感光性ポリイミド Granted JPS6157620A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18156784A JPS6157620A (ja) 1984-08-30 1984-08-30 有機溶媒可溶性の感光性ポリイミド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18156784A JPS6157620A (ja) 1984-08-30 1984-08-30 有機溶媒可溶性の感光性ポリイミド

Publications (2)

Publication Number Publication Date
JPS6157620A true JPS6157620A (ja) 1986-03-24
JPH0231103B2 JPH0231103B2 (enExample) 1990-07-11

Family

ID=16103057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18156784A Granted JPS6157620A (ja) 1984-08-30 1984-08-30 有機溶媒可溶性の感光性ポリイミド

Country Status (1)

Country Link
JP (1) JPS6157620A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6313032A (ja) * 1986-07-03 1988-01-20 Ube Ind Ltd 有機溶媒可溶性のポジ型感光性ポリイミド組成物
US5665523A (en) * 1994-03-29 1997-09-09 Nitto Denko Corporation Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern
US5851736A (en) * 1991-03-05 1998-12-22 Nitto Denko Corporation Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern
EP1070590A2 (en) * 1999-07-23 2001-01-24 Konica Corporation Ink jet head and production method of the same
US6350845B1 (en) 1999-06-28 2002-02-26 Kaneka Corporation Polyimide compositions and novel acid dianhydrides to be used therein
US6436593B1 (en) 1999-09-28 2002-08-20 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, process for producing pattern and electronic parts
US7435525B2 (en) 2004-05-07 2008-10-14 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, method for forming pattern, and electronic part
US7638254B2 (en) 2004-05-07 2009-12-29 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for forming pattern, and electronic part
US8298747B2 (en) 2007-03-12 2012-10-30 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
US8420291B2 (en) 2007-10-29 2013-04-16 Hitachi Chemical Dupont Microsystems, Ltd. Positive photosensitive resin composition, method for forming pattern, electronic component
US8758977B2 (en) 2005-09-22 2014-06-24 Hitachi Chemical Dupont Microsystems, Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131227A (en) * 1981-02-09 1982-08-14 Nippon Telegr & Teleph Corp <Ntt> Photopolymer and its production

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131227A (en) * 1981-02-09 1982-08-14 Nippon Telegr & Teleph Corp <Ntt> Photopolymer and its production

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6313032A (ja) * 1986-07-03 1988-01-20 Ube Ind Ltd 有機溶媒可溶性のポジ型感光性ポリイミド組成物
US5851736A (en) * 1991-03-05 1998-12-22 Nitto Denko Corporation Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern
US5665523A (en) * 1994-03-29 1997-09-09 Nitto Denko Corporation Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern
US6642393B2 (en) 1999-06-28 2003-11-04 Kaneka Corporation Acid anhydrides
US6350845B1 (en) 1999-06-28 2002-02-26 Kaneka Corporation Polyimide compositions and novel acid dianhydrides to be used therein
EP1070590A2 (en) * 1999-07-23 2001-01-24 Konica Corporation Ink jet head and production method of the same
US6436593B1 (en) 1999-09-28 2002-08-20 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, process for producing pattern and electronic parts
US7435525B2 (en) 2004-05-07 2008-10-14 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, method for forming pattern, and electronic part
US7638254B2 (en) 2004-05-07 2009-12-29 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for forming pattern, and electronic part
EP2469337A1 (en) 2004-05-07 2012-06-27 Hitachi Chemical DuPont MicroSystems Ltd. Positive photosensitive resin composition, method for forming pattern, and electronic component
US8758977B2 (en) 2005-09-22 2014-06-24 Hitachi Chemical Dupont Microsystems, Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts
US8871422B2 (en) 2005-09-22 2014-10-28 Hitachi Chemical Dupont Microsystems Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts
US8298747B2 (en) 2007-03-12 2012-10-30 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
US8420291B2 (en) 2007-10-29 2013-04-16 Hitachi Chemical Dupont Microsystems, Ltd. Positive photosensitive resin composition, method for forming pattern, electronic component

Also Published As

Publication number Publication date
JPH0231103B2 (enExample) 1990-07-11

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Legal Events

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