JPH0231103B2 - - Google Patents
Info
- Publication number
- JPH0231103B2 JPH0231103B2 JP59181567A JP18156784A JPH0231103B2 JP H0231103 B2 JPH0231103 B2 JP H0231103B2 JP 59181567 A JP59181567 A JP 59181567A JP 18156784 A JP18156784 A JP 18156784A JP H0231103 B2 JPH0231103 B2 JP H0231103B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- aromatic
- general formula
- mol
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18156784A JPS6157620A (ja) | 1984-08-30 | 1984-08-30 | 有機溶媒可溶性の感光性ポリイミド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18156784A JPS6157620A (ja) | 1984-08-30 | 1984-08-30 | 有機溶媒可溶性の感光性ポリイミド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6157620A JPS6157620A (ja) | 1986-03-24 |
| JPH0231103B2 true JPH0231103B2 (enExample) | 1990-07-11 |
Family
ID=16103057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18156784A Granted JPS6157620A (ja) | 1984-08-30 | 1984-08-30 | 有機溶媒可溶性の感光性ポリイミド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6157620A (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0644154B2 (ja) * | 1986-07-03 | 1994-06-08 | 宇部興産株式会社 | 有機溶媒可溶性のポジ型感光性ポリイミド組成物 |
| US5851736A (en) * | 1991-03-05 | 1998-12-22 | Nitto Denko Corporation | Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern |
| JP3709997B2 (ja) * | 1994-03-29 | 2005-10-26 | 日東電工株式会社 | 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法 |
| JP3942063B2 (ja) | 1999-06-28 | 2007-07-11 | 株式会社カネカ | 新規ポリイミド組成物およびこれに使用される新規酸二無水物 |
| EP1070590A3 (en) * | 1999-07-23 | 2001-06-13 | Konica Corporation | Ink jet head and production method of the same |
| JP4529252B2 (ja) | 1999-09-28 | 2010-08-25 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造法及び電子部品 |
| KR100774672B1 (ko) | 2004-05-07 | 2007-11-08 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및전자부품 |
| US7638254B2 (en) | 2004-05-07 | 2009-12-29 | Hitachi Chemical Dupont Microsystems Ltd | Positive photosensitive resin composition, method for forming pattern, and electronic part |
| TWI407255B (zh) | 2005-09-22 | 2013-09-01 | Hitachi Chem Dupont Microsys | 負片型感光性樹脂組成物、圖案形成方法以及電子零件 |
| EP2133743B1 (en) | 2007-03-12 | 2018-01-24 | Hitachi Chemical DuPont Microsystems, Ltd. | Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part |
| JP5176872B2 (ja) | 2007-10-29 | 2013-04-03 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パタ−ンの製造方法及び電子部品 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57131227A (en) * | 1981-02-09 | 1982-08-14 | Nippon Telegr & Teleph Corp <Ntt> | Photopolymer and its production |
-
1984
- 1984-08-30 JP JP18156784A patent/JPS6157620A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6157620A (ja) | 1986-03-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4595745A (en) | Organic solvent-soluble photosensitive polyamide resin | |
| JPH0526186B2 (enExample) | ||
| JPH0225378B2 (enExample) | ||
| TW201921114A (zh) | 感光性樹脂組成物 | |
| JPS59108031A (ja) | 感光性ポリイミド | |
| JPH0231103B2 (enExample) | ||
| JPS606729A (ja) | 有機溶媒に可溶性の感光性ポリイミド | |
| JPS59232122A (ja) | 有機溶媒可溶性の感光性ポリイミド | |
| JPH0531132B2 (enExample) | ||
| JPH0526187B2 (enExample) | ||
| WO1998004959A1 (fr) | Compositions de resine negative et leur application | |
| JPS6042425A (ja) | 化学線感応性重合体組成物 | |
| JPH0424694B2 (enExample) | ||
| JPS60178446A (ja) | 有機溶媒可溶性の感光材料 | |
| JPH0315929B2 (enExample) | ||
| JPS61238809A (ja) | 感光性ポリイミドの樹脂液組成物 | |
| JPS606728A (ja) | 有機溶媒可溶性の感光性ポリアミドイミド | |
| JP2022073737A (ja) | 感光性樹脂組成物、および硬化膜の製造方法 | |
| JPS6116970B2 (enExample) | ||
| JP2006058324A (ja) | ネガ型感光性ポリイミド前駆体組成物 | |
| JPH09258439A (ja) | 感光性樹脂組成物 | |
| JPH0337571B2 (enExample) | ||
| JP2540927B2 (ja) | 感光性樹脂組成物およびこれを用いた感光性エレメント | |
| JPH0259170B2 (enExample) | ||
| JPH0643640A (ja) | 感光性ポリイミドプリカーサー組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |