JPS6155930A - 工程間リ−ドフレ−ム搬送装置 - Google Patents
工程間リ−ドフレ−ム搬送装置Info
- Publication number
- JPS6155930A JPS6155930A JP17875984A JP17875984A JPS6155930A JP S6155930 A JPS6155930 A JP S6155930A JP 17875984 A JP17875984 A JP 17875984A JP 17875984 A JP17875984 A JP 17875984A JP S6155930 A JPS6155930 A JP S6155930A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- inspection
- frame
- processing steps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 238000007689 inspection Methods 0.000 claims abstract description 23
- 230000002950 deficient Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 35
- 230000007723 transport mechanism Effects 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000007781 pre-processing Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 11
- 239000011265 semifinished product Substances 0.000 description 8
- 230000032258 transport Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17875984A JPS6155930A (ja) | 1984-08-27 | 1984-08-27 | 工程間リ−ドフレ−ム搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17875984A JPS6155930A (ja) | 1984-08-27 | 1984-08-27 | 工程間リ−ドフレ−ム搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6155930A true JPS6155930A (ja) | 1986-03-20 |
JPH032341B2 JPH032341B2 (enrdf_load_stackoverflow) | 1991-01-14 |
Family
ID=16054102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17875984A Granted JPS6155930A (ja) | 1984-08-27 | 1984-08-27 | 工程間リ−ドフレ−ム搬送装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6155930A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01108729A (ja) * | 1987-10-21 | 1989-04-26 | Mitsubishi Electric Corp | 半導体アセンブリ製造装置 |
JPH01199437A (ja) * | 1988-02-04 | 1989-08-10 | Sanyo Electric Co Ltd | 半導体製造装置 |
WO2006093120A1 (ja) * | 2005-03-01 | 2006-09-08 | Tokyo Electron Limited | 中継ステーション及び中継ステーションを用いた基板処理システム |
ITUD20090156A1 (it) * | 2009-09-03 | 2011-03-04 | Applied Materials Inc | Apparato di lavorazione substrati comprendente un dispositivo per la manipolazione di substrati danneggiati |
-
1984
- 1984-08-27 JP JP17875984A patent/JPS6155930A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01108729A (ja) * | 1987-10-21 | 1989-04-26 | Mitsubishi Electric Corp | 半導体アセンブリ製造装置 |
JPH01199437A (ja) * | 1988-02-04 | 1989-08-10 | Sanyo Electric Co Ltd | 半導体製造装置 |
WO2006093120A1 (ja) * | 2005-03-01 | 2006-09-08 | Tokyo Electron Limited | 中継ステーション及び中継ステーションを用いた基板処理システム |
KR100840959B1 (ko) | 2005-03-01 | 2008-06-24 | 도쿄엘렉트론가부시키가이샤 | 중계 스테이션 및 중계 스테이션을 이용한 기판 처리시스템 |
ITUD20090156A1 (it) * | 2009-09-03 | 2011-03-04 | Applied Materials Inc | Apparato di lavorazione substrati comprendente un dispositivo per la manipolazione di substrati danneggiati |
Also Published As
Publication number | Publication date |
---|---|
JPH032341B2 (enrdf_load_stackoverflow) | 1991-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000283924A (ja) | ワーク検査方法および装置 | |
KR100497506B1 (ko) | 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치 | |
US6705001B2 (en) | Apparatus for assembling integrated circuit packages | |
JPH04105737A (ja) | ハイブリッドicのリードカット装置 | |
JPS6155930A (ja) | 工程間リ−ドフレ−ム搬送装置 | |
US4982728A (en) | Apparatus for assembling semiconductor devices | |
KR20000047308A (ko) | 반도체팩키지의 싱귤레이션 및 적재시스템 | |
JP3041984B2 (ja) | ワイヤボンディング・システム | |
KR100497505B1 (ko) | 반도체 패키지의 싱귤레이션 방법 및 장치 | |
JP2553517B2 (ja) | 電子装置の製造装置 | |
KR20000009145A (ko) | 반도체 팩키지용 자동몰딩장치 | |
JPS61101034A (ja) | 半導体装置製造システム | |
JPH11309419A (ja) | Ngストッカ装置 | |
KR100446111B1 (ko) | 반도체 패키지 몰딩 프레스 장치 및 이의 반도체 패키지몰딩 프레스 방법 | |
JP2590488B2 (ja) | リ−ドフレ−ム搬送装置 | |
JPS63184344A (ja) | 半導体製造装置 | |
CN115709179A (zh) | 用于qfn芯片的自动光学检测设备 | |
JP3304569B2 (ja) | 排出シュータ付き搬送レール機構 | |
JPH0737907A (ja) | 半導体処理装置およびその処理方法 | |
JPS61279136A (ja) | 工程間リ−ドフレ−ム搬送装置 | |
JP3332519B2 (ja) | リード加工機のピックアップ機構 | |
KR20000056424A (ko) | 플립칩용 디스펜싱 장치 | |
JP2664951B2 (ja) | 半導体製造装置 | |
JPS62153022A (ja) | 搬送装置 | |
JPH11286318A (ja) | ワーク搬送処理方法及び装置 |