JPS6152375A - ニツケル−金マスクによつて被覆された銅をエツチングする方法及び装置 - Google Patents

ニツケル−金マスクによつて被覆された銅をエツチングする方法及び装置

Info

Publication number
JPS6152375A
JPS6152375A JP60103648A JP10364885A JPS6152375A JP S6152375 A JPS6152375 A JP S6152375A JP 60103648 A JP60103648 A JP 60103648A JP 10364885 A JP10364885 A JP 10364885A JP S6152375 A JPS6152375 A JP S6152375A
Authority
JP
Japan
Prior art keywords
copper
etching
gold
nickel
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60103648A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0136555B2 (cg-RX-API-DMAC7.html
Inventor
ノーヴエル　ジヨン　ネルソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
P S I STAR
Original Assignee
P S I STAR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P S I STAR filed Critical P S I STAR
Publication of JPS6152375A publication Critical patent/JPS6152375A/ja
Publication of JPH0136555B2 publication Critical patent/JPH0136555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
JP60103648A 1984-05-17 1985-05-15 ニツケル−金マスクによつて被覆された銅をエツチングする方法及び装置 Granted JPS6152375A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/611,190 US4543153A (en) 1984-05-17 1984-05-17 Process and apparatus for etching copper masked by a nickel-gold mask
US611190 1984-05-17

Publications (2)

Publication Number Publication Date
JPS6152375A true JPS6152375A (ja) 1986-03-15
JPH0136555B2 JPH0136555B2 (cg-RX-API-DMAC7.html) 1989-08-01

Family

ID=24447987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60103648A Granted JPS6152375A (ja) 1984-05-17 1985-05-15 ニツケル−金マスクによつて被覆された銅をエツチングする方法及び装置

Country Status (6)

Country Link
US (1) US4543153A (cg-RX-API-DMAC7.html)
JP (1) JPS6152375A (cg-RX-API-DMAC7.html)
CA (1) CA1223082A (cg-RX-API-DMAC7.html)
DE (1) DE3516760A1 (cg-RX-API-DMAC7.html)
FR (1) FR2564683A1 (cg-RX-API-DMAC7.html)
GB (1) GB2159102B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119594A (ja) * 1986-09-15 1988-05-24 ピーエスアイ　スター 銅のエッチング方法並びにその製品

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3430075A1 (de) * 1984-08-16 1986-02-27 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum herstellen einer messsonde zur verwendung bei der messung der temperatur oder masse eines stroemenden mediums
DE3701456A1 (de) * 1987-01-20 1988-07-28 Herrmann Ritzenhoff Fa Verfahren zur herstellung von dekorativen oder informativen musterungen an gegenstaenden, die aus einfach oder gegebenenfalls mehrfach plattierten blechen gebildet wurden
GB2206541A (en) * 1987-07-02 1989-01-11 Psi Star Inc Manufacturing printed circuit boards
US4925522A (en) * 1989-08-21 1990-05-15 Gte Products Corporation Printed circuit assembly with contact dot
US5108562A (en) * 1991-02-06 1992-04-28 International Business Machines Electrolytic method for forming vias and through holes in copper-invar-copper core structures
US5304284A (en) * 1991-10-18 1994-04-19 International Business Machines Corporation Methods for etching a less reactive material in the presence of a more reactive material
FR2776020B1 (fr) * 1998-03-11 2000-05-05 Renault Procede de controle de l'injection dans un moteur a combustion interne et allumage commande, alimente par du carburant gazeux liquefie ou par un carburant gazeux sous des conditions soniques
DE102009015604A1 (de) * 2009-04-02 2010-10-07 Siemens Aktiengesellschaft Verfahren zur Strukturierung einer auf einem Substrat befindlichen Schicht mit mehreren Lagen
EP2918707B1 (en) 2014-03-12 2019-05-22 Rolls-Royce North American Technologies, Inc. Anisotropic etching of metallic substrates
EP3518631A1 (en) 2018-01-29 2019-07-31 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Anisotropic etching using highly branched polymers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1047275A (cg-RX-API-DMAC7.html) *
GB229414A (en) * 1923-11-29 1925-02-26 Robert David Lewis Improvements in air tubes or pipes for use in colliery ventilation and the like
GB840284A (en) * 1957-04-12 1960-07-06 Machlett Lab Inc Improvements in high voltage switching tubes
DE1164528B (de) * 1960-02-10 1964-03-05 Ruwel Werke Gmbh Verfahren zum Herstellen von gedruckten Leiterplatten
US3287191A (en) * 1963-07-23 1966-11-22 Photo Engravers Res Inc Etching of printed circuit components
GB1364660A (en) * 1971-12-02 1974-08-29 Standard Telephones Cables Ltd Method of producing electrical interconnection patterns
JPS5313177B2 (cg-RX-API-DMAC7.html) * 1973-06-20 1978-05-08
JPS5540120B2 (cg-RX-API-DMAC7.html) * 1974-11-30 1980-10-15
SE404863B (sv) * 1975-12-17 1978-10-30 Perstorp Ab Forfarande vid framstellning av ett flerlagerkort

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119594A (ja) * 1986-09-15 1988-05-24 ピーエスアイ　スター 銅のエッチング方法並びにその製品

Also Published As

Publication number Publication date
US4543153A (en) 1985-09-24
FR2564683A1 (fr) 1985-11-22
DE3516760A1 (de) 1985-11-21
GB2159102A (en) 1985-11-27
JPH0136555B2 (cg-RX-API-DMAC7.html) 1989-08-01
GB2159102B (en) 1988-03-02
GB8512466D0 (en) 1985-06-19
CA1223082A (en) 1987-06-16

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