GB1364660A - Method of producing electrical interconnection patterns - Google Patents

Method of producing electrical interconnection patterns

Info

Publication number
GB1364660A
GB1364660A GB5596371A GB5596371A GB1364660A GB 1364660 A GB1364660 A GB 1364660A GB 5596371 A GB5596371 A GB 5596371A GB 5596371 A GB5596371 A GB 5596371A GB 1364660 A GB1364660 A GB 1364660A
Authority
GB
United Kingdom
Prior art keywords
etch
layer
slices
held
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5596371A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB5596371A priority Critical patent/GB1364660A/en
Publication of GB1364660A publication Critical patent/GB1364660A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1364660 Etching of an aluminium layer STANDARD TELEPHONES & CABLES Ltd 2 Dec 1971 55963/71 Heading C7B [Also in Division B6] In a method of producing a printed circuit from an Al layer on a substrate, e.g. from an Al coated slice of Si, the layer is electrically connected with a conductor of a material less electro-positive than Al and is etched, when suitably masked, with at least a part of the conductor immersed in the etching solution. The coated Si slices may have integrated circuits thereon or be plain oxidized Si slices. They may be held in phosphoric acid etch by stainless steel tweezers connected via an ammeter to a Pt electrode in the etch. Alternatively they may be clamped in Pt or Au wire or held in Au plated tweezers submerged in the.etch.
GB5596371A 1971-12-02 1971-12-02 Method of producing electrical interconnection patterns Expired GB1364660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5596371A GB1364660A (en) 1971-12-02 1971-12-02 Method of producing electrical interconnection patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5596371A GB1364660A (en) 1971-12-02 1971-12-02 Method of producing electrical interconnection patterns

Publications (1)

Publication Number Publication Date
GB1364660A true GB1364660A (en) 1974-08-29

Family

ID=10475350

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5596371A Expired GB1364660A (en) 1971-12-02 1971-12-02 Method of producing electrical interconnection patterns

Country Status (1)

Country Link
GB (1) GB1364660A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2564683A1 (en) * 1984-05-17 1985-11-22 Psi Star Inc METHOD AND DEVICE FOR THE ATTACK OF MASK COPPER WITH A NICKEL-GOLD MASK

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2564683A1 (en) * 1984-05-17 1985-11-22 Psi Star Inc METHOD AND DEVICE FOR THE ATTACK OF MASK COPPER WITH A NICKEL-GOLD MASK
GB2159102A (en) * 1984-05-17 1985-11-27 Psi Star Inc Process and apparatus for etching copper

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Legal Events

Date Code Title Description
PS Patent sealed
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PCNP Patent ceased through non-payment of renewal fee