GB1288992A - - Google Patents
Info
- Publication number
- GB1288992A GB1288992A GB1288992DA GB1288992A GB 1288992 A GB1288992 A GB 1288992A GB 1288992D A GB1288992D A GB 1288992DA GB 1288992 A GB1288992 A GB 1288992A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- layer
- electroplated
- coating
- printed circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
1288992 Printed circuits WESTINGHOUSE ELECTRIC CORP 22 June 1970 30138/70 Heading H1R In a method of making printed circuits the conductors on each side of an epoxy glass board are connected together by coating the walls of an aperture in the board, firstly with a layer 30 of copper, nickel, palladium, silver or gold by chemical or electroless methods, secondly with an electroplated conductive layer 32 provided from a non-cyanide bath such as copper pyrophosphate, sulphuric or fluoroborate acid and thirdly with a layer of electroplated copper 34 provided from a cyanide bath, finally a lead-in coating 36 is electroplated upon the copper layer 34.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3013870 | 1970-06-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1288992A true GB1288992A (en) | 1972-09-13 |
Family
ID=10302926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1288992D Expired GB1288992A (en) | 1970-06-22 | 1970-06-22 |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1288992A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2407639A1 (en) * | 1977-10-28 | 1979-05-25 | Blaupunkt Werke Gmbh | METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS |
GB2305299A (en) * | 1995-09-12 | 1997-04-02 | Irish Circuits Ltd | Printed circuit board production process |
EP0936639A2 (en) * | 1998-02-10 | 1999-08-18 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
EP1091024A1 (en) * | 1998-04-30 | 2001-04-11 | Ebara Corporation | Method and device for plating substrate |
EP1923488A3 (en) * | 1998-09-14 | 2009-05-27 | Ibiden Co., Ltd. | A process for manufacturing a multilayer printed circuit board |
-
1970
- 1970-06-22 GB GB1288992D patent/GB1288992A/en not_active Expired
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2407639A1 (en) * | 1977-10-28 | 1979-05-25 | Blaupunkt Werke Gmbh | METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS |
GB2305299A (en) * | 1995-09-12 | 1997-04-02 | Irish Circuits Ltd | Printed circuit board production process |
EP0936639A2 (en) * | 1998-02-10 | 1999-08-18 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
EP0936639A3 (en) * | 1998-02-10 | 1999-09-29 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
US6007758A (en) * | 1998-02-10 | 1999-12-28 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
EP1091024A1 (en) * | 1998-04-30 | 2001-04-11 | Ebara Corporation | Method and device for plating substrate |
EP1091024A4 (en) * | 1998-04-30 | 2006-03-22 | Ebara Corp | Method and device for plating substrate |
EP1923488A3 (en) * | 1998-09-14 | 2009-05-27 | Ibiden Co., Ltd. | A process for manufacturing a multilayer printed circuit board |
US7691189B2 (en) | 1998-09-14 | 2010-04-06 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
US7827680B2 (en) | 1998-09-14 | 2010-11-09 | Ibiden Co., Ltd. | Electroplating process of electroplating an elecrically conductive sustrate |
US8065794B2 (en) | 1998-09-14 | 2011-11-29 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |