GB1214894A - Method of providing metal layers by electrodeposition - Google Patents

Method of providing metal layers by electrodeposition

Info

Publication number
GB1214894A
GB1214894A GB2946468A GB2946468A GB1214894A GB 1214894 A GB1214894 A GB 1214894A GB 2946468 A GB2946468 A GB 2946468A GB 2946468 A GB2946468 A GB 2946468A GB 1214894 A GB1214894 A GB 1214894A
Authority
GB
United Kingdom
Prior art keywords
envelope
metal parts
nickel
frame
electrodeposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2946468A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1214894A publication Critical patent/GB1214894A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1,214,894. Electronic component housings. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 20 June, 1968 [23 June, 1967], No. 29464/68. Heading H1K. To ensure an even deposition of plating metal in a method of electroplating one or more metal parts 24, 25 of an envelope for electronic components and conductors which are connected in a frame 23 and pass through the envelope in an insulated manner, flexible lugs 21, 22 are provided on the frame 23 so that they may be bent into contact with the metal parts of the envelope to ensure that all parts to be plated are electrically connected. The envelope and its conductors are then immersed in liquid electrolyte and plated, after which the frame 23 and flexible lugs 21, 22 are removed. The non-metal parts of the envelope are of glass and the metal parts are of an iron-nickel-cobalt alloy, such as for example 28-29% nickel, 16-19% cobalt and 52-56% iron. Plating metals used are gold, silver, copper or nickel.
GB2946468A 1967-06-23 1968-06-20 Method of providing metal layers by electrodeposition Expired GB1214894A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6708747A NL6708747A (en) 1967-06-23 1967-06-23

Publications (1)

Publication Number Publication Date
GB1214894A true GB1214894A (en) 1970-12-09

Family

ID=19800519

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2946468A Expired GB1214894A (en) 1967-06-23 1968-06-20 Method of providing metal layers by electrodeposition

Country Status (7)

Country Link
BE (1) BE717008A (en)
CH (1) CH522741A (en)
DE (1) DE1771404A1 (en)
FR (1) FR1573339A (en)
GB (1) GB1214894A (en)
NL (1) NL6708747A (en)
SE (1) SE335040B (en)

Also Published As

Publication number Publication date
NL6708747A (en) 1968-12-24
DE1771404A1 (en) 1972-04-06
BE717008A (en) 1968-12-23
CH522741A (en) 1972-06-30
SE335040B (en) 1971-05-10
FR1573339A (en) 1969-07-04

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