GB1461474A - Electrical connectors and a method of preparing stable electro platings - Google Patents
Electrical connectors and a method of preparing stable electro platingsInfo
- Publication number
- GB1461474A GB1461474A GB2955274A GB2955274A GB1461474A GB 1461474 A GB1461474 A GB 1461474A GB 2955274 A GB2955274 A GB 2955274A GB 2955274 A GB2955274 A GB 2955274A GB 1461474 A GB1461474 A GB 1461474A
- Authority
- GB
- United Kingdom
- Prior art keywords
- alloy
- electrical connectors
- platings
- substrate
- preparing stable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
1461474 Electrical connectors FULMER RESEARCH INSTITUTE Ltd 3 Oct 1975 [3 July 1974] 29552/74 Heading H2E [Also in Division C7] An electric connector comprises a conductive substrate bearing a plating of gold alloy up to 5Á thick, the alloy containing 0À1-5% by wt. of Cd, Sb or Sn. The substrate may be Cu, a Cu alloy, Cu-Ni-Fe, brass, steel or Ni and may include Ni plated on Cu. The alloy is electroplated conventionally and exhibits increased corrosion and substrate-diffusion resistance. Cu substrates may be degreased, cathodically cleaned in cyanide and etched with a sulphochromic etch (for Cu base) or with HCl (when a Ni plating is present). Reference is made to the insertion and separation of connectors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2955274A GB1461474A (en) | 1974-07-03 | 1974-07-03 | Electrical connectors and a method of preparing stable electro platings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2955274A GB1461474A (en) | 1974-07-03 | 1974-07-03 | Electrical connectors and a method of preparing stable electro platings |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1461474A true GB1461474A (en) | 1977-01-13 |
Family
ID=10293346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2955274A Expired GB1461474A (en) | 1974-07-03 | 1974-07-03 | Electrical connectors and a method of preparing stable electro platings |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1461474A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2130602A (en) * | 1982-11-24 | 1984-06-06 | Stc Plc | Electroplating electrical contacts |
GB2167610A (en) * | 1984-09-27 | 1986-05-29 | Feinmetall Gmbh | Electrical spring test prod |
EP1184904A2 (en) * | 2000-08-23 | 2002-03-06 | Acqutek Semiconductor & Technology Co. Ltd. | Substrate for manufacturing a semiconductor device with three element alloy |
-
1974
- 1974-07-03 GB GB2955274A patent/GB1461474A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2130602A (en) * | 1982-11-24 | 1984-06-06 | Stc Plc | Electroplating electrical contacts |
GB2167610A (en) * | 1984-09-27 | 1986-05-29 | Feinmetall Gmbh | Electrical spring test prod |
EP1184904A2 (en) * | 2000-08-23 | 2002-03-06 | Acqutek Semiconductor & Technology Co. Ltd. | Substrate for manufacturing a semiconductor device with three element alloy |
EP1184904A3 (en) * | 2000-08-23 | 2006-05-17 | Acqutek Semiconductor & Technology Co. Ltd. | Substrate for manufacturing a semiconductor device with three element alloy |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |