GB1462001A - Method of electrolytically nodularizing a metal surface - Google Patents

Method of electrolytically nodularizing a metal surface

Info

Publication number
GB1462001A
GB1462001A GB12675A GB12675A GB1462001A GB 1462001 A GB1462001 A GB 1462001A GB 12675 A GB12675 A GB 12675A GB 12675 A GB12675 A GB 12675A GB 1462001 A GB1462001 A GB 1462001A
Authority
GB
United Kingdom
Prior art keywords
bath
plated
nodular
gpl
jan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12675A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of GB1462001A publication Critical patent/GB1462001A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)

Abstract

1462001 Nodular copper electro-plate; zincate-treating aluminium GOULD Inc 2 Jan 1975 [7 Jan 1974] 126/75 Headings C7B and C7F A nodular Cu layer is plated on a metal substrate from an acidic bath of pH<1 containing 5-70 gpl Cu, 3-50 gpl NO 3 at 22-50‹C and a cathode c.d. of 50-300 ASF for 10-180 seconds. The bath may contain H 2 SO 4 and the NO 3 be associated with Cu, Na, K or NH 4 . The substrate may be Cu, an alloy thereof or Ni. A subsequent layer of Zn, In, brass, Ni, Co, Cr or stainless steel may be applied. In examples Al foil is Cu plated with a pyrophosphate or CN bath, nodular plated as above, chemically or mechanically stripped off the Al and finally built up to 1.4 mil thickness on its rear surface using the first bath. The Al may be zincated before Cu plating to facilitate chemical stripping thereof, using a bath containing NaOH, ZnO, Fe C13 and Rochelle salt.
GB12675A 1974-01-07 1975-01-02 Method of electrolytically nodularizing a metal surface Expired GB1462001A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43134274A 1974-01-07 1974-01-07

Publications (1)

Publication Number Publication Date
GB1462001A true GB1462001A (en) 1977-01-19

Family

ID=23711503

Family Applications (1)

Application Number Title Priority Date Filing Date
GB12675A Expired GB1462001A (en) 1974-01-07 1975-01-02 Method of electrolytically nodularizing a metal surface

Country Status (6)

Country Link
JP (1) JPS5756558B2 (en)
CA (1) CA1044636A (en)
DE (1) DE2500160C2 (en)
GB (1) GB1462001A (en)
LU (1) LU71602A1 (en)
SE (1) SE7500053L (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
EP0996318A2 (en) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Novel composite foil, process for producing the same and copper-clad laminate
EP0996319A2 (en) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
JPS58224059A (en) * 1982-06-22 1983-12-26 Tokai Rika Co Ltd Die casting machine
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
CN1084803C (en) * 1993-04-19 2002-05-15 Ga-Tek公司 Process for making copper metal powder, copper oxides and copper foil
US5670033A (en) * 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857681A (en) * 1971-08-03 1974-12-31 Yates Industries Copper foil treatment and products produced therefrom

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
EP0996318A2 (en) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Novel composite foil, process for producing the same and copper-clad laminate
EP0996319A2 (en) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards
EP0996318A3 (en) * 1998-10-19 2002-02-20 Mitsui Mining & Smelting Co., Ltd. Novel composite foil, process for producing the same and copper-clad laminate
EP0996319A3 (en) * 1998-10-19 2002-02-20 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards
US6548153B2 (en) 1998-10-19 2003-04-15 Mitsui Mining & Smelting Co., Ltd. Composite material used in making printed wiring boards

Also Published As

Publication number Publication date
JPS50101234A (en) 1975-08-11
JPS5756558B2 (en) 1982-11-30
CA1044636A (en) 1978-12-19
DE2500160A1 (en) 1975-07-17
DE2500160C2 (en) 1982-12-23
LU71602A1 (en) 1975-06-17
SE7500053L (en) 1975-07-08

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940102