SE7500053L - - Google Patents
Info
- Publication number
- SE7500053L SE7500053L SE7500053A SE7500053A SE7500053L SE 7500053 L SE7500053 L SE 7500053L SE 7500053 A SE7500053 A SE 7500053A SE 7500053 A SE7500053 A SE 7500053A SE 7500053 L SE7500053 L SE 7500053L
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43134274A | 1974-01-07 | 1974-01-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE7500053L true SE7500053L (en) | 1975-07-08 |
Family
ID=23711503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7500053A SE7500053L (en) | 1974-01-07 | 1975-01-03 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5756558B2 (en) |
CA (1) | CA1044636A (en) |
DE (1) | DE2500160C2 (en) |
GB (1) | GB1462001A (en) |
LU (1) | LU71602A1 (en) |
SE (1) | SE7500053L (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4169018A (en) * | 1978-01-16 | 1979-09-25 | Gould Inc. | Process for electroforming copper foil |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
JPS58224059A (en) * | 1982-06-22 | 1983-12-26 | Tokai Rika Co Ltd | Die casting machine |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4846918A (en) * | 1988-02-24 | 1989-07-11 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
AU682356B2 (en) * | 1993-04-19 | 1997-10-02 | Ga-Tek Inc. | Process for making copper metal powder, copper oxides and copper foil |
US5670033A (en) * | 1993-04-19 | 1997-09-23 | Electrocopper Products Limited | Process for making copper metal powder, copper oxides and copper foil |
US5366612A (en) * | 1993-04-19 | 1994-11-22 | Magma Copper Company | Process for making copper foil |
DE69930909T2 (en) * | 1998-10-19 | 2007-05-03 | Mitsui Mining & Smelting Co., Ltd. | New composite foil, process for its production and copper-clad laminate |
SG101924A1 (en) | 1998-10-19 | 2004-02-27 | Mitsui Mining & Smelting Co | Composite material used in making printed wiring boards |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
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1974
- 1974-12-18 CA CA216,635A patent/CA1044636A/en not_active Expired
-
1975
- 1975-01-02 GB GB12675A patent/GB1462001A/en not_active Expired
- 1975-01-03 DE DE2500160A patent/DE2500160C2/en not_active Expired
- 1975-01-03 SE SE7500053A patent/SE7500053L/xx unknown
- 1975-01-07 JP JP50004629A patent/JPS5756558B2/ja not_active Expired
- 1975-01-07 LU LU71602A patent/LU71602A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
JPS50101234A (en) | 1975-08-11 |
LU71602A1 (en) | 1975-06-17 |
GB1462001A (en) | 1977-01-19 |
DE2500160C2 (en) | 1982-12-23 |
JPS5756558B2 (en) | 1982-11-30 |
CA1044636A (en) | 1978-12-19 |
DE2500160A1 (en) | 1975-07-17 |