JPH0136555B2 - - Google Patents
Info
- Publication number
- JPH0136555B2 JPH0136555B2 JP60103648A JP10364885A JPH0136555B2 JP H0136555 B2 JPH0136555 B2 JP H0136555B2 JP 60103648 A JP60103648 A JP 60103648A JP 10364885 A JP10364885 A JP 10364885A JP H0136555 B2 JPH0136555 B2 JP H0136555B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- etching
- conductors
- gold
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 44
- 239000004020 conductor Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 8
- 230000000717 retained effect Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 2
- 239000000243 solution Substances 0.000 description 12
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- -1 copper cations Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/611,190 US4543153A (en) | 1984-05-17 | 1984-05-17 | Process and apparatus for etching copper masked by a nickel-gold mask |
| US611190 | 1984-05-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6152375A JPS6152375A (ja) | 1986-03-15 |
| JPH0136555B2 true JPH0136555B2 (cg-RX-API-DMAC7.html) | 1989-08-01 |
Family
ID=24447987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60103648A Granted JPS6152375A (ja) | 1984-05-17 | 1985-05-15 | ニツケル−金マスクによつて被覆された銅をエツチングする方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4543153A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS6152375A (cg-RX-API-DMAC7.html) |
| CA (1) | CA1223082A (cg-RX-API-DMAC7.html) |
| DE (1) | DE3516760A1 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2564683A1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB2159102B (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3430075A1 (de) * | 1984-08-16 | 1986-02-27 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zum herstellen einer messsonde zur verwendung bei der messung der temperatur oder masse eines stroemenden mediums |
| US4695348A (en) * | 1986-09-15 | 1987-09-22 | Psi Star | Copper etching process and product |
| DE3701456A1 (de) * | 1987-01-20 | 1988-07-28 | Herrmann Ritzenhoff Fa | Verfahren zur herstellung von dekorativen oder informativen musterungen an gegenstaenden, die aus einfach oder gegebenenfalls mehrfach plattierten blechen gebildet wurden |
| GB2206541A (en) * | 1987-07-02 | 1989-01-11 | Psi Star Inc | Manufacturing printed circuit boards |
| US4925522A (en) * | 1989-08-21 | 1990-05-15 | Gte Products Corporation | Printed circuit assembly with contact dot |
| US5108562A (en) * | 1991-02-06 | 1992-04-28 | International Business Machines | Electrolytic method for forming vias and through holes in copper-invar-copper core structures |
| US5304284A (en) * | 1991-10-18 | 1994-04-19 | International Business Machines Corporation | Methods for etching a less reactive material in the presence of a more reactive material |
| FR2776020B1 (fr) * | 1998-03-11 | 2000-05-05 | Renault | Procede de controle de l'injection dans un moteur a combustion interne et allumage commande, alimente par du carburant gazeux liquefie ou par un carburant gazeux sous des conditions soniques |
| DE102009015604A1 (de) * | 2009-04-02 | 2010-10-07 | Siemens Aktiengesellschaft | Verfahren zur Strukturierung einer auf einem Substrat befindlichen Schicht mit mehreren Lagen |
| EP2918707B1 (en) | 2014-03-12 | 2019-05-22 | Rolls-Royce North American Technologies, Inc. | Anisotropic etching of metallic substrates |
| EP3518631A1 (en) | 2018-01-29 | 2019-07-31 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Anisotropic etching using highly branched polymers |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1047275A (cg-RX-API-DMAC7.html) * | ||||
| GB229414A (en) * | 1923-11-29 | 1925-02-26 | Robert David Lewis | Improvements in air tubes or pipes for use in colliery ventilation and the like |
| GB840284A (en) * | 1957-04-12 | 1960-07-06 | Machlett Lab Inc | Improvements in high voltage switching tubes |
| DE1164528B (de) * | 1960-02-10 | 1964-03-05 | Ruwel Werke Gmbh | Verfahren zum Herstellen von gedruckten Leiterplatten |
| US3287191A (en) * | 1963-07-23 | 1966-11-22 | Photo Engravers Res Inc | Etching of printed circuit components |
| GB1364660A (en) * | 1971-12-02 | 1974-08-29 | Standard Telephones Cables Ltd | Method of producing electrical interconnection patterns |
| JPS5313177B2 (cg-RX-API-DMAC7.html) * | 1973-06-20 | 1978-05-08 | ||
| JPS5540120B2 (cg-RX-API-DMAC7.html) * | 1974-11-30 | 1980-10-15 | ||
| SE404863B (sv) * | 1975-12-17 | 1978-10-30 | Perstorp Ab | Forfarande vid framstellning av ett flerlagerkort |
-
1984
- 1984-05-17 US US06/611,190 patent/US4543153A/en not_active Expired - Fee Related
-
1985
- 1985-04-15 CA CA000479094A patent/CA1223082A/en not_active Expired
- 1985-05-09 DE DE19853516760 patent/DE3516760A1/de not_active Withdrawn
- 1985-05-15 JP JP60103648A patent/JPS6152375A/ja active Granted
- 1985-05-15 FR FR8507396A patent/FR2564683A1/fr not_active Withdrawn
- 1985-05-16 GB GB08512466A patent/GB2159102B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4543153A (en) | 1985-09-24 |
| FR2564683A1 (fr) | 1985-11-22 |
| DE3516760A1 (de) | 1985-11-21 |
| GB2159102A (en) | 1985-11-27 |
| GB2159102B (en) | 1988-03-02 |
| GB8512466D0 (en) | 1985-06-19 |
| CA1223082A (en) | 1987-06-16 |
| JPS6152375A (ja) | 1986-03-15 |
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