JPS6149443A - チツプ介在体の製造方法 - Google Patents

チツプ介在体の製造方法

Info

Publication number
JPS6149443A
JPS6149443A JP60153406A JP15340685A JPS6149443A JP S6149443 A JPS6149443 A JP S6149443A JP 60153406 A JP60153406 A JP 60153406A JP 15340685 A JP15340685 A JP 15340685A JP S6149443 A JPS6149443 A JP S6149443A
Authority
JP
Japan
Prior art keywords
chip
support
manufacturing
interposer
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60153406A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0517708B2 (enExample
Inventor
ピーター・ゲルダマンス
ガンガダーラ・スワミ・マサド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS6149443A publication Critical patent/JPS6149443A/ja
Publication of JPH0517708B2 publication Critical patent/JPH0517708B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/635—
    • H10W70/095—
    • H10W70/611—
    • H10W90/401—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H10W72/07251—
    • H10W72/20—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60153406A 1984-08-13 1985-07-13 チツプ介在体の製造方法 Granted JPS6149443A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US639988 1984-08-13
US06/639,988 US4617730A (en) 1984-08-13 1984-08-13 Method of fabricating a chip interposer

Publications (2)

Publication Number Publication Date
JPS6149443A true JPS6149443A (ja) 1986-03-11
JPH0517708B2 JPH0517708B2 (enExample) 1993-03-09

Family

ID=24566380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60153406A Granted JPS6149443A (ja) 1984-08-13 1985-07-13 チツプ介在体の製造方法

Country Status (4)

Country Link
US (1) US4617730A (enExample)
EP (1) EP0171662B1 (enExample)
JP (1) JPS6149443A (enExample)
DE (1) DE3578614D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO1998004000A1 (fr) * 1996-07-22 1998-01-29 Honda Giken Kogyo Kabushiki Kaisha Unite de commande electronique de type enfichable, structure de connexion entre un tableau de connexion et des fiches, unite de connexion entre des pieces electroniques et un tableau de connexion et procede de montage de pieces electroniques

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US4880684A (en) * 1988-03-11 1989-11-14 International Business Machines Corporation Sealing and stress relief layers and use thereof
US5020219A (en) * 1988-05-16 1991-06-04 Leedy Glenn J Method of making a flexible tester surface for testing integrated circuits
US5512397A (en) * 1988-05-16 1996-04-30 Leedy; Glenn J. Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
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JPS505377A (enExample) * 1973-05-29 1975-01-21
JPS5178176A (enExample) * 1974-12-20 1976-07-07 Ibm

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Publication number Priority date Publication date Assignee Title
WO1998004000A1 (fr) * 1996-07-22 1998-01-29 Honda Giken Kogyo Kabushiki Kaisha Unite de commande electronique de type enfichable, structure de connexion entre un tableau de connexion et des fiches, unite de connexion entre des pieces electroniques et un tableau de connexion et procede de montage de pieces electroniques
US6720500B1 (en) * 1996-07-22 2004-04-13 Honda Giken Kogyo Kabushiki Kaisha Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part

Also Published As

Publication number Publication date
US4617730A (en) 1986-10-21
EP0171662A2 (en) 1986-02-19
DE3578614D1 (de) 1990-08-16
EP0171662A3 (en) 1987-01-14
EP0171662B1 (en) 1990-07-11
JPH0517708B2 (enExample) 1993-03-09

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