SE377229B - - Google Patents
Info
- Publication number
- SE377229B SE377229B SE7210177A SE1017772A SE377229B SE 377229 B SE377229 B SE 377229B SE 7210177 A SE7210177 A SE 7210177A SE 1017772 A SE1017772 A SE 1017772A SE 377229 B SE377229 B SE 377229B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W20/211—Through-semiconductor vias, e.g. TSVs
-
- H01L23/481—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17553671A | 1971-08-27 | 1971-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE377229B true SE377229B (enExample) | 1975-06-23 |
Family
ID=22640616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7210177A SE377229B (enExample) | 1971-08-27 | 1972-08-04 |
Country Status (2)
| Country | Link |
|---|---|
| CA (1) | CA981799A (enExample) |
| SE (1) | SE377229B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4275410A (en) * | 1978-11-29 | 1981-06-23 | Hughes Aircraft Company | Three-dimensionally structured microelectronic device |
| US4851615A (en) * | 1982-04-19 | 1989-07-25 | Olin Corporation | Printed circuit board |
| US4617730A (en) * | 1984-08-13 | 1986-10-21 | International Business Machines Corporation | Method of fabricating a chip interposer |
| US5039628A (en) * | 1988-02-19 | 1991-08-13 | Microelectronics & Computer Technology Corporation | Flip substrate for chip mount |
| US4926241A (en) * | 1988-02-19 | 1990-05-15 | Microelectronics And Computer Technology Corporation | Flip substrate for chip mount |
| JP2721093B2 (ja) * | 1992-07-21 | 1998-03-04 | 三菱電機株式会社 | 半導体装置 |
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1972
- 1972-08-04 SE SE7210177A patent/SE377229B/xx unknown
- 1972-08-24 CA CA150,294A patent/CA981799A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CA981799A (en) | 1976-01-13 |