CA981799A - Multi-layer glass-metal package - Google Patents

Multi-layer glass-metal package

Info

Publication number
CA981799A
CA981799A CA150,294A CA150294A CA981799A CA 981799 A CA981799 A CA 981799A CA 150294 A CA150294 A CA 150294A CA 981799 A CA981799 A CA 981799A
Authority
CA
Canada
Prior art keywords
layer glass
metal package
package
metal
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA150,294A
Other versions
CA150294S (en
Inventor
Brian Sunners
Perry R. Langston (Jr.)
Alfred H. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA981799A publication Critical patent/CA981799A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
CA150,294A 1971-08-27 1972-08-24 Multi-layer glass-metal package Expired CA981799A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17553671A 1971-08-27 1971-08-27

Publications (1)

Publication Number Publication Date
CA981799A true CA981799A (en) 1976-01-13

Family

ID=22640616

Family Applications (1)

Application Number Title Priority Date Filing Date
CA150,294A Expired CA981799A (en) 1971-08-27 1972-08-24 Multi-layer glass-metal package

Country Status (2)

Country Link
CA (1) CA981799A (en)
SE (1) SE377229B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980001220A1 (en) * 1978-11-29 1980-06-12 Hughes Aircraft Co Three-dimensionally structured microelectronic device
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
US4851615A (en) * 1982-04-19 1989-07-25 Olin Corporation Printed circuit board
US4926241A (en) * 1988-02-19 1990-05-15 Microelectronics And Computer Technology Corporation Flip substrate for chip mount
US5039628A (en) * 1988-02-19 1991-08-13 Microelectronics & Computer Technology Corporation Flip substrate for chip mount
US5382829A (en) * 1992-07-21 1995-01-17 Mitsubishi Denki Kabushiki Kaisha Packaged microwave semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980001220A1 (en) * 1978-11-29 1980-06-12 Hughes Aircraft Co Three-dimensionally structured microelectronic device
US4275410A (en) * 1978-11-29 1981-06-23 Hughes Aircraft Company Three-dimensionally structured microelectronic device
US4851615A (en) * 1982-04-19 1989-07-25 Olin Corporation Printed circuit board
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
US4926241A (en) * 1988-02-19 1990-05-15 Microelectronics And Computer Technology Corporation Flip substrate for chip mount
US5039628A (en) * 1988-02-19 1991-08-13 Microelectronics & Computer Technology Corporation Flip substrate for chip mount
US5382829A (en) * 1992-07-21 1995-01-17 Mitsubishi Denki Kabushiki Kaisha Packaged microwave semiconductor device
US5534727A (en) * 1992-07-21 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
SE377229B (en) 1975-06-23

Similar Documents

Publication Publication Date Title
CA957995A (en) Combination package
CA968313A (en) Insulation package
CA957303A (en) Packages
CA975721A (en) Carton construction
CA988021A (en) Packaging
CA981799A (en) Multi-layer glass-metal package
CA952072A (en) Carton
CA1021298A (en) Packaging
CA956612A (en) Cartons
CA949939A (en) Parallellepipedic package
CA975722A (en) Web-lock carton
AU465791B2 (en) Parallellepipedic package
CA888019A (en) Combination package
AU3529271A (en) Containers
CA864948A (en) Sealed carton
CA860147A (en) Packaging
AU466120B2 (en) Packaging
CA881946A (en) Packages
CA883653A (en) Moisture-proof packaging
AU4914672A (en) Sandwich package
CA872077A (en) Packaging means
CA885006A (en) Chemical package
CA887758A (en) Chemical package
CA887759A (en) Chemical package
CA876261A (en) Chemical package