JPS6148257B2 - - Google Patents

Info

Publication number
JPS6148257B2
JPS6148257B2 JP54007098A JP709879A JPS6148257B2 JP S6148257 B2 JPS6148257 B2 JP S6148257B2 JP 54007098 A JP54007098 A JP 54007098A JP 709879 A JP709879 A JP 709879A JP S6148257 B2 JPS6148257 B2 JP S6148257B2
Authority
JP
Japan
Prior art keywords
lead frame
mold
molding
frame
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54007098A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5599729A (en
Inventor
Takashi Nakagawa
Tomoo Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP709879A priority Critical patent/JPS5599729A/ja
Publication of JPS5599729A publication Critical patent/JPS5599729A/ja
Publication of JPS6148257B2 publication Critical patent/JPS6148257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP709879A 1979-01-26 1979-01-26 Resin molding method of electronic part Granted JPS5599729A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP709879A JPS5599729A (en) 1979-01-26 1979-01-26 Resin molding method of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP709879A JPS5599729A (en) 1979-01-26 1979-01-26 Resin molding method of electronic part

Publications (2)

Publication Number Publication Date
JPS5599729A JPS5599729A (en) 1980-07-30
JPS6148257B2 true JPS6148257B2 (ref) 1986-10-23

Family

ID=11656596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP709879A Granted JPS5599729A (en) 1979-01-26 1979-01-26 Resin molding method of electronic part

Country Status (1)

Country Link
JP (1) JPS5599729A (ref)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (ja) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp 半導体装置の樹脂封止方法
JPH02100332A (ja) * 1988-10-06 1990-04-12 Rohm Co Ltd フープ状リードフレームに対するモールド部の成形装置
JP2551100Y2 (ja) * 1990-07-17 1997-10-22 日本電気株式会社 半導体素子封入装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110066A (ja) * 1974-07-11 1976-01-27 Takao Nishikawa Kokumotsusenbetsusochi
JPS5337380A (en) * 1976-09-17 1978-04-06 Matsushita Electronics Corp Schottky barrier type semiconductor
JPS5393782A (en) * 1977-01-26 1978-08-17 Mitsubishi Electric Corp Preheating method of sealing resin in resin sealing and device for the same
JPS5399263A (en) * 1977-02-14 1978-08-30 Matsushita Electric Ind Co Ltd Automatic assembly machine for resin molding base

Also Published As

Publication number Publication date
JPS5599729A (en) 1980-07-30

Similar Documents

Publication Publication Date Title
JP7102238B2 (ja) 樹脂成形装置および樹脂成形品の製造方法
TW202234534A (zh) 樹脂成型品的製造方法、成型模和樹脂成型裝置
JPS6148257B2 (ref)
JP3077645B2 (ja) リードフレーム搬送装置及びそれを備えた樹脂封止装置
JPS61114824A (ja) レジンモ−ルド装置
JPH09153505A (ja) 半導体装置の樹脂封止装置及び封止方法
KR920001987Y1 (ko) 반도체칩의 컴파운드성형모울드
JP3006533B2 (ja) 半導体のフープリードフレームの封入金型およびフープリードフレームのセット方法
KR0164131B1 (ko) 와이어 본딩용 히터 블럭
KR200171486Y1 (ko) 와이어 본더의 열공급장치
JPH0719785B2 (ja) 半導体装置の樹脂モールド方法
JP2940752B2 (ja) 半導体樹脂封止装置
JPH0265148A (ja) 熱圧着ワイヤボンディング方法
JP2772486B2 (ja) 電子部品の樹脂封止成形用金型
TW202520391A (zh) 樹脂成形品的製造方法
JPH0620578Y2 (ja) 半導体射出成型機
JP2781233B2 (ja) リードフレームのモールド・フォーミング方法及びモールド・フォーミング装置
JP2551100Y2 (ja) 半導体素子封入装置
JPS6297813A (ja) モ−ルド金型
JPS5852106Y2 (ja) トランスファ−成形機
JPH088363A (ja) リードフレームおよびそれを用いた半導体装置ならびに半導体製造方法およびその製造に用いるモールド金型
JPS63181438A (ja) 半導体装置の樹脂封止用金型
JP2818870B2 (ja) ワイヤボンディング装置
JPS6258546B2 (ref)
JPS6384033A (ja) 半導体装置の製造方法