JPS5599729A - Resin molding method of electronic part - Google Patents

Resin molding method of electronic part

Info

Publication number
JPS5599729A
JPS5599729A JP709879A JP709879A JPS5599729A JP S5599729 A JPS5599729 A JP S5599729A JP 709879 A JP709879 A JP 709879A JP 709879 A JP709879 A JP 709879A JP S5599729 A JPS5599729 A JP S5599729A
Authority
JP
Japan
Prior art keywords
lead frames
molding die
guide rails
molding
resin molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP709879A
Other languages
Japanese (ja)
Other versions
JPS6148257B2 (en
Inventor
Takashi Nakagawa
Tomoo Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP709879A priority Critical patent/JPS5599729A/en
Publication of JPS5599729A publication Critical patent/JPS5599729A/en
Publication of JPS6148257B2 publication Critical patent/JPS6148257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent displacement in a molding die in the resin molding of long or continuous lead frames by preheating the lead frames to a molding temperature. CONSTITUTION:Lead frame assemblies are conveyed in between an upper molding die 9 and a lower molding die 10 along guide rails 12. The lead frames are heated to a temperature near a molding temperature by heaters 13 contained in the guide rails, then the lower molding die rises and pilot pins 20 are inserted into the pilot holes of the lead frames together with the guide rails thus fixing the lead frames. Since the lead frames have been heated, they have been thermally expanded and accordingly, displacement in the molding die is prevented.
JP709879A 1979-01-26 1979-01-26 Resin molding method of electronic part Granted JPS5599729A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP709879A JPS5599729A (en) 1979-01-26 1979-01-26 Resin molding method of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP709879A JPS5599729A (en) 1979-01-26 1979-01-26 Resin molding method of electronic part

Publications (2)

Publication Number Publication Date
JPS5599729A true JPS5599729A (en) 1980-07-30
JPS6148257B2 JPS6148257B2 (en) 1986-10-23

Family

ID=11656596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP709879A Granted JPS5599729A (en) 1979-01-26 1979-01-26 Resin molding method of electronic part

Country Status (1)

Country Link
JP (1) JPS5599729A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device
JPH02100332A (en) * 1988-10-06 1990-04-12 Rohm Co Ltd Molding device for molded section of hooped lead frame
JPH0434734U (en) * 1990-07-17 1992-03-23

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110066A (en) * 1974-07-11 1976-01-27 Takao Nishikawa KOKUMOTSUSENBETSUSOCHI
JPS5337380A (en) * 1976-09-17 1978-04-06 Matsushita Electronics Corp Schottky barrier type semiconductor
JPS5393782A (en) * 1977-01-26 1978-08-17 Mitsubishi Electric Corp Preheating method of sealing resin in resin sealing and device for the same
JPS5399263A (en) * 1977-02-14 1978-08-30 Matsushita Electric Ind Co Ltd Automatic assembly machine for resin molding base

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110066A (en) * 1974-07-11 1976-01-27 Takao Nishikawa KOKUMOTSUSENBETSUSOCHI
JPS5337380A (en) * 1976-09-17 1978-04-06 Matsushita Electronics Corp Schottky barrier type semiconductor
JPS5393782A (en) * 1977-01-26 1978-08-17 Mitsubishi Electric Corp Preheating method of sealing resin in resin sealing and device for the same
JPS5399263A (en) * 1977-02-14 1978-08-30 Matsushita Electric Ind Co Ltd Automatic assembly machine for resin molding base

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device
JPS6361775B2 (en) * 1983-05-06 1988-11-30
JPH02100332A (en) * 1988-10-06 1990-04-12 Rohm Co Ltd Molding device for molded section of hooped lead frame
JPH0434734U (en) * 1990-07-17 1992-03-23

Also Published As

Publication number Publication date
JPS6148257B2 (en) 1986-10-23

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