JPS5711030A - Positioning method of lead frame in mold - Google Patents

Positioning method of lead frame in mold

Info

Publication number
JPS5711030A
JPS5711030A JP8507180A JP8507180A JPS5711030A JP S5711030 A JPS5711030 A JP S5711030A JP 8507180 A JP8507180 A JP 8507180A JP 8507180 A JP8507180 A JP 8507180A JP S5711030 A JPS5711030 A JP S5711030A
Authority
JP
Japan
Prior art keywords
lead frame
guide holes
mold
central
drilled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8507180A
Other languages
Japanese (ja)
Other versions
JPS6045572B2 (en
Inventor
Kazuo Numajiri
Teruo Kusakari
Minoru Togashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55085071A priority Critical patent/JPS6045572B2/en
Publication of JPS5711030A publication Critical patent/JPS5711030A/en
Publication of JPS6045572B2 publication Critical patent/JPS6045572B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To exactly hold a lead frame in a given position for ensuring its continuous operation by a method in which a guide hole for regulating the longitudinal position is drilled in the central side edge of the lead frame, long guide holes are drilled in both end edges, and a projection pin is fitted into these holes.
CONSTITUTION: Round guide holes 2 are formed in the central both edges of the lead frame 1, and oblong guide holes 3 are formed in both end edges along the longitudinal direction of the lead frame. The lead frame 1 is held by an upper mold 4 and an lower mold 5 and positioned by a round section of pins 6 and 7 projectionally provided to the lower mold 5. Thus, even when the lead frame 1 is thermally expanded by heating in the former process, the longitudinal position of the lead frame 1 is secured in place by the central guide holes 2, and also its widthwise position is secured in place by the guide holes 3 on both ends. Thus, a baking process and a molding process can be continuously shifted, permitting the continuous operation of molding to be performed.
COPYRIGHT: (C)1982,JPO&Japio
JP55085071A 1980-06-25 1980-06-25 Positioning method of lead frame in mold die Expired JPS6045572B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55085071A JPS6045572B2 (en) 1980-06-25 1980-06-25 Positioning method of lead frame in mold die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55085071A JPS6045572B2 (en) 1980-06-25 1980-06-25 Positioning method of lead frame in mold die

Publications (2)

Publication Number Publication Date
JPS5711030A true JPS5711030A (en) 1982-01-20
JPS6045572B2 JPS6045572B2 (en) 1985-10-11

Family

ID=13848384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55085071A Expired JPS6045572B2 (en) 1980-06-25 1980-06-25 Positioning method of lead frame in mold die

Country Status (1)

Country Link
JP (1) JPS6045572B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device
JPH04251943A (en) * 1991-01-09 1992-09-08 Rohm Co Ltd Method for multimolding of molded part in electronic component lead frame
JPH06111653A (en) * 1991-09-28 1994-04-22 Omron Corp Method for forming insertion part of terminal fitting of electric equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0390482U (en) * 1989-12-28 1991-09-13

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device
JPS6361775B2 (en) * 1983-05-06 1988-11-30
JPH04251943A (en) * 1991-01-09 1992-09-08 Rohm Co Ltd Method for multimolding of molded part in electronic component lead frame
JPH06111653A (en) * 1991-09-28 1994-04-22 Omron Corp Method for forming insertion part of terminal fitting of electric equipment

Also Published As

Publication number Publication date
JPS6045572B2 (en) 1985-10-11

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