JPS6258546B2 - - Google Patents

Info

Publication number
JPS6258546B2
JPS6258546B2 JP56066607A JP6660781A JPS6258546B2 JP S6258546 B2 JPS6258546 B2 JP S6258546B2 JP 56066607 A JP56066607 A JP 56066607A JP 6660781 A JP6660781 A JP 6660781A JP S6258546 B2 JPS6258546 B2 JP S6258546B2
Authority
JP
Japan
Prior art keywords
lead frame
shaped molded
molded product
resin plate
mold parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56066607A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57181129A (en
Inventor
Toshuki Arai
Keiji Hazama
Shinichi Oota
Kiichi Kanamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP56066607A priority Critical patent/JPS57181129A/ja
Publication of JPS57181129A publication Critical patent/JPS57181129A/ja
Publication of JPS6258546B2 publication Critical patent/JPS6258546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP56066607A 1981-04-30 1981-04-30 Forming device molding package of semiconductors Granted JPS57181129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56066607A JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56066607A JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Publications (2)

Publication Number Publication Date
JPS57181129A JPS57181129A (en) 1982-11-08
JPS6258546B2 true JPS6258546B2 (ref) 1987-12-07

Family

ID=13320751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56066607A Granted JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Country Status (1)

Country Link
JP (1) JPS57181129A (ref)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122151A (ja) * 1985-08-01 1987-06-03 Hitachi Chem Co Ltd 半導体類のパツケ−ジ封止方法およびその装置

Also Published As

Publication number Publication date
JPS57181129A (en) 1982-11-08

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