JPS6146056B2 - - Google Patents
Info
- Publication number
- JPS6146056B2 JPS6146056B2 JP55156292A JP15629280A JPS6146056B2 JP S6146056 B2 JPS6146056 B2 JP S6146056B2 JP 55156292 A JP55156292 A JP 55156292A JP 15629280 A JP15629280 A JP 15629280A JP S6146056 B2 JPS6146056 B2 JP S6146056B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- conductive path
- semiconductor substrate
- multilayer wiring
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15629280A JPS5779648A (en) | 1980-11-05 | 1980-11-05 | Multilayer wiring of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15629280A JPS5779648A (en) | 1980-11-05 | 1980-11-05 | Multilayer wiring of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5779648A JPS5779648A (en) | 1982-05-18 |
| JPS6146056B2 true JPS6146056B2 (OSRAM) | 1986-10-11 |
Family
ID=15624615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15629280A Granted JPS5779648A (en) | 1980-11-05 | 1980-11-05 | Multilayer wiring of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5779648A (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63289839A (ja) * | 1987-05-21 | 1988-11-28 | Nec Corp | 半導体装置の製造方法 |
| JP2743366B2 (ja) * | 1988-03-04 | 1998-04-22 | 日本電気株式会社 | 樹脂層間膜を用いた多層配線構造体の製造方法 |
| JP2663662B2 (ja) * | 1990-01-31 | 1997-10-15 | 日本電気株式会社 | 半導体装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113277A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Production of semiconductor device |
-
1980
- 1980-11-05 JP JP15629280A patent/JPS5779648A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5779648A (en) | 1982-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6146056B2 (OSRAM) | ||
| JPH01185947A (ja) | 半導体装置製造方法 | |
| JPS6337517B2 (OSRAM) | ||
| JPS6046036A (ja) | 半導体装置の製造方法 | |
| JP2589994B2 (ja) | ウェーハの接着方法 | |
| JPS58135645A (ja) | 半導体装置の製造方法 | |
| JPH0494127A (ja) | 半導体装置の製造方法 | |
| JPS6174352A (ja) | 多層配線を有する半導体装置の製造方法 | |
| JP2808401B2 (ja) | 半導体装置の製造方法 | |
| JPH0419707B2 (OSRAM) | ||
| KR910000807Y1 (ko) | 반도체소자의 다층배선구조 | |
| JPH01154536A (ja) | 半導体装置の製造方法 | |
| JPS57103333A (en) | Manufacture of semiconductor device | |
| JPH025551A (ja) | 半導体装置 | |
| JPH07111968B2 (ja) | 半導体装置の製造方法 | |
| JPS61251153A (ja) | 半導体装置のバンプ形成方法 | |
| JP2535577B2 (ja) | ウェ―ハの接着方法 | |
| JPS63248148A (ja) | 半導体集積回路装置の製造方法 | |
| JPS58158952A (ja) | 半導体装置及びその製造法 | |
| JPS5925245A (ja) | 半導体装置の製造方法 | |
| JPH0414224A (ja) | 半導体装置の製造方法 | |
| JPH09232305A (ja) | 成膜方法 | |
| JPS6377139A (ja) | 絶縁膜の形成方法 | |
| JPS568825A (en) | Semiconductor device | |
| JPH0311738A (ja) | 薄膜導体パターンの形成方法 |