JPS6145857B2 - - Google Patents

Info

Publication number
JPS6145857B2
JPS6145857B2 JP52119191A JP11919177A JPS6145857B2 JP S6145857 B2 JPS6145857 B2 JP S6145857B2 JP 52119191 A JP52119191 A JP 52119191A JP 11919177 A JP11919177 A JP 11919177A JP S6145857 B2 JPS6145857 B2 JP S6145857B2
Authority
JP
Japan
Prior art keywords
external connection
thin metal
semiconductor element
connection
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52119191A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5452466A (en
Inventor
Toshiharu Sekine
Yoshio Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11919177A priority Critical patent/JPS5452466A/ja
Publication of JPS5452466A publication Critical patent/JPS5452466A/ja
Publication of JPS6145857B2 publication Critical patent/JPS6145857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP11919177A 1977-10-03 1977-10-03 Manufacture of semiconductor device Granted JPS5452466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11919177A JPS5452466A (en) 1977-10-03 1977-10-03 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11919177A JPS5452466A (en) 1977-10-03 1977-10-03 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5452466A JPS5452466A (en) 1979-04-25
JPS6145857B2 true JPS6145857B2 (mo) 1986-10-09

Family

ID=14755161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11919177A Granted JPS5452466A (en) 1977-10-03 1977-10-03 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5452466A (mo)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195856A (ja) * 1983-04-20 1984-11-07 Fujitsu Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS5452466A (en) 1979-04-25

Similar Documents

Publication Publication Date Title
US3859718A (en) Method and apparatus for the assembly of semiconductor devices
JPS6145857B2 (mo)
US3978516A (en) Lead frame assembly for a packaged semiconductor microcircuit
JPH02273944A (ja) リード付き半導体素子の製造方法
US3429030A (en) Method of fabricating semiconductor devices
JP2875591B2 (ja) 半導体装置及びその製造方法
JP3112113B2 (ja) 半導体装置
JPS5850762A (ja) 半導体装置用リ−ドフレ−ム
JPH02211643A (ja) 半導体装置
JPS58123747A (ja) 半導体装置の製造方法
JPS636824A (ja) チツプ・インダクタの製造方法
JPS63278264A (ja) Ｍｏｓｆｅｔモジユ−ル
JPH0131687B2 (mo)
JPS60164345A (ja) リ−ドフレ−ムの製造方法
JPS633463B2 (mo)
JPH06140453A (ja) ワイヤーボンディング方法
JPS63215046A (ja) ウエツジボンデイング方法
JPH07161908A (ja) 半導体装置
JP2700434B2 (ja) 半導体装置
KR200331874Y1 (ko) 반도체의다핀형태패키지
JPH01297834A (ja) ワイヤボンデイング方法
JPH02159752A (ja) リードフレーム
JPH09213859A (ja) 半導体装置の製造方法
JPS61216349A (ja) ガラス端子のメツキ方法
JPS634355B2 (mo)