JPS6144854Y2 - - Google Patents
Info
- Publication number
- JPS6144854Y2 JPS6144854Y2 JP12371881U JP12371881U JPS6144854Y2 JP S6144854 Y2 JPS6144854 Y2 JP S6144854Y2 JP 12371881 U JP12371881 U JP 12371881U JP 12371881 U JP12371881 U JP 12371881U JP S6144854 Y2 JPS6144854 Y2 JP S6144854Y2
- Authority
- JP
- Japan
- Prior art keywords
- screen
- frame
- printing
- flexible
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007639 printing Methods 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Screen Printers (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12371881U JPS5829467U (ja) | 1981-08-21 | 1981-08-21 | 印刷用スクリ−ン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12371881U JPS5829467U (ja) | 1981-08-21 | 1981-08-21 | 印刷用スクリ−ン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5829467U JPS5829467U (ja) | 1983-02-25 |
| JPS6144854Y2 true JPS6144854Y2 (enrdf_load_stackoverflow) | 1986-12-17 |
Family
ID=29917609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12371881U Granted JPS5829467U (ja) | 1981-08-21 | 1981-08-21 | 印刷用スクリ−ン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5829467U (enrdf_load_stackoverflow) |
-
1981
- 1981-08-21 JP JP12371881U patent/JPS5829467U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5829467U (ja) | 1983-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4048438A (en) | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips | |
| JPS6144854Y2 (enrdf_load_stackoverflow) | ||
| JPH04186792A (ja) | プリント配線板およびその製造方法 | |
| JP4837655B2 (ja) | ソルダ・マスクを形成するためのプロセス、そのための装置、および電気回路パターン付きの誘電体内層を形成するためのプロセス | |
| JPH021915Y2 (enrdf_load_stackoverflow) | ||
| JP2658414B2 (ja) | グリーンシートへの導電層パターン形成装置 | |
| JP3520460B2 (ja) | スクリーン印刷機 | |
| JPS6118880B2 (enrdf_load_stackoverflow) | ||
| JP2910261B2 (ja) | プリント配線板とその製造方法 | |
| JP2001298253A (ja) | 印刷用下地膜、それを用いた印刷方法及びその方法により製造される配線基板 | |
| JP3089264B2 (ja) | フレキシブルプリント配線板の加工方法 | |
| JPH0621630A (ja) | 多層印刷配線板 | |
| JP3010822B2 (ja) | プリント配線板の製造方法 | |
| JPS63170093A (ja) | はんだ印刷用スクリ−ン | |
| JP3469072B2 (ja) | スクリーン印刷によるパターン形成方法及び装置 | |
| JPH0627637A (ja) | フレキシブル回路基板用マスク構造 | |
| JP2001105563A (ja) | スクリーン版およびそれを使用した配線基板の製造方法 | |
| JPS59155992A (ja) | 段差基板面への印刷用マスク | |
| JP3019502B2 (ja) | プリント配線板とその製造方法 | |
| JPH02105597A (ja) | 印刷配線板およびその製造方法 | |
| JP2552339Y2 (ja) | ２つの回路基板の回路を接続する接続装置 | |
| JPH0786727A (ja) | プリント配線板及びその製造方法 | |
| JPH05283834A (ja) | 印刷配線板及びその製造方法 | |
| JP2884265B2 (ja) | ２層ｔａｂテープの製造方法 | |
| JP2586790B2 (ja) | 印刷配線板の製造方法 |