JPS6118880B2 - - Google Patents

Info

Publication number
JPS6118880B2
JPS6118880B2 JP13443478A JP13443478A JPS6118880B2 JP S6118880 B2 JPS6118880 B2 JP S6118880B2 JP 13443478 A JP13443478 A JP 13443478A JP 13443478 A JP13443478 A JP 13443478A JP S6118880 B2 JPS6118880 B2 JP S6118880B2
Authority
JP
Japan
Prior art keywords
resist
air
piezo
injection hole
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13443478A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5562793A (en
Inventor
Jukichi Takeda
Keiichiro Shimada
Kyoshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13443478A priority Critical patent/JPS5562793A/ja
Publication of JPS5562793A publication Critical patent/JPS5562793A/ja
Publication of JPS6118880B2 publication Critical patent/JPS6118880B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP13443478A 1978-11-02 1978-11-02 Apparatus for manufacturing printed circuit board Granted JPS5562793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13443478A JPS5562793A (en) 1978-11-02 1978-11-02 Apparatus for manufacturing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13443478A JPS5562793A (en) 1978-11-02 1978-11-02 Apparatus for manufacturing printed circuit board

Publications (2)

Publication Number Publication Date
JPS5562793A JPS5562793A (en) 1980-05-12
JPS6118880B2 true JPS6118880B2 (enrdf_load_stackoverflow) 1986-05-14

Family

ID=15128274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13443478A Granted JPS5562793A (en) 1978-11-02 1978-11-02 Apparatus for manufacturing printed circuit board

Country Status (1)

Country Link
JP (1) JPS5562793A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04128879U (ja) * 1991-05-21 1992-11-25 井沢工業株式会社 バインダロツク機構
JPH0646976U (ja) * 1992-12-03 1994-06-28 株式会社熊谷製作所 リングバインダー
US7296946B2 (en) 2001-11-30 2007-11-20 Microsoft Corporation Ring binder mechanism
US7549817B2 (en) 2002-12-18 2009-06-23 World Wide Stationery Mfg. Co., Ltd. Ready lock ring binder mechanism

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04128879U (ja) * 1991-05-21 1992-11-25 井沢工業株式会社 バインダロツク機構
JPH0646976U (ja) * 1992-12-03 1994-06-28 株式会社熊谷製作所 リングバインダー
US7296946B2 (en) 2001-11-30 2007-11-20 Microsoft Corporation Ring binder mechanism
US7549817B2 (en) 2002-12-18 2009-06-23 World Wide Stationery Mfg. Co., Ltd. Ready lock ring binder mechanism

Also Published As

Publication number Publication date
JPS5562793A (en) 1980-05-12

Similar Documents

Publication Publication Date Title
US3729819A (en) Method and device for fabricating printed wiring or the like
US2965952A (en) Method for manufacturing etched circuitry
JPS6118880B2 (enrdf_load_stackoverflow)
GB2030779A (en) Improvements in or relating to the manufacture of flexible printed circuits
US5090121A (en) Apparatus and method for fabricating cirucit pattern on conductive surface of circuit board
JPH05131609A (ja) ソルダーペースト印刷機
JP2007531266A (ja) ソルダ・マスクを形成するためのプロセス、そのための装置、および電気回路パターン付きの誘電体内層を形成するためのプロセス
CN101003035A (zh) 多喷头模组与涂布制程
TWM601505U (zh) 形成cof細密電路的系統以及刻製電路的系統
JPH04152692A (ja) プリント配線板の製造方法
JPH04291989A (ja) スクリーン印刷の塗膜形成方法
JP3520460B2 (ja) スクリーン印刷機
KR102539011B1 (ko) 연성인쇄회로기판 제조 방법
JPS588600B2 (ja) リヨウメンプリントハイセンバンノセイゾウホウホウ
JP2921704B2 (ja) スクリーン印刷機
JPH0563941B2 (enrdf_load_stackoverflow)
JP3520375B2 (ja) フレキシブル回路基板用印刷装置及びそれを用いたフレキシブル回路基板の製造方法
JPH012392A (ja) 導体パタ−ン形成方法
TWI295936B (en) Multi-injector module and coating process
JPH10126058A (ja) 多層プリント配線板の製造方法
JPH04255395A (ja) 印刷用スクリーン及びその形成方法
JPS60244092A (ja) プリント配線板製造方法
KR19980010292U (ko) 휨 개선 구조의 pcb
JPS6447092A (en) Soldering method of surface packaging component
JPS6357769U (enrdf_load_stackoverflow)