JPS6118880B2 - - Google Patents
Info
- Publication number
- JPS6118880B2 JPS6118880B2 JP13443478A JP13443478A JPS6118880B2 JP S6118880 B2 JPS6118880 B2 JP S6118880B2 JP 13443478 A JP13443478 A JP 13443478A JP 13443478 A JP13443478 A JP 13443478A JP S6118880 B2 JPS6118880 B2 JP S6118880B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- air
- piezo
- injection hole
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002347 injection Methods 0.000 claims description 21
- 239000007924 injection Substances 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
本発明はプリント配線板の製造装置に関し、特
にエツチングレジストにより回路パターンを形成
するためのパターン形成装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board manufacturing apparatus, and more particularly to a pattern forming apparatus for forming a circuit pattern using an etching resist.
各種電子機器に用いられるプリント配線板は、
通常、表面に銅膜を有する銅張積層板の表面全体
にエツチングレジストを塗布し、形成すべき回路
パターンを描いたフオトマスクフイルムでレジス
ト表面を覆い、露光、現像して銅張積層板表面に
所望の回路に応じた形状にレジストを付着させ、
続いてエツチングによりレジスト除去部の不要銅
膜を除去して所望の回路パターンを形成してい
る。しかしながら、このような方法においては、
所望の回路パターン形状に応じてレジストを塗布
するのに、まずフオトマスクフイルムを形成しこ
れを用いて露光、現像を行なうためパターン形式
に多くの作業時間および労力を要していた。 Printed wiring boards used in various electronic devices are
Usually, an etching resist is applied to the entire surface of a copper-clad laminate that has a copper film on the surface, the resist surface is covered with a photomask film on which the circuit pattern to be formed is drawn, and the resist is exposed and developed to form an etching resist on the surface of the copper-clad laminate. Attach the resist in a shape according to the desired circuit,
Subsequently, unnecessary copper film in the resist removed portion is removed by etching to form a desired circuit pattern. However, in such a method,
In order to apply a resist according to a desired circuit pattern shape, a photomask film is first formed and then exposed and developed using this film, which requires a lot of work time and labor to form a pattern.
本発明は上記の点に鑑みなされたものであつ
て、フオトマスクフイルムを用いることなく、従
つて露光、現像工程を要さず直接銅張積層板上に
所望の回路パターンに応じてエツチングレジスト
を塗布できるようなプリント配線板の組造装置の
提供を目的とする。このため本発明に係るプリン
ト配線板の製造装置はプリント配線板の回路形成
用エツチングレジストを充満したレジスト室の周
壁にピエゾを装着して該ピエゾにより圧力を加え
て該レジストを塗布するためのレジスト噴射孔を
有し、このレジスト噴射孔の周囲をパターンコン
トロール用の空気噴射孔で囲み、該空気噴射孔を
ピエゾが周壁に装着された複数のピエゾ駆動式噴
射空気供給用空気室に連結させ、各空気室を選択
的に駆動可能としている。 The present invention has been made in view of the above points, and it is possible to directly apply an etching resist in accordance with a desired circuit pattern onto a copper clad laminate without using a photomask film or requiring any exposure or development steps. The purpose of the present invention is to provide a printed wiring board assembly device that can be coated. Therefore, the printed wiring board manufacturing apparatus according to the present invention attaches a piezo to the peripheral wall of a resist chamber filled with an etching resist for forming a circuit on a printed wiring board, and applies pressure with the piezo to apply the resist. having an injection hole, surrounding the resist injection hole with an air injection hole for pattern control, and connecting the air injection hole to a plurality of piezo-driven injection air supply air chambers in which piezos are mounted on the peripheral wall; Each air chamber can be selectively driven.
図面は本発明の一実施例の概略構成図である。
１はレジスト槽、２はレジスト室、３，６はピエ
ゾ（圧電素子）、４は空気槽、５は空気室、７は
制御回路、８はレジスト噴射孔、９は空気噴射
孔、１０はプリント基板である。銅張積層板等か
らなるプリント基板１０は公知のXYテーブル
（図示しない）上に載せ形成すべき配線パターン
に従つて縦横方向に移動可能とするかあるいはプ
リント基板１０を固定してレジスト噴射孔８を形
成すべき配線パターンに従つて縦横方向に移動可
能な構造とする。レジスト噴射孔８の周囲はパタ
ーンコントロール用の空気噴射孔９により３重に
囲まれる。各空気噴射孔９は複数の空気室５を介
して空気槽４と連通している。各空気室５および
レジスト室２には電気信号を圧力に変換するピエ
ゾ６または３が装着される。各ピエゾ６および３
は制御回路７と連結する。 The drawing is a schematic diagram of an embodiment of the present invention.
1 is a resist tank, 2 is a resist chamber, 3 and 6 are piezo (piezoelectric elements), 4 is an air tank, 5 is an air chamber, 7 is a control circuit, 8 is a resist injection hole, 9 is an air injection hole, 10 is a print It is a board. The printed circuit board 10 made of a copper-clad laminate or the like is placed on a known XY table (not shown) and can be moved vertically and horizontally according to the wiring pattern to be formed, or the printed circuit board 10 is fixed and the resist injection holes 8 The structure is such that it can be moved vertically and horizontally according to the wiring pattern to be formed. The resist injection hole 8 is surrounded in three layers by air injection holes 9 for pattern control. Each air injection hole 9 communicates with the air tank 4 via a plurality of air chambers 5. Each air chamber 5 and resist chamber 2 is equipped with a piezo 6 or 3 that converts electrical signals into pressure. each piezo 6 and 3
is connected to the control circuit 7.
以上のような構成の装置において、制御回路７
からピエゾ３に電気信号を送りレジスト噴射孔８
よりレジストを噴射しつつプリント基板１０をパ
ターンに従つて移動させプリント基板１０上に所
望の配線パターン形状に対応したレジスト１１を
塗布する。このとき塗布すべきレジストの幅に応
じて適当な空気噴射孔９に連通する空気室５に通
電してその空気室５のピエゾ６を作動させてレジ
スト噴射孔８より噴射されるレジストの周囲に空
気を噴射しその圧力により塗布すべきレジスト１
１の幅を調整する。 In the device configured as above, the control circuit 7
Sends an electric signal to the piezo 3 from the resist injection hole 8
The printed circuit board 10 is moved according to the pattern while spraying the resist, and the resist 11 corresponding to the desired wiring pattern shape is applied onto the printed circuit board 10. At this time, depending on the width of the resist to be coated, electricity is applied to the air chamber 5 communicating with the appropriate air injection hole 9, and the piezo 6 of the air chamber 5 is activated to spread around the resist sprayed from the resist injection hole 8. Resist 1 to be applied by spraying air and using its pressure
Adjust the width of 1.
以上のような装置を用いればフオトマスクフイ
ルムを用いることなく、従つて露光、現像工程を
要さず直接銅張積層板上に所望の回路パターンに
対応してエツチングレジストを塗布できるためプ
リント配線板の製造作業に要する時間および労力
が大巾に減少する。 By using the above-mentioned apparatus, it is possible to directly apply etching resist in a desired circuit pattern onto a copper-clad laminate without using a photomask film, and therefore without requiring an exposure or development process. The time and labor required for manufacturing operations are greatly reduced.
図面は本発明に係るプリント配線板の製造装置
の一実施例の概略構成図である。
１……レジスト槽、２……レジスト室、３，６
……ピエゾ、４……空気槽、５……空気室、７…
…制御回路、８……レジスト噴射孔、９……空気
噴射孔、１０……プリント基板。
The drawing is a schematic diagram of an embodiment of a printed wiring board manufacturing apparatus according to the present invention. 1...Resist tank, 2...Resist chamber, 3, 6
...Piezo, 4...Air tank, 5...Air chamber, 7...
...Control circuit, 8...Resist injection hole, 9...Air injection hole, 10...Printed circuit board.
Claims (1)
ストを充満したレジスト室の周壁にピエゾを装着
して該ピエゾにより圧力を加えて該レジストを塗
布するためのレジスト噴射孔を有し、このレジス
ト噴射孔の周囲をパターンコントロール用の空気
噴射孔で囲み、該空気噴射孔をピエゾが周壁に装
着された複数のピエゾ駆動式噴射空気供給用空気
室に連結させ、各空気室を選択的に駆動可能とし
たプリント配線板の製造装置。1 A piezo is attached to the peripheral wall of a resist chamber filled with an etching resist for forming a circuit on a printed wiring board, and a resist injection hole is provided for applying pressure by the piezo to apply the resist, and the area around the resist injection hole is is surrounded by air injection holes for pattern control, and the air injection holes are connected to a plurality of piezo-driven injection air supply air chambers with piezos attached to the peripheral wall, so that each air chamber can be selectively driven. Wiring board manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13443478A JPS5562793A (en) | 1978-11-02 | 1978-11-02 | Apparatus for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13443478A JPS5562793A (en) | 1978-11-02 | 1978-11-02 | Apparatus for manufacturing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5562793A JPS5562793A (en) | 1980-05-12 |
| JPS6118880B2 true JPS6118880B2 (en) | 1986-05-14 |
Family
ID=15128274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13443478A Granted JPS5562793A (en) | 1978-11-02 | 1978-11-02 | Apparatus for manufacturing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5562793A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04128879U (en) * | 1991-05-21 | 1992-11-25 | 井沢工業株式会社 | binder lock mechanism |
| JPH0646976U (en) * | 1992-12-03 | 1994-06-28 | 株式会社熊谷製作所 | Ring binder |
-
1978
- 1978-11-02 JP JP13443478A patent/JPS5562793A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04128879U (en) * | 1991-05-21 | 1992-11-25 | 井沢工業株式会社 | binder lock mechanism |
| JPH0646976U (en) * | 1992-12-03 | 1994-06-28 | 株式会社熊谷製作所 | Ring binder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5562793A (en) | 1980-05-12 |
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