12959 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種多喷頭模組與塗佈製程，且特別 是有關於一種適用各種不同尺寸基板的多喷頭模組與塗 製程。 【先前技術】 隨著數位化工業的急速發展，線路板（wiredB〇ard) 在數位產品上的應用也越來越廣泛，舉凡手機、電腦以及 籲 S位相機等等產品内皆有線路板的存在，因此可以說線路 - 板早已充斥在我們生活週遭的產品之中。線路板以製造方 法區分大致可分為疊層法（laminate)與增層法（buildup) 兩種形式，前者通常是應用於製造佈線密度較低的印刷線 路板（Printing Wired Board, PWB)，而後者通常是應用於 製造佈線密度較高的構裝載板（package substmte)。然而， 由於現今線路板已朝大排版及高佈線密度的設計趨勢發 展，使得不管是印刷線路板或構裝載板皆同樣具有高佈^ φ 密度及線寬細小的特徵。 承上所述，因線路板的目的就是為了承載外部電子零 進而達成電流導通的目的。因此，在線路板上的線路 製作完成之後必須將外部電子零件之組裝區的線路定義出 來j並將非組裝區以一層高分子材料覆蓋於其上做適當的 保濩，而此作保護之用的高分子材料層即為防焊層（s〇ider Mask)。傳統上，電路板的防焊層塗佈製程是以感光性油 墨塗佈於印刷電路板之表面以後，再以曝光和顯影的方式 129593^twf.d〇c/g 來圖案化感光性油墨以製作出圖案化防焊層。有關於防焊 層的塗佈製程將詳述如後。 圖ία與圖1B繪示習知之一種防焊層的塗佈製程的示 意圖。請先參考圖1A，此習知的塗佈製程適於將一感光性 油墨喷塗在一電路板110a上。此習知的塗佈製程包括下列 步驟。首先，提供多個喷頭120，而這些喷頭12〇沿著一 轴線10配置，且各喷頭120之間維持固定間距。此外，電 路板110a劃分出多個塗佈區域U2a，且各喷頭12〇分別 對應於這些塗佈區域112a其中之一。然後，藉由這些喷頭 120的同時來回移動，以將感光性油墨喷塗在電路板 上。由圖1A可知，各個喷頭120需同時來回喷塗六次才 月t*將感光性油墨塗滿各個塗佈區域112a，也就是整個電路 板 110a。 請參考圖1B，如果使用上述的喷頭12〇將感光性油 墨喷塗於較小尺寸的電路板ll〇b時，則部分喷頭120將無 法參與塗佈製程。更詳細而言，當電路板n〇b仍然劃分出 多個塗佈區域112b時，由於各噴頭120之間維持固定間 距，因此部分喷頭120將沒有參與塗佈製程，如圖1B之 右側兩個喷頭120。此時，各個噴頭12〇仍須同時來回噴 塗六次才能將感光性油墨塗滿各個塗佈區域112b。換言 之，雖然電路板110b與電路板ll〇a的尺寸不同，然而兩 電路板110b與電路板ll〇a所需的塗佈次數卻是相同。 【發明内容】 有鑑於此，本發明之目的是提供一種多喷頭模組，其 7 1295934 twf.doc/g 喷頭間的間距可以配合基板的尺寸進行調整。 此外’本發明之另一目的是提供一種塗佈製程，以縮 短各種不同尺寸的基板所需的時間。 為達上述或是其他目的，本發明提出一種多噴頭模 組，其適於將一液體喷塗於一基板上。此多喷頭模組包括 多個噴頭、多個致動器、一第一控制器、一第二控制器與 一控制介面，其中這些喷頭沿著一軸線配置，且這些喷頭 適於將液體噴塗於基板上。這些致動器分別與這些噴頭連 接，且各致動器適於帶動相對應之喷頭沿著軸線移動，以 改變各噴頭間關距。第—控制贿這些喷頭電性連接， 以控制各喷顧運作。第二㈣器與這些致動器電性連 接二以控制各致動器的運作。控制介面電性連接至第 與第二控制器，以控制第—控制器與第二控制器的^ 在本發明之-實施例中，基板劃分出多個塗佈 且各賀頭對應於這些塗佈區域其中之一。 埤 驟。首先，隸液體。此塗佈製程包括下列步 且各嘴ί二ΓΓη而這些喷頭沿著一轴線配置， 使各喷頭之間“4: 噴頭的位置，以 間距二藉由，：液==不 且各喷頭:;二心=域個塗佈區域’ 8 1295936twf.d〇c/g 基於上述，本發明依據基板尺寸的不同變更各噴頭之 間的間距，以使各噴頭皆能位於實際列印範圍内，因此相 較於習知技術，本發明所需的列印刷數較少，且所需的喷 印時間也較短。 ' 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 圖2是依照本發明之一實施例之一種塗佈製程的示意 圖。請參考圖2，本實施例之塗佈製程適於在一基板21〇 上贺塗一液體，其中基板210例如是電路板，而液體例如 是感光性油墨或液態光阻。本實施例雖然以電路板製程中 的塗佈製程為例進行說明，然而本實施例所提出的塗佈製 程卻可以應用於其他技術領域的塗佈製程。 請繼續參考圖2,本實施例之塗佈製程包括下列步 驟。首先，提供多個喷頭310，而這些喷頭310沿著一轴 線20配置，且各喷頭31〇之間維持一第一間距D1。然後， 移動這些噴頭310的位置，以使各喷頭310之間維持一第 二間距D2，其中第二間距D2不同於第一間距di，也就 疋第二間距D2小於第一間距D1。此外，基板21〇可以割 分出多個塗佈區域212，且各喷頭310分別對應於這些塗 佈區域212其中之一。然後，藉由這些喷頭31〇將液體喷 塗基板210上。更詳細而言，這些喷頭310可以具有乂軸 的自由度，而基板210具有Y軸的自由度。或者，這些喷 9 1295936twf.d〇c/g 頭310為固定，而基板210具有x軸與γ軸的自由度。 承上所述，當各個喷頭310以第一間距D1排列"時， 則各個喷頭310需同時來回噴塗六次才能將液體塗滿各個 塗佈區域212，也就是整個基板210。然而，當各個喷頭 310以第二間距D2排列時，則各個喷頭31〇只需同時來回 喷塗四次便能將液體塗滿各個塗佈區域212。簡單而言， 依據基板210尺寸的不同，調整各個喷頭31〇之間的間"距， 以使各個噴頭310皆可在實際列印範圍内，因此相較於習 知技術，本貫施例之塗佈製程所需的列印刷數較少。換t 之，相較於習知技術，本實施例之塗佈製程所需的喷印時 間也就可以縮短。此外，有關於控制各喷頭31〇的系統架 構將舉例如後。 # " 圖3是依照本發明之一實施例之一種多喷頭模組的系 統架構圖。請同時參考圖2與圖3，本實施例之多噴頭模 組300適於將一液體喷塗於一基板21〇上。此多喷頭模組 3〇〇包括多個喷頭310、多個致動器32〇、一第一控制器 330a、一第二控制器330b與一控制介面340。其中，這些 喷頭310沿著一軸線2〇配置，且這些喷頭31〇適於將液體 喷塗於基板210上，如圖2所示。此外，這些致動器 分別與這些喷頭310連接，且各致動器32〇適於帶動相對 應之喷頭310沿著軸線2〇移動，以改變各喷頭31〇之間的 間距。舉例而言，軸線20可以是導軌，而致動器32〇可以 是馬達或是其他傳動機構。 第一控制器330a與這些喷頭31〇電性連接，以控制 X29593^twf.d〇c/g 運作。此外，第二控制器3鳥與這些致動器 320電性連接，以控制各致動器 介面34。電性連接至第一控制器：作與第另外： 以控制第-控制器島與第二控·遍的運作: 二2 & ^作人員可以透過控制介面Μ0輸入基板210 析度、設定各喷頭MO的塗佈寬度或其他 參數。然後，控制介面34()便輸出各種控制訊號 2制器330a與第二控制器3通。接著，第一控制器3施 Ί 一控制器33%便依據控制介面340所發出的控制訊號 控制^致動器320與各喷頭·的運作，以完成塗佈製程。 紅上所述，本發明之多喷頭模組與塗佈製程至少呈 下列優點： # / 由於本發明能夠依據基板尺寸的不同變更各噴頭 之間的間距，以使各噴頭皆能位於實際列印範圍内，因此 相較於習知技術，本發明所需的列印刷數較少，且所需的 噴印時間也較短。 二、相較於習知技術中部分喷頭使用次數較高，由於 本發明之各喷頭皆能參與塗佈製程，因此本發明之多嘴頭 模組的使用壽命較長。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明’任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 1295够 #.d〇c/g 【圖式簡單說明】 圖1A與圖1B繪示習知之一種防焊層的塗佈製程的示 意圖。 圖2是依照本發明之一實施例之一種塗佈製程的示意 圖。 圖3是依照本發明之一實施例之一種多喷頭模組的系 統架構圖。 【主要元件符號說明】 10 :軸線 110a、110b :電路板 112a、112b :塗佈區域 120 :噴頭 和 20 :軸線 210 :基板 212 :塗佈區域 300 :多喷頭模組 310 :喷頭 320 :致動器 330a :第一控制器 330b :第二控制器 340 :控制介面 1212959 IX. Description of the Invention: [Technical Field] The present invention relates to a multi-head module and a coating process, and more particularly to a multi-head module and a coating process for various substrates of different sizes. [Prior Art] With the rapid development of the digital industry, the use of circuit boards (wiredB〇ard) in digital products has become more and more extensive, and there are circuit boards in mobile phones, computers, and S-bit cameras. Exist, so it can be said that the line-board has long been filled with products around our lives. The circuit board can be roughly divided into two methods: a laminate method and a buildup method. The former is usually applied to a printed wiring board (PWB) having a low wiring density. The latter is usually applied to the manufacture of a package substmte with a high wiring density. However, since today's circuit boards have been trending toward large typesetting and high wiring density, both printed circuit boards and load boards have the characteristics of high density and fine line width. As stated above, the purpose of the circuit board is to carry external electrons and achieve current conduction. Therefore, after the circuit on the circuit board is completed, the circuit of the assembly area of the external electronic component must be defined and the non-assembly area should be covered with a layer of polymer material for proper protection, and this is used for protection. The polymer material layer is a s〇ider mask. Conventionally, the solder mask coating process of the circuit board is performed by applying a photosensitive ink to the surface of the printed circuit board, and then patterning the photosensitive ink by exposure and development to 129593^twf.d〇c/g. A patterned solder mask is produced. The coating process for the solder resist layer will be detailed later. FIG. 1B and FIG. 1B illustrate a schematic view of a conventional solder mask coating process. Referring first to Figure 1A, the conventional coating process is suitable for spraying a photosensitive ink onto a circuit board 110a. This conventional coating process includes the following steps. First, a plurality of showerheads 120 are provided, and these showerheads 12 are disposed along an axis 10 with a fixed spacing between the showerheads 120. Further, the circuit board 110a divides a plurality of coating areas U2a, and each of the heads 12'' corresponds to one of the coating areas 112a, respectively. Then, the photosensitive ink is sprayed on the circuit board by moving the nozzles 120 back and forth at the same time. As can be seen from Fig. 1A, each of the heads 120 needs to be sprayed back and forth six times at a time to fill the respective coating areas 112a, i.e., the entire board 110a, with photosensitive ink. Referring to Fig. 1B, if the photosensitive ink is sprayed onto the smaller-sized circuit board 11b using the above-described head 12, the partial head 120 will not participate in the coating process. In more detail, when the circuit board n〇b still divides the plurality of coating regions 112b, since the fixed spacing is maintained between the nozzles 120, the partial nozzles 120 will not participate in the coating process, as shown in the right side of FIG. 1B. A nozzle 120. At this time, each of the heads 12 must be sprayed back and forth six times at the same time to apply the photosensitive ink to the respective coating areas 112b. In other words, although the size of the circuit board 110b and the circuit board 11a are different, the number of times required for the two boards 110b and the board 11a is the same. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a multi-head module, wherein the spacing between the nozzles of the 7 1295934 twf.doc/g can be adjusted according to the size of the substrate. Further, another object of the present invention is to provide a coating process for reducing the time required for substrates of various sizes. To achieve the above or other objects, the present invention provides a multi-nozzle module adapted to spray a liquid onto a substrate. The multi-head module includes a plurality of nozzles, a plurality of actuators, a first controller, a second controller and a control interface, wherein the nozzles are arranged along an axis, and the nozzles are adapted to The liquid is sprayed onto the substrate. These actuators are respectively coupled to the spray heads, and each actuator is adapted to move the corresponding spray head along the axis to vary the distance between the spray heads. First—control bribes the electrical connections of these nozzles to control the operation of each nozzle. The second (four) device is electrically coupled to the actuators to control the operation of the actuators. The control interface is electrically connected to the second controller to control the first controller and the second controller. In the embodiment of the present invention, the substrate is divided into a plurality of coatings and the respective heads correspond to the coatings. One of the cloth areas.埤. First of all, the liquid. The coating process comprises the following steps and the nozzles are arranged along an axis so that the positions of the nozzles are "4: between the nozzles, with a spacing of two, by: liquid == not Nozzle: 2 center = domain coating area ' 8 1295936twf.d〇c / g Based on the above, the present invention changes the spacing between the nozzles according to the size of the substrate, so that each nozzle can be located in the actual printing range Therefore, compared to the prior art, the number of columns required for the present invention is small, and the required printing time is also short. 'To make the above and other objects, features and advantages of the present invention more obvious BRIEF DESCRIPTION OF THE DRAWINGS The following is a detailed description of the preferred embodiments and the accompanying drawings in which: FIG. 2 is a schematic diagram of a coating process in accordance with an embodiment of the present invention. The coating process of the embodiment is suitable for coating a liquid on a substrate 21, wherein the substrate 210 is, for example, a circuit board, and the liquid is, for example, a photosensitive ink or a liquid photoresist. This embodiment is coated in a circuit board process. The cloth manufacturing process is described as an example, but the embodiment The proposed coating process can be applied to coating processes in other technical fields. With continued reference to Figure 2, the coating process of the present embodiment includes the following steps. First, a plurality of showerheads 310 are provided, and the showerheads 310 are along An axis 20 is disposed, and a first spacing D1 is maintained between the nozzles 31. Then, the positions of the nozzles 310 are moved to maintain a second spacing D2 between the nozzles 310, wherein the second spacing D2 Different from the first pitch di, that is, the second pitch D2 is smaller than the first pitch D1. Further, the substrate 21〇 may divide the plurality of coating regions 212, and each of the showerheads 310 respectively corresponds to the coating regions 212. Then, the liquid is sprayed onto the substrate 210 by the nozzles 31. In more detail, the heads 310 may have a degree of freedom of the x-axis, and the substrate 210 has a degree of freedom of the Y-axis. The spray head 9 1295936twf.d〇c/g head 310 is fixed, and the substrate 210 has the degrees of freedom of the x-axis and the γ-axis. As described above, when the respective heads 310 are arranged at the first pitch D1, each spray is The head 310 needs to be sprayed back and forth six times at the same time to fill the liquid The coating area 212, that is, the entire substrate 210. However, when the respective heads 310 are arranged at the second pitch D2, the respective heads 31 can be sprayed four times at the same time to fill the respective coating areas. 212. Briefly, according to the size of the substrate 210, the spacing between the respective nozzles 31 is adjusted so that each of the nozzles 310 can be in the actual printing range, so compared with the prior art, The number of prints required for the coating process of the embodiment is small. In other words, the printing time required for the coating process of the present embodiment can be shortened compared to the prior art. The system architecture of each nozzle 31 will be described later. # " Figure 3 is a system architecture diagram of a multi-head module in accordance with an embodiment of the present invention. Referring to FIG. 2 and FIG. 3 simultaneously, the multi-nozzle module 300 of the present embodiment is adapted to spray a liquid onto a substrate 21A. The multi-head module 3A includes a plurality of heads 310, a plurality of actuators 32A, a first controller 330a, a second controller 330b and a control interface 340. Wherein, the showerheads 310 are disposed along an axis 2〇, and the showerheads 31 are adapted to spray liquid onto the substrate 210, as shown in FIG. Further, these actuators are respectively coupled to the heads 310, and each of the actuators 32 is adapted to move the corresponding head 310 along the axis 2 to change the spacing between the heads 31. For example, the axis 20 can be a rail and the actuator 32 can be a motor or other transmission. The first controller 330a is electrically connected to the shower heads 31 to control the operation of X29593^twf.d〇c/g. In addition, the second controller 3 is electrically coupled to the actuators 320 to control the actuator interfaces 34. Electrically connected to the first controller: to do the same: to control the operation of the first controller island and the second control channel: 2 2 & ^ staff can input the substrate 210 through the control interface Μ 0 Coating width or other parameters of the nozzle MO. Then, the control interface 34() outputs various control signals 2a to the second controller 3. Then, the first controller 3 applies a controller 33% to control the operation of the actuator 320 and each of the nozzles according to the control signal sent from the control interface 340 to complete the coating process. As described above, the multi-head module and the coating process of the present invention have at least the following advantages: # / The present invention can change the spacing between the nozzles according to the size of the substrate, so that the nozzles can be located in the actual column. Within the printing range, the number of prints required for the present invention is less and the required print time is shorter compared to conventional techniques. Second, compared with the prior art, some nozzles are used more frequently, and since the nozzles of the present invention can participate in the coating process, the multi-head module of the present invention has a long service life. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. 1295 enough #.d〇c/g [Simplified Schematic Description] Figs. 1A and 1B are diagrams showing a conventional coating process of a solder resist layer. Figure 2 is a schematic illustration of a coating process in accordance with an embodiment of the present invention. 3 is a system architecture diagram of a multi-nozzle module in accordance with an embodiment of the present invention. [Main component symbol description] 10: Axis 110a, 110b: Circuit board 112a, 112b: Coating area 120: Head and 20: Axis 210: Substrate 212: Coating area 300: Multi-head module 310: Head 320: Actuator 330a: first controller 330b: second controller 340: control interface 12