I295^^fdoc/006 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種塗佈製程，且特別是有關於一種 採用多喷頭的塗佈製程。 【先前技術】 隨著數位化工業的急速發展，線路板（wiredBoard) 在數位產品上的應用也越來越廣泛，舉凡手機、電腦以及 數位相機等等產品内皆有線路板的存在，因此可以說線路 板早已充斥在我們生活週遭的產品之中。線路板以製造方 法區分大致可分為疊層法（laminate)與增層法（build_叩） 兩種形式，前者通常是應用於製造佈線密度較低的印刷線 路板（Printing Wired Board, PWB)，而後者通常是應用於 衣仏佈線始、度較高的構裝載板（|)扣]^狀如15如站幻。然而， 由於現=線路板已朝大排版及高佈線密度的設計趨勢發 f ’使付不管是印刷線路板或構裝載板皆同樣具有高 逾、度及線寬細小的特徵。 、 承上所述，因線路板的目的就是為了承载外部電子零 件，進而達成電流導通的目的。因此， 二 ^乍完成之後必須將外部電子零件之組裳區的線路定義出 二=^，區以—層高分子材料覆蓋於其上做適當的 ^又 作保護之用的兩分子材料層即為防焊層㈤如 墨塗佈於印刷電路板之表面以後，再 5 12955氣 doc/006 來圖案化感光性油墨以製作出圖案化防焊層。有關於防焊 層的塗佈製程將詳述如後。 立圖1A至圖ic!會示習知之一種防焊層的塗佈製程的示 意圖。+請先參考圖1A，此習知的塗佈製程適於將-感光性 油墨育塗在—電路板上。此習知的塗佈製程包括下列 步驟。首先，提供多個喷頭120，*這些喷頭120沿著一 轴線10配置’且各嘴頭uo之間維持固定間距。此外，噴 頭上2〇具有一塗佈寬度W。另外，電路板110劃分出多 個第一區域112與多個第二區域114,其中第-區域112 為正刷區域，而弟—區域114為尾刷區域。換言之，第一 區f112的寬度為塗佈寬度wi的整數倍，而第二區域114 的見度小於塗佈寬度W1。 一 以腺ΓΓ相1B，藉由這些喷頭12G的同時來回移動， 將感光性油墨塗滿各個第一區域112。換言之， 1 ^需同時來回喷、塗四次才能職紐油墨塗滿各個第 品V 112。此時，電路板11〇上仍有部分區域 = 14)尚未塗佈感光性油墨。雖然各個第二區域 於塗佈寬度w卜然而這些第二區域ii4仍 員120進行一次喷塗。 貝 晴翏考圖1C，在將感光性油墨噴塗滿各第二區域叫 至此大致元成此習知的塗佈製程。值得注意的是 於電路板110的寬度並不是塗佈寬度W1的 疋 次】:板110的尾刷區域（第二區域114)仍須額外的一 1295·5 备 ^vf.doc/006 【發明内容】 有鑑於此，本發明的目的就是提供一種塗佈 減少喷塗次數。 、為達上述或是其他目的，本發明提出—種塗佈製程， 其適於在-基板上贺塗一液體，而基板 ί;一第二區域:其中第二區域的寬度小於各第4域: 覓度。此塗佈製私包括下列步驟。首先 二 ,+ 、—王贺碩沿者一罘一軸線配置。然後， 私動以改變:欠噴頭與這些 置。接著，藉由這些主喷頭盘次喷鮮相對位 之這些第-區域與第二區t—r貝糾液體分別噴塗基板 在本發明之一實施例中，夂古A 而各第一區域的寬度為塗佈寬===有—塗佈寬度， -區實施例中，各主噴料別對應至這些第 置，ίί發 :么一實施例中，*噴頭沿著-第二軸線配 置，且乐一軸線與第二軸線平行。 矛 塗，^發知技術需要進行尾刷區域的喷 區域），而喷塗尾刷區域(第二 嘴頭喷印完成時，次喷(弟一區域），因此在主 習知技術，本發明所需_1=成時。換言之，相較於 為讓本發明之上述和其他目的、特徵和優點能更明顯 7 doc/0〇6 I29558Swf H董下文锊舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 制。圖至圖2C繪示依照本發明之一實施例之一種塗佈 效j的示意圖。請先參考圖2A，本實施例之塗佈製程適於 =感光性油墨噴塗在一基板21G上，其中基板21〇例如 是電路板，而液體例如是感光性油墨或液態光阻。本實施 攀 j雖然以電路板製程中的塗佈製程為例進行說明，然而本 實施例所提出的塗佈製程卻可以應用於其他技術領域的塗 佈製程。此外，基板210劃分出多個第一區域212與一第 二區域214,其中第二區域214的寬度小於各第一區域212 的寬度。 承上所述，本實施例之塗佈製程包括下列步驟。首 先，提供多個主喷頭220a與一次喷頭220b，其中這些主 喷頭220a沿著一第一轴線22配置。在本實施例中，次喷 φ 頭220b沿著一第二軸線24配置，且第一軸線22與第二軸 線24平行。然而，在另一實施例中，次喷頭220b也可以 沿著第一軸線22配置。此外，主喷頭220a具有一塗怖1 度W2，而各第一區域212的寬度為塗佈寬度W2的整數 倍。換言之，第一區域212也就是整刷區域，而第二區域 214也就是尾刷區域。 然後，移動次喷頭220b，以改變次喷頭220b與這些 主喷頭220a之間的相對位置。簡單而言，各個主喷頭220a 1295m wf.doc/006 分別對應至這些第一區域212其中之一，而次喷頭220b 對應至第二區域214。在本實施例中，主喷頭22〇a也可以 是固定式或可移動式。 請參考圖2B，藉由這些主喷頭22〇a與次喷頭22〇b 的同時來回移動兩次，以將液體分別喷塗基板21〇之這些 第一區域212與第二區域214上。此時，第二區域214已 完成塗佈，而各第一區域212尚有未塗佈的部份。 請參考圖2C，然後，藉由這些主噴頭22〇a來回移動 兩次，以將各第-區域212的剩餘部分塗滿。至此，大致 完成本實施例之塗佈製程。 由於本實施例採用可移動式的次喷頭2鳥來喷塗第 尾刷區域）’而主喷頭22Ga噴塗第—區域212 =區域）’ _在主_ 22Ga喷印完成時，次喷頭 次完更詳細而言，相較於習知技術需要五 ==月匕元成塗佈製程，本實施例只需四次噴塗便可完 成全佈衣私，因此本實施例所需的 製程所雲的拉网。, 平乂夕以降低塗佈 郎省的刷數就愈多。 才本貝施例所旎 雖然本發明已以較佳實施例揭 限定本發明，任何熟習此技藝者，在非用以 ::範圍内’當可作些許之更動與潤飾不之騎 乾圍當視後附之申請專利範圍所界定者為準。"日之保瞍 【圖式簡單說明】 1.2955 8没 wf.doc/006 圖1A至圖ic繪示習知之一種防焊層的塗佈製程的示 意圖。 圖2Α至圖2C繪示依照本發明之一實施例之一種塗佈 製程的示意圖。 【主要元件符號說明】I295^^fdoc/006 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a coating process, and more particularly to a coating process using a multi-nozzle. [Prior Art] With the rapid development of the digital industry, the use of wired boards in digital products is becoming more and more widespread. In the case of mobile phones, computers, digital cameras, etc., there are circuit boards, so It is said that the circuit board has long been filled with products around our lives. The circuit board can be roughly divided into two methods: a laminate method and a build-up method (build_叩). The former is usually applied to a printed wiring board (PWB) with a low wiring density. The latter is usually applied to the 仏 仏 仏 、 、 、 | | | | | | | ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ However, since the current circuit board has been trending toward large layout and high wiring density, the printed circuit board or the loading board has the characteristics of high over-degree and small line width. According to the above, the purpose of the circuit board is to carry external electronic components, thereby achieving the purpose of current conduction. Therefore, after completion, the line of the external electronic component must be defined as two = ^, and the area is covered with a layer of polymer material to make appropriate two layers of material for protection. For the solder mask (5), if the ink is applied to the surface of the printed circuit board, the photosensitive ink is patterned by using 512/955 gas doc/006 to form a patterned solder resist layer. The coating process for the solder resist layer will be detailed later. The drawings 1A to ic! show a schematic view of a coating process of a solder resist layer. + Referring first to Figure 1A, this conventional coating process is suitable for culturing a photosensitive ink onto a circuit board. This conventional coating process includes the following steps. First, a plurality of showerheads 120 are provided, * these showerheads 120 are disposed along an axis 10 and maintain a fixed spacing between the nozzles uo. Further, the top surface of the spray head has a coating width W. In addition, the circuit board 110 defines a plurality of first regions 112 and a plurality of second regions 114, wherein the first region 112 is a positive brush region and the brother region 114 is a tail brush region. In other words, the width of the first region f112 is an integral multiple of the coating width wi, and the visibility of the second region 114 is less than the coating width W1. With the adenine phase 1B, the photosensitive ink is applied to each of the first regions 112 by the simultaneous movement of the heads 12G. In other words, 1 ^ needs to be sprayed back and forth four times at the same time to fill the first product V 112 with the ink. At this time, there is still a partial area on the board 11 = = 14) The photosensitive ink has not been applied. Although each of the second regions is at the coating width w, these second regions ii4 are still sprayed once. In the case of Fig. 1C, the photosensitive ink is sprayed over each of the second regions so that it is roughly the conventional coating process. It should be noted that the width of the circuit board 110 is not the width of the coating width W1]: the tail brush area of the board 110 (the second area 114) still needs an additional 1295·5 preparation ^vf.doc/006 [invention In view of the above, it is an object of the present invention to provide a coating that reduces the number of sprays. For the above or other purposes, the present invention provides a coating process suitable for coating a liquid on a substrate, and a substrate; a second region: wherein the width of the second region is smaller than each of the fourth regions : 觅度. This coating process includes the following steps. First of all, +, - Wang Heshuo along the axis configuration. Then, the private move to change: under the nozzle and these settings. Then, by spraying the substrate with the first region and the second region t-r, respectively, by the main nozzles, in the embodiment of the present invention, in the first embodiment of the present invention, The width is the coating width === there is - coating width, - in the embodiment, each main spray corresponds to these first, ίί hair: in one embodiment, * the nozzle is arranged along the - second axis, And the axis of the music is parallel to the second axis. Spear coating, ^ knowing technology needs to carry out the spray area of the tail brush area), and spraying the tail brush area (the second nozzle is printed, the second spray (different area), so in the main conventional technology, the present invention </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The drawings are described in detail below. [Embodiment] FIG. 2C is a schematic view showing a coating effect j according to an embodiment of the present invention. Referring first to FIG. 2A, the coating process of the embodiment is suitable. The photosensitive ink is sprayed on a substrate 21G, wherein the substrate 21 is, for example, a circuit board, and the liquid is, for example, a photosensitive ink or a liquid photoresist. This embodiment is performed by taking a coating process in a circuit board process as an example. However, the coating process proposed in this embodiment can be applied to coating processes in other technical fields. Further, the substrate 210 divides the plurality of first regions 212 and a second region 214, wherein the width of the second region 214 Less than the width of each first region 212 As described above, the coating process of the present embodiment includes the following steps. First, a plurality of main showerheads 220a and a primary showerhead 220b are provided, wherein the main showerheads 220a are disposed along a first axis 22. In an embodiment, the secondary spray φ head 220b is disposed along a second axis 24, and the first axis 22 is parallel to the second axis 24. However, in another embodiment, the secondary spray head 220b can also follow the first axis. In addition, the main head 220a has a coating degree of W2, and the width of each of the first areas 212 is an integral multiple of the coating width W2. In other words, the first area 212 is the entire brush area, and the second area 214 is the tail brush area. Then, the secondary head 220b is moved to change the relative position between the secondary head 220b and the main heads 220a. Briefly, each of the main heads 220a 1295m wf.doc/006 corresponds to To the first region 212, the secondary nozzle 220b corresponds to the second region 214. In this embodiment, the main nozzle 22A may also be fixed or movable. Referring to FIG. 2B, The two main nozzles 22〇a and the second nozzles 22〇b move back and forth simultaneously The liquid is sprayed onto the first region 212 and the second region 214 of the substrate 21, respectively. At this time, the second region 214 has been coated, and each of the first regions 212 has an uncoated portion. Referring to FIG. 2C, the main nozzles 22a are moved back and forth twice to fill the remaining portions of the respective first regions 212. Thus, the coating process of the present embodiment is substantially completed. The movable secondary nozzle 2 birds to spray the tail brush area) 'and the main nozzle 22Ga spray the first area 212 = area) ' _ When the main _ 22Ga printing is completed, the secondary nozzle is finished in more detail In other words, compared with the conventional technology, it is required to complete the coating process by five == months. In this embodiment, only four times of spraying can complete the full cloth, so the drawing of the cloud required by the embodiment is required. , Pingyi Xi to reduce the number of brushes in the Lang province. The present invention has been described in terms of a preferred embodiment, and any person skilled in the art is not able to use the following: This is subject to the definition of the scope of the patent application. "日保保瞍 [Simple description of the drawing] 1.2955 8 No wf.doc/006 Figure 1A to Figure ic shows a schematic diagram of a coating process for a solder resist layer. 2A through 2C are schematic views of a coating process in accordance with an embodiment of the present invention. [Main component symbol description]
10 : 轴線 110 電路板 112 第一區域 114 第二區域 120 喷頭 22 ： 第一轴線 24 ： 第二軸線 210 ： :基板 212 ： :第一區域 214 ： :第二區域 220a :主喷頭 220b :次喷頭10: axis 110 circuit board 112 first area 114 second area 120 head 22: first axis 24: second axis 210:: substrate 212: : first area 214: : second area 220a: main nozzle 220b: secondary nozzle