JPS6144449Y2 - - Google Patents
Info
- Publication number
- JPS6144449Y2 JPS6144449Y2 JP14094881U JP14094881U JPS6144449Y2 JP S6144449 Y2 JPS6144449 Y2 JP S6144449Y2 JP 14094881 U JP14094881 U JP 14094881U JP 14094881 U JP14094881 U JP 14094881U JP S6144449 Y2 JPS6144449 Y2 JP S6144449Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- shield plate
- opening
- retaining portion
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14094881U JPS5846455U (ja) | 1981-09-22 | 1981-09-22 | 放熱体の取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14094881U JPS5846455U (ja) | 1981-09-22 | 1981-09-22 | 放熱体の取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5846455U JPS5846455U (ja) | 1983-03-29 |
| JPS6144449Y2 true JPS6144449Y2 (pm) | 1986-12-15 |
Family
ID=29934086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14094881U Granted JPS5846455U (ja) | 1981-09-22 | 1981-09-22 | 放熱体の取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5846455U (pm) |
-
1981
- 1981-09-22 JP JP14094881U patent/JPS5846455U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5846455U (ja) | 1983-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4438164B2 (ja) | シールドケース | |
| JP2586389B2 (ja) | Ｌｓｉケースのシールド構造 | |
| JPS6144449Y2 (pm) | ||
| JPH03255697A (ja) | 集積回路用放熱構造体 | |
| JPS592566A (ja) | スイツチング電源 | |
| JPS6144444Y2 (pm) | ||
| JPH0927689A (ja) | 電子部品ユニット | |
| JPS6318225Y2 (pm) | ||
| JPH0531294U (ja) | プリント基板用ヒートシンク | |
| JPH0219996Y2 (pm) | ||
| JPH0314300A (ja) | 電磁波シールド部材 | |
| JPH0528796Y2 (pm) | ||
| JP3728836B2 (ja) | Ｌｓｉパッケージ用冷却装置およびその固定方法 | |
| JPH0651022Y2 (ja) | 電子機器筐体 | |
| JPS6039099Y2 (ja) | 超音波加湿ユニット | |
| JP2906635B2 (ja) | 混成集積回路装置 | |
| JPH0720935Y2 (ja) | 半導体レーザ装置 | |
| JPS6144448Y2 (pm) | ||
| JPH0217508Y2 (pm) | ||
| JPH01174990U (pm) | ||
| JPH0419837Y2 (pm) | ||
| JPH0582994A (ja) | 箱形ユニツト構造 | |
| JPH02202040A (ja) | 半導体装置 | |
| JPH0136366Y2 (pm) | ||
| JPH0134346Y2 (pm) |