JPS6144438Y2 - - Google Patents
Info
- Publication number
- JPS6144438Y2 JPS6144438Y2 JP1981107913U JP10791381U JPS6144438Y2 JP S6144438 Y2 JPS6144438 Y2 JP S6144438Y2 JP 1981107913 U JP1981107913 U JP 1981107913U JP 10791381 U JP10791381 U JP 10791381U JP S6144438 Y2 JPS6144438 Y2 JP S6144438Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- spacer
- resin
- substrates
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 26
- 125000006850 spacer group Chemical group 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981107913U JPS5812955U (ja) | 1981-07-20 | 1981-07-20 | 樹脂封止半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981107913U JPS5812955U (ja) | 1981-07-20 | 1981-07-20 | 樹脂封止半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5812955U JPS5812955U (ja) | 1983-01-27 |
| JPS6144438Y2 true JPS6144438Y2 (ru) | 1986-12-15 |
Family
ID=29902338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981107913U Granted JPS5812955U (ja) | 1981-07-20 | 1981-07-20 | 樹脂封止半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812955U (ru) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5165012B2 (ja) | 2010-02-22 | 2013-03-21 | 三菱電機株式会社 | 樹脂封止形電子制御装置及びその製造方法 |
-
1981
- 1981-07-20 JP JP1981107913U patent/JPS5812955U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5812955U (ja) | 1983-01-27 |
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