JPS6142421B2 - - Google Patents

Info

Publication number
JPS6142421B2
JPS6142421B2 JP5240382A JP5240382A JPS6142421B2 JP S6142421 B2 JPS6142421 B2 JP S6142421B2 JP 5240382 A JP5240382 A JP 5240382A JP 5240382 A JP5240382 A JP 5240382A JP S6142421 B2 JPS6142421 B2 JP S6142421B2
Authority
JP
Japan
Prior art keywords
rotating body
wafer
plate
seating portion
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5240382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58168253A (ja
Inventor
Masaaki Sadamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5240382A priority Critical patent/JPS58168253A/ja
Publication of JPS58168253A publication Critical patent/JPS58168253A/ja
Publication of JPS6142421B2 publication Critical patent/JPS6142421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
JP5240382A 1982-03-29 1982-03-29 ウエハの回転保持具 Granted JPS58168253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5240382A JPS58168253A (ja) 1982-03-29 1982-03-29 ウエハの回転保持具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5240382A JPS58168253A (ja) 1982-03-29 1982-03-29 ウエハの回転保持具

Publications (2)

Publication Number Publication Date
JPS58168253A JPS58168253A (ja) 1983-10-04
JPS6142421B2 true JPS6142421B2 (enExample) 1986-09-20

Family

ID=12913824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5240382A Granted JPS58168253A (ja) 1982-03-29 1982-03-29 ウエハの回転保持具

Country Status (1)

Country Link
JP (1) JPS58168253A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2728766B2 (ja) * 1990-07-18 1998-03-18 株式会社東芝 半導体の処理方法およびその装置
JPH07110455B2 (ja) * 1992-10-27 1995-11-29 住友電気工業株式会社 ウェハ固定装置

Also Published As

Publication number Publication date
JPS58168253A (ja) 1983-10-04

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