JPS634938B2 - - Google Patents

Info

Publication number
JPS634938B2
JPS634938B2 JP57113141A JP11314182A JPS634938B2 JP S634938 B2 JPS634938 B2 JP S634938B2 JP 57113141 A JP57113141 A JP 57113141A JP 11314182 A JP11314182 A JP 11314182A JP S634938 B2 JPS634938 B2 JP S634938B2
Authority
JP
Japan
Prior art keywords
chuck table
wafer
outer periphery
vacuum
vacuum suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57113141A
Other languages
English (en)
Japanese (ja)
Other versions
JPS594045A (ja
Inventor
Shigeo Inomata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11314182A priority Critical patent/JPS594045A/ja
Publication of JPS594045A publication Critical patent/JPS594045A/ja
Publication of JPS634938B2 publication Critical patent/JPS634938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP11314182A 1982-06-30 1982-06-30 真空吸着固定手段 Granted JPS594045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11314182A JPS594045A (ja) 1982-06-30 1982-06-30 真空吸着固定手段

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11314182A JPS594045A (ja) 1982-06-30 1982-06-30 真空吸着固定手段

Publications (2)

Publication Number Publication Date
JPS594045A JPS594045A (ja) 1984-01-10
JPS634938B2 true JPS634938B2 (enExample) 1988-02-01

Family

ID=14604600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11314182A Granted JPS594045A (ja) 1982-06-30 1982-06-30 真空吸着固定手段

Country Status (1)

Country Link
JP (1) JPS594045A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014028418A (ja) * 2012-07-31 2014-02-13 Mitsuboshi Diamond Industrial Co Ltd 吸着テーブルの製造方法並びに吸着テーブル

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107414552B (zh) * 2017-08-22 2019-01-01 大连理工大学 一种用于铣削加工碳纤维复合材料的可调式吸附夹具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5813034B2 (ja) * 1977-01-20 1983-03-11 株式会社東芝 半導体輻射線検出器
JPS5390871A (en) * 1977-01-21 1978-08-10 Toyo Dengu Seisakushiyo Kk Device for chucking semiconductor wafer
JPS5833705Y2 (ja) * 1980-05-23 1983-07-28 株式会社 デイスコ 吸着固定装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014028418A (ja) * 2012-07-31 2014-02-13 Mitsuboshi Diamond Industrial Co Ltd 吸着テーブルの製造方法並びに吸着テーブル

Also Published As

Publication number Publication date
JPS594045A (ja) 1984-01-10

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