JPS594045A - 真空吸着固定手段 - Google Patents

真空吸着固定手段

Info

Publication number
JPS594045A
JPS594045A JP11314182A JP11314182A JPS594045A JP S594045 A JPS594045 A JP S594045A JP 11314182 A JP11314182 A JP 11314182A JP 11314182 A JP11314182 A JP 11314182A JP S594045 A JPS594045 A JP S594045A
Authority
JP
Japan
Prior art keywords
wafer
chuck table
circumferential part
chuck
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11314182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634938B2 (enExample
Inventor
Shigeo Inomata
猪又　重郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11314182A priority Critical patent/JPS594045A/ja
Publication of JPS594045A publication Critical patent/JPS594045A/ja
Publication of JPS634938B2 publication Critical patent/JPS634938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP11314182A 1982-06-30 1982-06-30 真空吸着固定手段 Granted JPS594045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11314182A JPS594045A (ja) 1982-06-30 1982-06-30 真空吸着固定手段

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11314182A JPS594045A (ja) 1982-06-30 1982-06-30 真空吸着固定手段

Publications (2)

Publication Number Publication Date
JPS594045A true JPS594045A (ja) 1984-01-10
JPS634938B2 JPS634938B2 (enExample) 1988-02-01

Family

ID=14604600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11314182A Granted JPS594045A (ja) 1982-06-30 1982-06-30 真空吸着固定手段

Country Status (1)

Country Link
JP (1) JPS594045A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107414552A (zh) * 2017-08-22 2017-12-01 大连理工大学 一种用于铣削加工碳纤维复合材料的可调式吸附夹具

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5961064B2 (ja) * 2012-07-31 2016-08-02 三星ダイヤモンド工業株式会社 吸着テーブルの製造方法並びに吸着テーブル

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390781A (en) * 1977-01-20 1978-08-09 Toshiba Corp Semiconductor radiation detector
JPS5390871A (en) * 1977-01-21 1978-08-10 Toyo Dengu Seisakushiyo Kk Device for chucking semiconductor wafer
JPS56172941U (enExample) * 1980-05-23 1981-12-21

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390781A (en) * 1977-01-20 1978-08-09 Toshiba Corp Semiconductor radiation detector
JPS5390871A (en) * 1977-01-21 1978-08-10 Toyo Dengu Seisakushiyo Kk Device for chucking semiconductor wafer
JPS56172941U (enExample) * 1980-05-23 1981-12-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107414552A (zh) * 2017-08-22 2017-12-01 大连理工大学 一种用于铣削加工碳纤维复合材料的可调式吸附夹具

Also Published As

Publication number Publication date
JPS634938B2 (enExample) 1988-02-01

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