JPS6141538A - セラミツク基板及びその製造方法 - Google Patents

セラミツク基板及びその製造方法

Info

Publication number
JPS6141538A
JPS6141538A JP59163894A JP16389484A JPS6141538A JP S6141538 A JPS6141538 A JP S6141538A JP 59163894 A JP59163894 A JP 59163894A JP 16389484 A JP16389484 A JP 16389484A JP S6141538 A JPS6141538 A JP S6141538A
Authority
JP
Japan
Prior art keywords
composite material
plating
ceramic substrate
nickel
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59163894A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0214189B2 (enExample
Inventor
鶴岡　重雄
国谷　啓一
英夫 荒川
秋雄 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59163894A priority Critical patent/JPS6141538A/ja
Publication of JPS6141538A publication Critical patent/JPS6141538A/ja
Publication of JPH0214189B2 publication Critical patent/JPH0214189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
JP59163894A 1984-08-06 1984-08-06 セラミツク基板及びその製造方法 Granted JPS6141538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59163894A JPS6141538A (ja) 1984-08-06 1984-08-06 セラミツク基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59163894A JPS6141538A (ja) 1984-08-06 1984-08-06 セラミツク基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6141538A true JPS6141538A (ja) 1986-02-27
JPH0214189B2 JPH0214189B2 (enExample) 1990-04-06

Family

ID=15782826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59163894A Granted JPS6141538A (ja) 1984-08-06 1984-08-06 セラミツク基板及びその製造方法

Country Status (1)

Country Link
JP (1) JPS6141538A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521479A (ja) * 1991-07-15 1993-01-29 Mitsubishi Electric Corp 混成集積回路装置
JP2007500450A (ja) * 2003-05-08 2007-01-11 クラミック エレクトロニクス ゲーエムベーハー 複合材料及び電気回路又は電気モジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113683A (en) * 1979-02-21 1980-09-02 Kyoto Ceramic Method and composition of metallizing carbide type ceramic body
JPS55127044A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Electric circuit substrate and its manufacture
JPS5745248A (en) * 1980-09-01 1982-03-15 Hitachi Ltd Manufacture of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113683A (en) * 1979-02-21 1980-09-02 Kyoto Ceramic Method and composition of metallizing carbide type ceramic body
JPS55127044A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Electric circuit substrate and its manufacture
JPS5745248A (en) * 1980-09-01 1982-03-15 Hitachi Ltd Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521479A (ja) * 1991-07-15 1993-01-29 Mitsubishi Electric Corp 混成集積回路装置
JP2007500450A (ja) * 2003-05-08 2007-01-11 クラミック エレクトロニクス ゲーエムベーハー 複合材料及び電気回路又は電気モジュール

Also Published As

Publication number Publication date
JPH0214189B2 (enExample) 1990-04-06

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