JPS61289692A - 部品姿勢検出装置 - Google Patents

部品姿勢検出装置

Info

Publication number
JPS61289692A
JPS61289692A JP60132207A JP13220785A JPS61289692A JP S61289692 A JPS61289692 A JP S61289692A JP 60132207 A JP60132207 A JP 60132207A JP 13220785 A JP13220785 A JP 13220785A JP S61289692 A JPS61289692 A JP S61289692A
Authority
JP
Japan
Prior art keywords
light
thickness
detection device
sensor
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60132207A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0345919B2 (enExample
Inventor
瀬野　眞透
義彦 三沢
河井　誠
健一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60132207A priority Critical patent/JPS61289692A/ja
Priority to US06/875,210 priority patent/US4745295A/en
Publication of JPS61289692A publication Critical patent/JPS61289692A/ja
Publication of JPH0345919B2 publication Critical patent/JPH0345919B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP60132207A 1985-06-18 1985-06-18 部品姿勢検出装置 Granted JPS61289692A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60132207A JPS61289692A (ja) 1985-06-18 1985-06-18 部品姿勢検出装置
US06/875,210 US4745295A (en) 1985-06-18 1986-06-17 Attitude detecting arrangement for detecting the length and thickness of a part using horizontally and vertically disposed line sensors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60132207A JPS61289692A (ja) 1985-06-18 1985-06-18 部品姿勢検出装置

Publications (2)

Publication Number Publication Date
JPS61289692A true JPS61289692A (ja) 1986-12-19
JPH0345919B2 JPH0345919B2 (enExample) 1991-07-12

Family

ID=15075896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60132207A Granted JPS61289692A (ja) 1985-06-18 1985-06-18 部品姿勢検出装置

Country Status (2)

Country Link
US (1) US4745295A (enExample)
JP (1) JPS61289692A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202096A (ja) * 1987-02-18 1988-08-22 三洋電機株式会社 部品装着装置
JPS6474800A (en) * 1987-09-17 1989-03-20 Sony Corp Decision method of attitude of part for mounting machine
JPH02137299A (ja) * 1988-11-17 1990-05-25 Matsushita Electric Ind Co Ltd 電子部品実装方法
JPH08288696A (ja) * 1996-05-20 1996-11-01 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2021056131A (ja) * 2019-09-30 2021-04-08 シチズンファインデバイス株式会社 ワーク保持装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3090567B2 (ja) * 1993-12-29 2000-09-25 ヤマハ発動機株式会社 実装機における部品認識方法および同装置
JP3554615B2 (ja) * 1995-07-19 2004-08-18 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
US6292261B1 (en) * 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
US6229608B1 (en) * 1999-06-10 2001-05-08 Pmj Automec Oyj Procedure and system for inspecting a component with leads to determine its fitness for assembly
DE60321350D1 (de) * 2002-08-08 2008-07-10 Matsushita Electric Industrial Co Ltd Vorrichtung und verfahren zum ermitteln ob ein bauelemententräger gut ist, und maschine und verfahren zur montage eines elektronischen bauteils
US7433027B2 (en) * 2004-12-22 2008-10-07 Novartis Ag Apparatus and method for detecting lens thickness
US7400417B2 (en) * 2005-05-23 2008-07-15 Federal Mogul World Wide, Inc. Diffraction method for measuring thickness of a workpart
US7391338B2 (en) * 2005-12-21 2008-06-24 International Business Machines Corporation Apparatus and method using a sensor to detect improper orientation of an object
US7880900B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Measuring apparatus for performing positional analysis on an integrated circuit carrier
US20100045729A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Method for testing alignment of a test bed with a plurality of integrated circuits thereon
US7924440B2 (en) * 2008-08-19 2011-04-12 Silverbrook Research Pty Ltd Imaging apparatus for imaging integrated circuits on an integrated circuit carrier
US20100044437A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Measuring apparatus for a carrier of printhead integrated circuitry
US9057595B2 (en) 2011-11-30 2015-06-16 Novartis Ag Combination of mirror images to improve signal quality for contact lenses
JP6829946B2 (ja) * 2016-04-28 2021-02-17 川崎重工業株式会社 部品検査装置および方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956629A (en) * 1975-06-09 1976-05-11 Inex, Inc. Inspection method and apparatus
US4515479A (en) * 1980-07-29 1985-05-07 Diffracto Ltd. Electro-optical sensors with fiber optic bundles
JPS58111705A (ja) * 1981-12-25 1983-07-02 Mitsutoyo Mfg Co Ltd 光学式測定装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202096A (ja) * 1987-02-18 1988-08-22 三洋電機株式会社 部品装着装置
JPS6474800A (en) * 1987-09-17 1989-03-20 Sony Corp Decision method of attitude of part for mounting machine
JPH02137299A (ja) * 1988-11-17 1990-05-25 Matsushita Electric Ind Co Ltd 電子部品実装方法
JPH08288696A (ja) * 1996-05-20 1996-11-01 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2021056131A (ja) * 2019-09-30 2021-04-08 シチズンファインデバイス株式会社 ワーク保持装置

Also Published As

Publication number Publication date
JPH0345919B2 (enExample) 1991-07-12
US4745295A (en) 1988-05-17

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Legal Events

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