US4745295A - Attitude detecting arrangement for detecting the length and thickness of a part using horizontally and vertically disposed line sensors - Google Patents

Attitude detecting arrangement for detecting the length and thickness of a part using horizontally and vertically disposed line sensors Download PDF

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Publication number
US4745295A
US4745295A US06/875,210 US87521086A US4745295A US 4745295 A US4745295 A US 4745295A US 87521086 A US87521086 A US 87521086A US 4745295 A US4745295 A US 4745295A
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United States
Prior art keywords
light
length
thickness
detecting
attitude
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US06/875,210
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English (en)
Inventor
Makito Seno
Yoshihiko Misawa
Makoto Kawai
Kenichi Sato
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: KAWAI, MAKOTO, MISAWA, YOSHIHIKO, SATO, KENICHI, SENO, MAKITO
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning

Definitions

  • the present invention generally relates to a detecting arrangement and more particularly, to an attitude or posture detecting arrangement for objects, for example, electronic parts or the like, which is capable of positively detecting at high speeds, whether or not the object held by a holding device such as a suction nozzle, etc. is correctly supported or whether or not the object is a correct object as required, with a high detecting reliability.
  • the chip-type electronic part 1 (referred to as a chip part hereinbelow) which is an object to be detected is fed from a part supply section 2, and is held, through vacuum attraction, by one of suction nozzles 4 of a mounting head 3 of the machine to be intermittently rotated. Subsequently, after being subjected to a positional adjustment in X and Y directions by an X-Y direction adjusting section 6, the chip part 1 is checked for its attracted attitude by a detector 7, and is transported up to a print circuit board 9 supported on an X-Y table 8 so as to be mounted thereon as required.
  • FIG. 3 shows a state in which the chip part 1 is normally attracted onto the suction nozzle 4
  • FIG. 4 shows a state in which the chip part 1 is abnormally attracted thereto.
  • a pair of light transmitting type photo-sensors 10 and another pair of light transmitting type photo-sensors 11 are disposed vertically in two stages at opposite sides of the object 1 held by the suction nozzle 4 as illustrated.
  • the pair of spaced photosensors 10 are disposed immediately below the suction nozzle 4 for detecting the presence or absence of the chip part 1, while the pair of spaced photo-sensors 11 are disposed in a position that is located under the lower end of the suction nozzle 4 by a distance greater than a thickness t of the chip part 1, but less than a long side L of said chip part 1.
  • the conventional attitude detecting arrangement as described so far has a problem in that, even with respect to the chip part normally attracted onto the suction nozzle 4, if said chip part is incorrectly oriented in a horizontal plane by 90° as is the chip part 1a shown by chain lines in FIGS. 5(a) and 5(b), despite a normal posture thereof in the direction of thickness thereof, it is impossible to effect a correct detection.
  • an essential object of the present invention is to provide an improved attitude detecting arrangement for objects such as electronic parts, etc., which is capable of detecting not only an abnormal attraction taking place in the direction of thickness of the object to be detected, but also an incorrect orientation of the object which may occur in a horizontal plane, with substantial elimination of disadvantage inherent in the conventional arrangements of this kind.
  • Another important object of the present invention is to provide an attitude detecting arrangement of the abovedescribed type, which is simple in construction and functions accurately, and which is readily manufactured at low cost.
  • an attitude detecting arrangement for detecting the orientation of objects, which includes a sensor means having a light emitting portion and a light receiving portion confronting the light emitting portion for receiving light emitted from the light emitting portion so as to be capable of detecting lengths in a horizontal direction and a vertical direction, thereby to obtain data corresponding to of thickness and length of an object by interception of part of the light by the object held by a suction means and inserted between the light emitting portion and light receiving portion, and an operation processing means for detecting the attitude of the object to be detected through comparison of the data obtained by the sensor means with preliminarily obtained data of the thickness and length of the object to be detected.
  • FIG. 1 is a schematic side elevational diagram of an attitude detecting arrangement illustrating the operation principle of detection according to one preferred embodiment of the present invention
  • FIG. 2 is a fragmentary perspective view of a chip part mounting machine in which a conventional attitude detecting arrangement is employed (already referred to);
  • FIG. 3 is a fragmentary side sectional view of a suction nozzle portion of a conventional part attitude detecting arrangement showing a state of operation during normal attraction of the object (already referred to);
  • FIG. 4 is a view similar to FIG. 3, which particularly shows a state of operation during an abnormal attraction of the object (already referred to);
  • FIG. 5(a) is a fragmentary side sectional view of a suction nozzle portion of a conventional part attitude detecting arrangement showing a state of operation in which the chip part deviates from the proper orientation 90° in a horizontal plane (already referred to);
  • FIG. 5(b) is a top plane view of the suction nozzle portion of FIG. 5(a) (already referred to);
  • FIG. 6 is an electrical block diagram showing a circuit construction of the part attitude detecting arrangement for a chip part mounting machine according to one preferred embodiment of the present invention
  • FIG. 7(a) is a schematic side sectional view of a sensor portion employed in the arrangement of FIG. 6;
  • FIG. 7(b) is a top plan view of the sensor portion of FIG. 7(a).
  • FIG. 8 is a fragmentary side sectional view of a part attitude detecting arrangement according to a second embodiment of the present invention.
  • FIG. 6 an electrical circuit diagram representing a circuit of an attitude detecting arrangement for a chip type electronic part mounting machine according to one preferred embodiment of the present invention.
  • the circuit generally includes a sensor section 12 coupled, through an amplifier 13, to an operation processing section 17, whose output is connected to a controller 14 via an output circuit 18.
  • the controller 14 is connected, through an input circuit 15, to a comparing value memory section 16 which is also coupled to the operation processing section 17 and to which a key input section 19 is connected.
  • the sensor section 12 measures the thickness and length of the chip part 1 attracted onto the suction nozzle, and sends the data thereof to the amplifier 13.
  • data corresponding to the number of the chip parts is simultaneously fed from the controller 14 provided in a main body of the electronic part mounting machine to the comparing value memory section 16 through the input circuit 15, and this comparing value memory section 16 sends out corresponding standard data of thickness and length to the operation processing section 17.
  • the above two data corresponding to thicknesses and lengths are compared at the operation processing section 17, and the result is judged and fed to the controller 14 in the main body of the mounting machine through the output circuit 18.
  • the key input section 19 is for inputting the standard data for the thickness and length of the chip part.
  • the sensor section 12 for example, has a rectangular box-like configuration and is provided therein with a groove or recess V having a width sufficient to receive the suction nozzle 4 and the chip part 1.
  • a light source 20 and a lens O are disposed to emit parallel light rays R, while, after within the other side wall of the groove V, line sensors 22 and 23 are respectively embedded and extend in horizontal and vertical directions to confront the light source 20 through a half mirror 21.
  • Each of these line sensors 22 and 23 is of a charge coupled device (CCD) of one dimensional type which may be used as an image pick-up element.
  • CCD charge coupled device
  • On the light receiving surface of each sensor there are arranged a large number of sensor elements (not particularly shown), each of which is capable of emitting a signal indicating whether or not light from the light souce 20 is received thereby. Therefore, when an object, for example, the chip part 1 is introduced between the light source 20 and the line sensors 22 and 23, the light is shielded by the object and casts a shadow on the light receiving surface of the sensor, and by sequentially scanning the sensor elements at this time, the number of sensor elements that are covered by the shadow can be determined. For preventing unnecessary light from entering the line sensors 22 and 23, slits 24 are provided therefor as shown.
  • the state of the chip part may be judged "normal” if the data for the thickness t and length m(a) are within predetermined allowances upon comparison thereof with preset data, or the state may be judged "abnormal” if they exceed the preset data.
  • the part attitude detecting arrangement is adapted to subject the chip part 1 attracted and held by the suction nozzle 4 to positional adjustment by a pair of confronting chuck jaws 24c of a chuck 24.
  • the line sensor 23 extending in the horizontal direction is disposed under the chip part 1 in a position lower than a thickness t of the chip part 1, and a length obtained by subtracting lengths m1 and m2 of the portions shielded by the jaws 24c of the chuck 24, from the length L2 of the sensor 23, represents the length a of the chip part 1.
  • the thickness t of the chip part 1 may be represented by a length obtained by subtracting the set height h of the suction nozzle 4 from a length L1 of the portion shielded by the vertically disposed line sensor 22.
  • the attitude detecting arrangement includes the sensor section having the light source and sensors capable of detecting lengths in the horizontal direction and vertical direction so as to detect the thickness and length of the object due to the shielding of light by said object held by the suction nozzle and entering between the sensors, the comparing value memory section in which preliminarily obtained data of the thickness and length in the horizontal direction of the object to be detected are respectively stored, and the operation processing section for judging whether or not the object is correctly held or the object is a correct one as required, it is possible to determine the presence of the attracted object to be detected, state of the posture of the attracted object, and furthermore, whether determine or not such attracted object is the correct one as required.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
US06/875,210 1985-06-18 1986-06-17 Attitude detecting arrangement for detecting the length and thickness of a part using horizontally and vertically disposed line sensors Expired - Lifetime US4745295A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-132207 1985-06-18
JP60132207A JPS61289692A (ja) 1985-06-18 1985-06-18 部品姿勢検出装置

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US4745295A true US4745295A (en) 1988-05-17

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JP (1) JPS61289692A (enExample)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608642A (en) * 1993-12-29 1997-03-04 Yamaha Hatsudoki Kabushiki Kaisha Component recognition method and device
US5661239A (en) * 1995-07-19 1997-08-26 Sanyo Electric Co., Ltd. Electronic parts-mounting apparatus
US6229608B1 (en) * 1999-06-10 2001-05-08 Pmj Automec Oyj Procedure and system for inspecting a component with leads to determine its fitness for assembly
US6292261B1 (en) * 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
WO2004016064A1 (en) * 2002-08-08 2004-02-19 Matsushita Electric Industrial Co., Ltd. Device and method for detecting whether or not component holder is good, and apparatus and method for mounting electronic component
US20060262327A1 (en) * 2005-05-23 2006-11-23 Federal-Mogul World Wide, Inc. Diffraction method for measuring thickness of a workpart
US20070139181A1 (en) * 2005-12-21 2007-06-21 International Business Machines Corporation Apparatus and method using a sensor to detect improper orientation of an object
US7433027B2 (en) * 2004-12-22 2008-10-07 Novartis Ag Apparatus and method for detecting lens thickness
US20100045986A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Imaging apparatus for imaging integrated circuits on an integrated circuit carrier
US20100044437A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Measuring apparatus for a carrier of printhead integrated circuitry
US20100045729A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Method for testing alignment of a test bed with a plurality of integrated circuits thereon
US20100046007A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Measuring apparatus for performing positional analysis on an integrated circuit carrier
US9057595B2 (en) 2011-11-30 2015-06-16 Novartis Ag Combination of mirror images to improve signal quality for contact lenses
US10746535B2 (en) * 2016-04-28 2020-08-18 Kawasaki Jukogyo Kabushiki Kaisha Inspecting device and method for component with two wires

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810794B2 (ja) * 1987-02-18 1996-01-31 三洋電機株式会社 部品装着装置
JP2540879B2 (ja) * 1987-09-17 1996-10-09 ソニー株式会社 実装機の部品姿勢判定方法
JP2658298B2 (ja) * 1988-11-17 1997-09-30 松下電器産業株式会社 電子部品実装方法
JP2636823B2 (ja) * 1996-05-20 1997-07-30 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP7198188B2 (ja) * 2019-09-30 2022-12-28 シチズンファインデバイス株式会社 ワーク保持装置

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Publication number Priority date Publication date Assignee Title
US3956629A (en) * 1975-06-09 1976-05-11 Inex, Inc. Inspection method and apparatus
US4515479A (en) * 1980-07-29 1985-05-07 Diffracto Ltd. Electro-optical sensors with fiber optic bundles
US4521112A (en) * 1981-12-25 1985-06-04 Mitutoyo Mfg. Co., Ltd. Optical measuring device with position indicator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956629A (en) * 1975-06-09 1976-05-11 Inex, Inc. Inspection method and apparatus
US4515479A (en) * 1980-07-29 1985-05-07 Diffracto Ltd. Electro-optical sensors with fiber optic bundles
US4521112A (en) * 1981-12-25 1985-06-04 Mitutoyo Mfg. Co., Ltd. Optical measuring device with position indicator

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608642A (en) * 1993-12-29 1997-03-04 Yamaha Hatsudoki Kabushiki Kaisha Component recognition method and device
US5661239A (en) * 1995-07-19 1997-08-26 Sanyo Electric Co., Ltd. Electronic parts-mounting apparatus
US6292261B1 (en) * 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
US6229608B1 (en) * 1999-06-10 2001-05-08 Pmj Automec Oyj Procedure and system for inspecting a component with leads to determine its fitness for assembly
WO2004016064A1 (en) * 2002-08-08 2004-02-19 Matsushita Electric Industrial Co., Ltd. Device and method for detecting whether or not component holder is good, and apparatus and method for mounting electronic component
US7458147B2 (en) 2002-08-08 2008-12-02 Panasonic Corporation Method for determining whether a component holder is defective
US7433027B2 (en) * 2004-12-22 2008-10-07 Novartis Ag Apparatus and method for detecting lens thickness
US7400417B2 (en) 2005-05-23 2008-07-15 Federal Mogul World Wide, Inc. Diffraction method for measuring thickness of a workpart
US20060262327A1 (en) * 2005-05-23 2006-11-23 Federal-Mogul World Wide, Inc. Diffraction method for measuring thickness of a workpart
US7391338B2 (en) * 2005-12-21 2008-06-24 International Business Machines Corporation Apparatus and method using a sensor to detect improper orientation of an object
US20070139181A1 (en) * 2005-12-21 2007-06-21 International Business Machines Corporation Apparatus and method using a sensor to detect improper orientation of an object
US20100045729A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Method for testing alignment of a test bed with a plurality of integrated circuits thereon
US20100044437A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Measuring apparatus for a carrier of printhead integrated circuitry
US20100045986A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Imaging apparatus for imaging integrated circuits on an integrated circuit carrier
US20100046007A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Measuring apparatus for performing positional analysis on an integrated circuit carrier
US7880900B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Measuring apparatus for performing positional analysis on an integrated circuit carrier
US7924440B2 (en) 2008-08-19 2011-04-12 Silverbrook Research Pty Ltd Imaging apparatus for imaging integrated circuits on an integrated circuit carrier
US20110149355A1 (en) * 2008-08-19 2011-06-23 Silverbrook Research Pty Ltd Imaging apparatus for imaging integrated circuits on an integrated circuit carrier
US9057595B2 (en) 2011-11-30 2015-06-16 Novartis Ag Combination of mirror images to improve signal quality for contact lenses
US10746535B2 (en) * 2016-04-28 2020-08-18 Kawasaki Jukogyo Kabushiki Kaisha Inspecting device and method for component with two wires

Also Published As

Publication number Publication date
JPH0345919B2 (enExample) 1991-07-12
JPS61289692A (ja) 1986-12-19

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