JPS61276875A - 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤 - Google Patents

配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤

Info

Publication number
JPS61276875A
JPS61276875A JP60118898A JP11889885A JPS61276875A JP S61276875 A JPS61276875 A JP S61276875A JP 60118898 A JP60118898 A JP 60118898A JP 11889885 A JP11889885 A JP 11889885A JP S61276875 A JPS61276875 A JP S61276875A
Authority
JP
Japan
Prior art keywords
resin
heat
fine powder
adhesive
resistant resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60118898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0518476B2 (fr
Inventor
Akira Enomoto
亮 榎本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60118898A priority Critical patent/JPS61276875A/ja
Priority to US06/860,886 priority patent/US4752499A/en
Publication of JPS61276875A publication Critical patent/JPS61276875A/ja
Priority to US07/357,693 priority patent/US5021472A/en
Publication of JPH0518476B2 publication Critical patent/JPH0518476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP60118898A 1985-05-16 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤 Granted JPS61276875A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60118898A JPS61276875A (ja) 1985-06-03 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤
US06/860,886 US4752499A (en) 1985-05-16 1986-05-08 Adhesive for electroless plating and method of preparation of circuit board using this adhesive
US07/357,693 US5021472A (en) 1985-05-16 1989-05-25 Adhesive for electroless plating and method of preparation of circuit board using this adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60118898A JPS61276875A (ja) 1985-06-03 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤

Publications (2)

Publication Number Publication Date
JPS61276875A true JPS61276875A (ja) 1986-12-06
JPH0518476B2 JPH0518476B2 (fr) 1993-03-12

Family

ID=14747894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60118898A Granted JPS61276875A (ja) 1985-05-16 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤

Country Status (1)

Country Link
JP (1) JPS61276875A (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429479A (en) * 1987-07-23 1989-01-31 Ibiden Co Ltd Adhesive composition for electroless plating
JPS6447095A (en) * 1987-08-18 1989-02-21 Ibiden Co Ltd Printed wiring board and manufacture thereof
JPS6459987A (en) * 1987-08-31 1989-03-07 Ibiden Co Ltd Base material for additive
JPH028283A (ja) * 1988-06-28 1990-01-11 Ibiden Co Ltd 無電解めっき用接着剤
JPH02182731A (ja) * 1989-01-10 1990-07-17 Ibiden Co Ltd プリプレグ
JPH0380592A (ja) * 1989-08-24 1991-04-05 Ibiden Co Ltd プリント配線板の製造方法
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
US5589255A (en) * 1988-04-28 1996-12-31 Ibiden Co., Ltd. Adhesive for electroless plating, printed circuit boards and method of producing the same
WO1997024229A1 (fr) * 1995-12-26 1997-07-10 Ibiden Co., Ltd. Corps sur lequel est lie un film metallique, couche d'agent de liaison et agent de liaison
WO1998047329A1 (fr) * 1997-04-15 1998-10-22 Ibiden Co., Ltd. Adhesif utile pour effectuer le depot autocatalytique, composition de produit de depart utile pour preparer de l'adhesif pour depot catalytique et carte imprimee
US6248428B1 (en) 1997-04-15 2001-06-19 Ibiden Co., Ltd. Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
US6359035B1 (en) 1997-11-05 2002-03-19 Ibiden Co., Ltd. Adhesive for electroless plating and method of producing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040088592A (ko) 1996-01-11 2004-10-16 이비덴 가부시키가이샤 프린트 배선판 및 그의 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844709A (ja) * 1981-09-10 1983-03-15 マルコン電子株式会社 コンデンサの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844709A (ja) * 1981-09-10 1983-03-15 マルコン電子株式会社 コンデンサの製造方法

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429479A (en) * 1987-07-23 1989-01-31 Ibiden Co Ltd Adhesive composition for electroless plating
JPH0564714B2 (fr) * 1987-07-23 1993-09-16 Ibiden Co Ltd
JPS6447095A (en) * 1987-08-18 1989-02-21 Ibiden Co Ltd Printed wiring board and manufacture thereof
JPS6459987A (en) * 1987-08-31 1989-03-07 Ibiden Co Ltd Base material for additive
JPH0634447B2 (ja) * 1987-08-31 1994-05-02 イビデン株式会社 アディティブ用接着剤、これを使用したアディティブ用基材及びプリント配線板
US5589255A (en) * 1988-04-28 1996-12-31 Ibiden Co., Ltd. Adhesive for electroless plating, printed circuit boards and method of producing the same
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
JPH028283A (ja) * 1988-06-28 1990-01-11 Ibiden Co Ltd 無電解めっき用接着剤
JPH02182731A (ja) * 1989-01-10 1990-07-17 Ibiden Co Ltd プリプレグ
JPH0380592A (ja) * 1989-08-24 1991-04-05 Ibiden Co Ltd プリント配線板の製造方法
US5447996A (en) * 1991-07-23 1995-09-05 Ibiden Co., Ltd. Adhesive comprising cured amino resin powder for printed circuit board
US5688583A (en) * 1991-07-23 1997-11-18 Ibiden Co., Ltd. Adhesive for printed circuit board
US5741575A (en) * 1991-07-23 1998-04-21 Ibiden Co., Ltd. Adhesive for printed circuit board
US5795618A (en) * 1991-07-23 1998-08-18 Ibiden Co., Ltd Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
WO1997024229A1 (fr) * 1995-12-26 1997-07-10 Ibiden Co., Ltd. Corps sur lequel est lie un film metallique, couche d'agent de liaison et agent de liaison
US6607825B1 (en) 1995-12-26 2003-08-19 Ibiden Co., Ltd. Metal film bonded body, bonding agent layer and bonding agent
WO1998047329A1 (fr) * 1997-04-15 1998-10-22 Ibiden Co., Ltd. Adhesif utile pour effectuer le depot autocatalytique, composition de produit de depart utile pour preparer de l'adhesif pour depot catalytique et carte imprimee
US6248428B1 (en) 1997-04-15 2001-06-19 Ibiden Co., Ltd. Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
US6359035B1 (en) 1997-11-05 2002-03-19 Ibiden Co., Ltd. Adhesive for electroless plating and method of producing the same
WO2004096937A1 (fr) * 1997-11-05 2004-11-11 Yoshitaka Ono Adhesif destine au plaquage non electrolytique et procede de preparation correspondant

Also Published As

Publication number Publication date
JPH0518476B2 (fr) 1993-03-12

Similar Documents

Publication Publication Date Title
US4752499A (en) Adhesive for electroless plating and method of preparation of circuit board using this adhesive
US5055321A (en) Adhesive for electroless plating, printed circuit boards and method of producing the same
JPS61276875A (ja) 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤
JPH0455555B2 (fr)
JPH02188992A (ja) 多層プリント配線板およびその製造方法
JPH10158526A (ja) 樹脂組成物及びその成形体表面への導体形成方法
JPH06268339A (ja) フレックスリジッド多層プリント配線板およびその製造方法
JP3320432B2 (ja) 多層配線板の製造方法
JPH0564714B2 (fr)
JP3090973B2 (ja) アディティブプリント配線板用接着層の形成方法
JPH07188935A (ja) アンカー特性に優れる接着剤、およびこの接着剤を用いたプリント配線板とその製造方法
JP2877993B2 (ja) 配線板用接着剤とこの接着剤を用いたプリント配線板の製造方法およびプリント配線板
JP3115435B2 (ja) 接着剤およびプリント配線板
JP3007648B2 (ja) 無電解めっき用接着剤プリント配線板の製造方法およびプリント配線板
JPH05235546A (ja) 多層プリント配線板およびその製造方法
JPH0533840B2 (fr)
JPH028283A (ja) 無電解めっき用接着剤
JPH01275682A (ja) プリント配線板ならびにそれの製造方法と無電解めっき用接着剤
JP3219827B2 (ja) アンカー形成用耐熱性樹脂粒子および無電解めっき用接着剤とこの接着剤を用いたプリント配線板の製造方法およびプリント配線板
JPH0565074B2 (fr)
JPH028281A (ja) 無電解めっき用接着剤
JP2877992B2 (ja) 配線板用接着剤とこの接着剤を用いたプリント配線板の製造方法およびプリント配線板
JPH0426560B2 (fr)
JP3076680B2 (ja) 配線板用接着剤とこの接着剤を用いたプリント配線板の製造方法およびプリント配線板
JP2000191910A (ja) 耐熱性樹脂組成物、層間絶縁膜及び多層回路基板

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term