JPS61264788A - チツプ部品装着機 - Google Patents

チツプ部品装着機

Info

Publication number
JPS61264788A
JPS61264788A JP60106056A JP10605685A JPS61264788A JP S61264788 A JPS61264788 A JP S61264788A JP 60106056 A JP60106056 A JP 60106056A JP 10605685 A JP10605685 A JP 10605685A JP S61264788 A JPS61264788 A JP S61264788A
Authority
JP
Japan
Prior art keywords
mounting
chip
suction
supply
centering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60106056A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0370920B2 (enrdf_load_stackoverflow
Inventor
八木　博志
尚 藤田
原田　善雄
賢一 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP60106056A priority Critical patent/JPS61264788A/ja
Priority to CN 85107808 priority patent/CN1007692B/zh
Priority to DE3532500A priority patent/DE3532500C2/de
Priority to GB08522870A priority patent/GB2166372B/en
Priority to CA000490861A priority patent/CA1239482A/en
Priority to KR1019850006772A priority patent/KR900000185B1/ko
Priority to FR8513777A priority patent/FR2575630B1/fr
Publication of JPS61264788A publication Critical patent/JPS61264788A/ja
Priority to US07/067,648 priority patent/US4881319A/en
Priority to MYPI87001971A priority patent/MY102558A/en
Publication of JPH0370920B2 publication Critical patent/JPH0370920B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP60106056A 1984-09-17 1985-05-20 チツプ部品装着機 Granted JPS61264788A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP60106056A JPS61264788A (ja) 1985-05-20 1985-05-20 チツプ部品装着機
CN 85107808 CN1007692B (zh) 1985-05-20 1985-09-10 在印刷电路板上安装芯片型电路元件的方法及其所用装置
DE3532500A DE3532500C2 (de) 1984-09-17 1985-09-12 Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
GB08522870A GB2166372B (en) 1984-09-17 1985-09-16 Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor
CA000490861A CA1239482A (en) 1984-09-17 1985-09-16 Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor
KR1019850006772A KR900000185B1 (ko) 1984-09-17 1985-09-17 인쇄회로기판에 칩형 회로소자를 부착시키는 방법과 그 장치
FR8513777A FR2575630B1 (fr) 1984-09-17 1985-09-17 Procede de montage d'elements de circuit du type puce sur des plaquettes de circuit imprime et appareil associe
US07/067,648 US4881319A (en) 1984-09-17 1987-06-26 Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor
MYPI87001971A MY102558A (en) 1984-09-17 1987-09-26 Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60106056A JPS61264788A (ja) 1985-05-20 1985-05-20 チツプ部品装着機

Publications (2)

Publication Number Publication Date
JPS61264788A true JPS61264788A (ja) 1986-11-22
JPH0370920B2 JPH0370920B2 (enrdf_load_stackoverflow) 1991-11-11

Family

ID=14423957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60106056A Granted JPS61264788A (ja) 1984-09-17 1985-05-20 チツプ部品装着機

Country Status (1)

Country Link
JP (1) JPS61264788A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3919636A1 (de) * 1988-06-16 1989-12-28 Tdk Corp Geraet zur montage elektronischer komponenten
WO1998032317A1 (en) * 1997-01-17 1998-07-23 Matsushita Electric Industrial Co., Ltd. Electronic component mounting device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624997A (en) * 1979-08-07 1981-03-10 Sanyo Electric Co Device for mounting electric part
JPS5636196A (en) * 1979-09-03 1981-04-09 Sony Corp Apparatus for assembling electronic device circuit
JPS57145394A (en) * 1981-03-03 1982-09-08 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS57188900A (en) * 1982-03-04 1982-11-19 Matsushita Electric Ind Co Ltd Device for winding electronic part assembly coating tape
JPS57199730A (en) * 1981-06-01 1982-12-07 Matsushita Electric Ind Co Ltd Transfer equipment
JPS5827399A (ja) * 1981-07-29 1983-02-18 エヌ・ベー・フィリップス・フルーイランペンファブリケン 素子送給方法及び装置
JPS5941889A (ja) * 1982-08-31 1984-03-08 松下電器産業株式会社 電子部品の実装装置
JPS59198800A (ja) * 1983-04-26 1984-11-10 株式会社デンソー マルチヘツド部品組付装置
JPS6038900A (ja) * 1983-08-12 1985-02-28 株式会社日立製作所 電子部品挿入装置
JPS6066500A (ja) * 1983-09-22 1985-04-16 松下電器産業株式会社 部品装着装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624997A (en) * 1979-08-07 1981-03-10 Sanyo Electric Co Device for mounting electric part
JPS5636196A (en) * 1979-09-03 1981-04-09 Sony Corp Apparatus for assembling electronic device circuit
JPS57145394A (en) * 1981-03-03 1982-09-08 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS57199730A (en) * 1981-06-01 1982-12-07 Matsushita Electric Ind Co Ltd Transfer equipment
JPS5827399A (ja) * 1981-07-29 1983-02-18 エヌ・ベー・フィリップス・フルーイランペンファブリケン 素子送給方法及び装置
JPS57188900A (en) * 1982-03-04 1982-11-19 Matsushita Electric Ind Co Ltd Device for winding electronic part assembly coating tape
JPS5941889A (ja) * 1982-08-31 1984-03-08 松下電器産業株式会社 電子部品の実装装置
JPS59198800A (ja) * 1983-04-26 1984-11-10 株式会社デンソー マルチヘツド部品組付装置
JPS6038900A (ja) * 1983-08-12 1985-02-28 株式会社日立製作所 電子部品挿入装置
JPS6066500A (ja) * 1983-09-22 1985-04-16 松下電器産業株式会社 部品装着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3919636A1 (de) * 1988-06-16 1989-12-28 Tdk Corp Geraet zur montage elektronischer komponenten
WO1998032317A1 (en) * 1997-01-17 1998-07-23 Matsushita Electric Industrial Co., Ltd. Electronic component mounting device

Also Published As

Publication number Publication date
JPH0370920B2 (enrdf_load_stackoverflow) 1991-11-11

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term