JPS61255858A - 銅張りラミネ−トを製造する方法および装置 - Google Patents
銅張りラミネ−トを製造する方法および装置Info
- Publication number
- JPS61255858A JPS61255858A JP61099521A JP9952186A JPS61255858A JP S61255858 A JPS61255858 A JP S61255858A JP 61099521 A JP61099521 A JP 61099521A JP 9952186 A JP9952186 A JP 9952186A JP S61255858 A JPS61255858 A JP S61255858A
- Authority
- JP
- Japan
- Prior art keywords
- press
- belt
- copper
- press belt
- reaction zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 86
- 238000000034 method Methods 0.000 title claims description 27
- 229910052802 copper Inorganic materials 0.000 title claims description 21
- 239000010949 copper Substances 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011889 copper foil Substances 0.000 claims description 63
- 239000003792 electrolyte Substances 0.000 claims description 35
- 238000006243 chemical reaction Methods 0.000 claims description 29
- 239000002648 laminated material Substances 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000008151 electrolyte solution Substances 0.000 claims description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052753 mercury Inorganic materials 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims 2
- 239000003365 glass fiber Substances 0.000 description 14
- 238000000151 deposition Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 7
- 239000000428 dust Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 229910001431 copper ion Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000012792 core layer Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012432 intermediate storage Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
- B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1027—Pressing using at least one press band
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/15—Combined or convertible surface bonding means and/or assembly means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
- Y10T156/1956—Roller pair delaminating means
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3515629.5 | 1985-05-02 | ||
| DE19853515629 DE3515629A1 (de) | 1985-05-02 | 1985-05-02 | Verfahren und vorrichtung zur herstellung kupferkaschierter laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61255858A true JPS61255858A (ja) | 1986-11-13 |
| JPH032661B2 JPH032661B2 (enExample) | 1991-01-16 |
Family
ID=6269529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61099521A Granted JPS61255858A (ja) | 1985-05-02 | 1986-05-01 | 銅張りラミネ−トを製造する方法および装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4687528A (enExample) |
| EP (1) | EP0203368B1 (enExample) |
| JP (1) | JPS61255858A (enExample) |
| CN (1) | CN1019369B (enExample) |
| DE (2) | DE3515629A1 (enExample) |
| SU (2) | SU1438636A3 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136695A (ja) * | 1986-11-28 | 1988-06-08 | 三菱電機株式会社 | シ−ルド板の製造方法および装置 |
| JPS63285997A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| JPS63285998A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| JP2014147928A (ja) * | 2009-01-07 | 2014-08-21 | Swedish Biomimetics 3000 Ltd | 二重移動相の装置および方法 |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8704828D0 (en) * | 1987-03-02 | 1987-04-08 | M & T Laminates Ltd | Copper-clad dielectric material |
| DE3811467A1 (de) * | 1988-04-06 | 1989-10-19 | Siempelkamp Gmbh & Co | Verfahren und anlage zur kontinuierlichen herstellung von bahnfoermigem basismaterial fuer leiterplatten |
| DE3834993A1 (de) * | 1988-10-14 | 1990-04-19 | Held Kurt | Verfahren und vorrichtung zur kontinuierlichen herstellung von laminaten |
| US5149394A (en) * | 1988-10-14 | 1992-09-22 | Kurt Held | Method and apparatus for continuously fabricating laminates |
| US5034087A (en) * | 1989-11-16 | 1991-07-23 | Doboy Packaging Machinery, Inc. | Self-adjusting heat seal bar |
| DE4118249C2 (de) * | 1991-06-04 | 1994-10-27 | Guenther Dr Schwarz | Verfahren und Vorrichtung zur Massenkonservierung von Archivalien |
| TW244340B (enExample) * | 1992-07-21 | 1995-04-01 | Akzo Nv | |
| US5806177A (en) * | 1995-10-31 | 1998-09-15 | Sumitomo Bakelite Company Limited | Process for producing multilayer printed circuit board |
| DE19541406C1 (de) * | 1995-11-07 | 1996-10-17 | Held Kurt | Verfahren und Vorrichtung zur Herstellung von harzimprägnierten Schichtpreßstoffen |
| US6883213B2 (en) * | 1999-01-12 | 2005-04-26 | Hunter Douglas Inc. | Apparatus for producing non-woven fabric |
| US7056403B2 (en) * | 1999-01-12 | 2006-06-06 | Hunter Douglas Inc. | Apparatus for producing non-woven fabric |
| EP1155177B1 (en) | 1999-01-12 | 2005-11-30 | Hunter Douglas Inc. | Nonwoven fabric |
| US6926055B1 (en) | 1999-09-20 | 2005-08-09 | Hunter Douglas Inc. | Non-woven composite fabric and method and apparatus for manufacturing same |
| AU773064B2 (en) * | 1999-09-20 | 2004-05-13 | Hunter Douglas Industries Bv | Pressure laminator apparatus and non-woven fabric formed thereby |
| US7090743B2 (en) * | 1999-09-20 | 2006-08-15 | Hunter Douglas Inc. | Pressure laminator apparatus |
| US6805771B1 (en) | 1999-09-20 | 2004-10-19 | Hunter Douglas Industries B.V. | Pressure laminator apparatus and non woven fabric formed thereby |
| JP2001138437A (ja) * | 1999-11-17 | 2001-05-22 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
| JP3699447B2 (ja) * | 2000-07-14 | 2005-09-28 | 三菱レイヨン株式会社 | 炭素系材料シートの製造方法 |
| US7017244B2 (en) * | 2002-06-03 | 2006-03-28 | Hunter Douglas Inc. | Beam winding apparatus |
| US7695486B2 (en) * | 2002-10-02 | 2010-04-13 | Linda Dixon | Intradermal color introducing needle device, and apparatus and method involving the same |
| US20060163073A1 (en) * | 2003-06-27 | 2006-07-27 | Nobuhiro Higashihara | Process for producing metal plating film, process for producing electronic part and plating film forming apparatus |
| US8246808B2 (en) * | 2008-08-08 | 2012-08-21 | GM Global Technology Operations LLC | Selective electrochemical deposition of conductive coatings on fuel cell bipolar plates |
| CN102341236A (zh) * | 2009-03-25 | 2012-02-01 | 三井-杜邦聚合化学株式会社 | 电子部件用带有金属层的膜、其制造方法及用途 |
| KR101603964B1 (ko) * | 2012-06-22 | 2016-03-16 | 가부시키가이샤 씽크. 라보라토리 | 인쇄회로 기판 및 그 제조장치 및 제조방법 |
| CN103668374B (zh) * | 2013-12-19 | 2016-05-18 | 湖南永盛新材料股份有限公司 | 一种宽幅不锈钢带单面镀铜的方法及电镀槽 |
| CN108187965B (zh) * | 2018-02-11 | 2023-03-21 | 刘希文 | 一种输送带式面压力覆膜涂装工艺及装置 |
| US10960615B2 (en) * | 2018-11-13 | 2021-03-30 | The Boeing Company | System and method for laminating a composite laminate along a continuous loop lamination path |
| CN109591426B (zh) * | 2018-12-05 | 2019-09-13 | 广东嘉元科技股份有限公司 | 一种覆铜箔板的制备装置 |
| CN113696498B (zh) * | 2021-08-25 | 2023-03-31 | 开显工业自动化科技(苏州)有限公司 | 无限延续的带式复合材料挤压成型装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3043728A (en) * | 1958-03-17 | 1962-07-10 | Nat Res Corp | Apparatus and process for metallic vapor coating |
| GB1226199A (enExample) * | 1967-12-30 | 1971-03-24 | ||
| DE1704785A1 (de) * | 1967-12-30 | 1971-05-27 | Kalle Ag | Verfahren zum Herstellen eines Verbundmaterials mit einer Metallschicht |
| US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
| US3984598A (en) * | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
| FR2390517A1 (fr) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques |
| DE2820196A1 (de) * | 1978-05-09 | 1979-11-15 | Califoil Inc | Verfahren zur herstellung einer duennen kupferfolie |
| US4399183A (en) * | 1979-12-27 | 1983-08-16 | E. I. Du Pont De Nemours And Company | Web-supported membrane |
| DE3023827C2 (de) * | 1980-06-25 | 1985-11-21 | Siemens AG, 1000 Berlin und 8000 München | Anlage zum galvanischen Abscheiden von Aluminium |
| DE3212152C2 (de) * | 1982-04-01 | 1985-01-17 | Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim | Vorrichtung zum selektiven galvanischen Beschichten eines Bandes |
| US4587166A (en) * | 1983-02-16 | 1986-05-06 | Ampex Corporation | Plated magnetic recording material and process for making same |
| DE3307057C2 (de) * | 1983-03-01 | 1991-02-14 | Held, Kurt, 7218 Trossingen | Vorrichtung zur kontinuierlichen Herstellung kupferkaschierter Elektrolaminate |
| DE3342678C2 (de) * | 1983-11-25 | 1995-08-31 | Held Kurt | Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate |
| DE3413434A1 (de) * | 1984-04-10 | 1985-10-17 | Dielektra GmbH, 5000 Köln | Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten |
-
1985
- 1985-05-02 DE DE19853515629 patent/DE3515629A1/de not_active Withdrawn
-
1986
- 1986-04-23 DE DE8686105597T patent/DE3662240D1/de not_active Expired
- 1986-04-23 EP EP86105597A patent/EP0203368B1/de not_active Expired
- 1986-04-24 US US06/855,791 patent/US4687528A/en not_active Expired - Fee Related
- 1986-04-28 SU SU864027358A patent/SU1438636A3/ru active
- 1986-04-30 CN CN86103035A patent/CN1019369B/zh not_active Expired
- 1986-05-01 JP JP61099521A patent/JPS61255858A/ja active Granted
-
1987
- 1987-03-22 SU SU874202615A patent/SU1542430A3/ru active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136695A (ja) * | 1986-11-28 | 1988-06-08 | 三菱電機株式会社 | シ−ルド板の製造方法および装置 |
| JPS63285997A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| JPS63285998A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| JP2014147928A (ja) * | 2009-01-07 | 2014-08-21 | Swedish Biomimetics 3000 Ltd | 二重移動相の装置および方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0203368A1 (de) | 1986-12-03 |
| SU1542430A3 (ru) | 1990-02-07 |
| US4687528A (en) | 1987-08-18 |
| EP0203368B1 (de) | 1989-03-08 |
| JPH032661B2 (enExample) | 1991-01-16 |
| DE3662240D1 (en) | 1989-04-13 |
| CN1019369B (zh) | 1992-12-09 |
| SU1438636A3 (ru) | 1988-11-15 |
| DE3515629A1 (de) | 1986-11-06 |
| CN86103035A (zh) | 1986-11-12 |
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