JPS61247040A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS61247040A
JPS61247040A JP60087853A JP8785385A JPS61247040A JP S61247040 A JPS61247040 A JP S61247040A JP 60087853 A JP60087853 A JP 60087853A JP 8785385 A JP8785385 A JP 8785385A JP S61247040 A JPS61247040 A JP S61247040A
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor device
protrusion
heat sink
header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60087853A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0344414B2 (cg-RX-API-DMAC10.html
Inventor
Shigeo Iki
伊木　茂男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60087853A priority Critical patent/JPS61247040A/ja
Publication of JPS61247040A publication Critical patent/JPS61247040A/ja
Publication of JPH0344414B2 publication Critical patent/JPH0344414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/037—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/241—
    • H10W72/251—
    • H10W90/737—

Landscapes

  • Wire Bonding (AREA)
JP60087853A 1985-04-24 1985-04-24 半導体装置の製造方法 Granted JPS61247040A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60087853A JPS61247040A (ja) 1985-04-24 1985-04-24 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60087853A JPS61247040A (ja) 1985-04-24 1985-04-24 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61247040A true JPS61247040A (ja) 1986-11-04
JPH0344414B2 JPH0344414B2 (cg-RX-API-DMAC10.html) 1991-07-05

Family

ID=13926442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60087853A Granted JPS61247040A (ja) 1985-04-24 1985-04-24 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61247040A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174328A (ja) * 1987-01-14 1988-07-18 Hitachi Ltd 電子部品の接続構造
JPH0448740A (ja) * 1990-06-15 1992-02-18 Matsushita Electric Ind Co Ltd Ｔａｂ半導体装置
JP2011187946A (ja) * 2010-02-16 2011-09-22 Internatl Rectifier Corp はんだ濡れ性の前面金属部を備えるｉｉｉ族窒化物パワーデバイス
US20150041187A1 (en) * 2012-03-19 2015-02-12 Nippon Light Metal Company, Ltd. Manufacturing method of radiator-integrated substrate and radiator-integrated substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107342A (en) * 1980-01-31 1981-08-26 Sanyo Electric Co Ltd Reciprocating type cassette recorder
JPS5844731A (ja) * 1981-09-10 1983-03-15 Mitsubishi Electric Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107342A (en) * 1980-01-31 1981-08-26 Sanyo Electric Co Ltd Reciprocating type cassette recorder
JPS5844731A (ja) * 1981-09-10 1983-03-15 Mitsubishi Electric Corp 半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174328A (ja) * 1987-01-14 1988-07-18 Hitachi Ltd 電子部品の接続構造
JPH0448740A (ja) * 1990-06-15 1992-02-18 Matsushita Electric Ind Co Ltd Ｔａｂ半導体装置
JP2011187946A (ja) * 2010-02-16 2011-09-22 Internatl Rectifier Corp はんだ濡れ性の前面金属部を備えるｉｉｉ族窒化物パワーデバイス
US8853744B2 (en) 2010-02-16 2014-10-07 International Rectifier Corporation Power device with solderable front metal
US20150041187A1 (en) * 2012-03-19 2015-02-12 Nippon Light Metal Company, Ltd. Manufacturing method of radiator-integrated substrate and radiator-integrated substrate
US9474146B2 (en) * 2012-03-19 2016-10-18 Nippon Light Metal Company, Ltd. Manufacturing method of radiator-integrated substrate and radiator-integrated substrate

Also Published As

Publication number Publication date
JPH0344414B2 (cg-RX-API-DMAC10.html) 1991-07-05

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