JPS61242790A - 半田付け用フラツクス - Google Patents

半田付け用フラツクス

Info

Publication number
JPS61242790A
JPS61242790A JP60085266A JP8526685A JPS61242790A JP S61242790 A JPS61242790 A JP S61242790A JP 60085266 A JP60085266 A JP 60085266A JP 8526685 A JP8526685 A JP 8526685A JP S61242790 A JPS61242790 A JP S61242790A
Authority
JP
Japan
Prior art keywords
flux
phosphoric acid
soldering
activator
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60085266A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459078B2 (enExample
Inventor
Sandai Iwasa
山大 岩佐
Yoichi Oba
洋一 大場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Laboratory Co Ltd
Original Assignee
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Laboratory Co Ltd filed Critical Asahi Chemical Laboratory Co Ltd
Priority to JP60085266A priority Critical patent/JPS61242790A/ja
Priority to US06/838,825 priority patent/US4684054A/en
Priority to FR8604245A priority patent/FR2579857A1/fr
Priority to GB8607657A priority patent/GB2174326B/en
Priority to DE19863610747 priority patent/DE3610747A1/de
Priority to DE3645211A priority patent/DE3645211C2/de
Priority to NL8600826A priority patent/NL8600826A/nl
Priority to KR1019860002903A priority patent/KR900007263B1/ko
Publication of JPS61242790A publication Critical patent/JPS61242790A/ja
Priority to NL9201027A priority patent/NL9201027A/nl
Publication of JPH0459078B2 publication Critical patent/JPH0459078B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60085266A 1985-03-30 1985-04-19 半田付け用フラツクス Granted JPS61242790A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP60085266A JPS61242790A (ja) 1985-04-19 1985-04-19 半田付け用フラツクス
US06/838,825 US4684054A (en) 1985-03-30 1986-03-12 Automatic soldering apparatus and method of using the flux to heat the circuit board
FR8604245A FR2579857A1 (fr) 1985-03-30 1986-03-25 Appareil et procede de soudage automatique
GB8607657A GB2174326B (en) 1985-03-30 1986-03-27 Method for automatic soldering.
DE3645211A DE3645211C2 (de) 1985-03-30 1986-03-29 Flußmittel für das Löten von Leiterplatten
DE19863610747 DE3610747A1 (de) 1985-03-30 1986-03-29 Verfahren und vorrichtung zum selbsttaetigen loeten
NL8600826A NL8600826A (nl) 1985-03-30 1986-04-01 Werkwijze en inrichting voor het solderen van een plaat met gedrukte bedrading.
KR1019860002903A KR900007263B1 (ko) 1985-04-19 1986-04-16 납땜용 플럭스
NL9201027A NL9201027A (nl) 1985-03-30 1992-06-10 Werkwijze en inrichting voor het solderen van een plaat met gedrukte bedrading.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60085266A JPS61242790A (ja) 1985-04-19 1985-04-19 半田付け用フラツクス

Publications (2)

Publication Number Publication Date
JPS61242790A true JPS61242790A (ja) 1986-10-29
JPH0459078B2 JPH0459078B2 (enExample) 1992-09-21

Family

ID=13853771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60085266A Granted JPS61242790A (ja) 1985-03-30 1985-04-19 半田付け用フラツクス

Country Status (2)

Country Link
JP (1) JPS61242790A (enExample)
KR (1) KR900007263B1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04143094A (ja) * 1990-10-03 1992-05-18 Metsuku Kk はんだ付け用フラックス
JPH04237593A (ja) * 1990-07-02 1992-08-26 American Teleph & Telegr Co <Att> 水溶性ハンダ付用フラックス
JPH0569183A (ja) * 1991-01-28 1993-03-23 American Teleph & Telegr Co <Att> 水溶性はんだペーストとはんだ付け方法
JPH05212584A (ja) * 1992-01-31 1993-08-24 Senju Metal Ind Co Ltd ソルダーペースト
WO2008072654A1 (ja) * 2006-12-12 2008-06-19 Senju Metal Industry Co., Ltd. 鉛フリーはんだ用フラックスとはんだ付け方法
CN105728982A (zh) * 2015-11-05 2016-07-06 广东轻工职业技术学院 一种高效助焊剂

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110159A (en) * 1974-07-16 1976-01-27 Matsushita Electric Industrial Co Ltd Handazukehoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110159A (en) * 1974-07-16 1976-01-27 Matsushita Electric Industrial Co Ltd Handazukehoho

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04237593A (ja) * 1990-07-02 1992-08-26 American Teleph & Telegr Co <Att> 水溶性ハンダ付用フラックス
JPH04143094A (ja) * 1990-10-03 1992-05-18 Metsuku Kk はんだ付け用フラックス
JPH0569183A (ja) * 1991-01-28 1993-03-23 American Teleph & Telegr Co <Att> 水溶性はんだペーストとはんだ付け方法
JPH05212584A (ja) * 1992-01-31 1993-08-24 Senju Metal Ind Co Ltd ソルダーペースト
WO2008072654A1 (ja) * 2006-12-12 2008-06-19 Senju Metal Industry Co., Ltd. 鉛フリーはんだ用フラックスとはんだ付け方法
US9073154B2 (en) 2006-12-12 2015-07-07 Senju Metal Industry Co., Ltd. Flux for lead-free solder and soldering method
CN105728982A (zh) * 2015-11-05 2016-07-06 广东轻工职业技术学院 一种高效助焊剂
CN105728982B (zh) * 2015-11-05 2017-11-24 广东轻工职业技术学院 一种高效助焊剂

Also Published As

Publication number Publication date
JPH0459078B2 (enExample) 1992-09-21
KR860008701A (ko) 1986-11-17
KR900007263B1 (ko) 1990-10-06

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