KR900007263B1 - 납땜용 플럭스 - Google Patents

납땜용 플럭스 Download PDF

Info

Publication number
KR900007263B1
KR900007263B1 KR1019860002903A KR860002903A KR900007263B1 KR 900007263 B1 KR900007263 B1 KR 900007263B1 KR 1019860002903 A KR1019860002903 A KR 1019860002903A KR 860002903 A KR860002903 A KR 860002903A KR 900007263 B1 KR900007263 B1 KR 900007263B1
Authority
KR
South Korea
Prior art keywords
flux
soldering
phosphate
phosphoric acid
dibutyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860002903A
Other languages
English (en)
Korean (ko)
Other versions
KR860008701A (ko
Inventor
야마히로 이와사
요오이찌 오오바
Original Assignee
가부시기가이샤 아사히 카가꾸켄큐우쇼
야마히로 이와사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 아사히 카가꾸켄큐우쇼, 야마히로 이와사 filed Critical 가부시기가이샤 아사히 카가꾸켄큐우쇼
Publication of KR860008701A publication Critical patent/KR860008701A/ko
Application granted granted Critical
Publication of KR900007263B1 publication Critical patent/KR900007263B1/ko
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019860002903A 1985-04-19 1986-04-16 납땜용 플럭스 Expired KR900007263B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-85266 1985-04-19
JP60085266A JPS61242790A (ja) 1985-04-19 1985-04-19 半田付け用フラツクス

Publications (2)

Publication Number Publication Date
KR860008701A KR860008701A (ko) 1986-11-17
KR900007263B1 true KR900007263B1 (ko) 1990-10-06

Family

ID=13853771

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860002903A Expired KR900007263B1 (ko) 1985-04-19 1986-04-16 납땜용 플럭스

Country Status (2)

Country Link
JP (1) JPS61242790A (enExample)
KR (1) KR900007263B1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009724A (en) * 1990-07-02 1991-04-23 At&T Bell Laboratories Soldering flux and method of its use in fabricating and assembling circuit boards
JPH07121468B2 (ja) * 1990-10-03 1995-12-25 メック株式会社 はんだ付け用フラックス
US5069730A (en) * 1991-01-28 1991-12-03 At&T Bell Laboratories Water-soluble soldering paste
JPH05212584A (ja) * 1992-01-31 1993-08-24 Senju Metal Ind Co Ltd ソルダーペースト
KR101163427B1 (ko) 2006-12-12 2012-07-13 센주긴조쿠고교 가부시키가이샤 납프리 땜납용 플럭스와 납땜 방법
CN105728982B (zh) * 2015-11-05 2017-11-24 广东轻工职业技术学院 一种高效助焊剂

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110159A (en) * 1974-07-16 1976-01-27 Matsushita Electric Industrial Co Ltd Handazukehoho

Also Published As

Publication number Publication date
JPH0459078B2 (enExample) 1992-09-21
JPS61242790A (ja) 1986-10-29
KR860008701A (ko) 1986-11-17

Similar Documents

Publication Publication Date Title
JP2690197B2 (ja) 清浄不要のはんだ付用フラックス及びその使用方法
US4478650A (en) Water soluble flux
US5064480A (en) Water washable soldering paste
EP0183705B1 (en) Soldering flux
KR100192681B1 (ko) 이염기 에스테르 및 탄화수소 용매로 구성되는, 인쇄 회로판용 세정 조성물
GB2243623A (en) Low-residue soldering flux based on dicarboxylic acids.
CN101557903A (zh) 无铅软钎料用焊剂和软钎焊方法
CA2022625A1 (en) Cleaning composition of dibasic ester, hydrocarbon solvent, compatibilizing surfactant and water
KR20020089455A (ko) 양이온성 계면활성제를 가진 납땜 용제
SE457335B (sv) Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet
US5281281A (en) No-clean, low-residue, volatile organic compound free soldering flux and method of use
US5011620A (en) Cleaning composition of dibasic ester and hydrocarbon solvent
US5062988A (en) Cleaning composition of dibasic ester, hydrocarbon solvent and compatibilizing component
KR900007263B1 (ko) 납땜용 플럭스
WO2020262632A1 (ja) フラックス及びソルダペースト
US3305406A (en) Method of fluxing an article to be soldered with noncorrosive fluxing compositions
US4523712A (en) Soldering composition and method of soldering therewith
JP3368502B2 (ja) 洗浄不要かつ低残存性の、揮発性有機化合物を含まないハンダ付けフラツクス溶液および使用方法
US5131962A (en) Low-residual type soldering flux
EP0538821B1 (en) Foaming flux for automatic soldering process
JPS58179562A (ja) はんだ付方法とはんだ付用フラツクス組成物
EP0458161B1 (en) Water-soluble soldering flux
JPS6390390A (ja) 半田付け用フラツクス
US5395548A (en) Non-azeotropic solvent composition for cleaning and defluxing electrical assemblies
EP0550460B1 (en) Solder fluxes bearing oxide removers generated by light

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 19940819

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19951007

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19951007

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000