JPS6124176B2 - - Google Patents

Info

Publication number
JPS6124176B2
JPS6124176B2 JP7404882A JP7404882A JPS6124176B2 JP S6124176 B2 JPS6124176 B2 JP S6124176B2 JP 7404882 A JP7404882 A JP 7404882A JP 7404882 A JP7404882 A JP 7404882A JP S6124176 B2 JPS6124176 B2 JP S6124176B2
Authority
JP
Japan
Prior art keywords
copper foil
epoxy resin
copper
silane coupling
coupling agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7404882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58191153A (ja
Inventor
Atsushi Fujioka
Yasuo Myadera
Tomio Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP7404882A priority Critical patent/JPS58191153A/ja
Publication of JPS58191153A publication Critical patent/JPS58191153A/ja
Publication of JPS6124176B2 publication Critical patent/JPS6124176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Laminated Bodies (AREA)
JP7404882A 1982-04-30 1982-04-30 エポキシ樹脂銅張積層板 Granted JPS58191153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7404882A JPS58191153A (ja) 1982-04-30 1982-04-30 エポキシ樹脂銅張積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7404882A JPS58191153A (ja) 1982-04-30 1982-04-30 エポキシ樹脂銅張積層板

Publications (2)

Publication Number Publication Date
JPS58191153A JPS58191153A (ja) 1983-11-08
JPS6124176B2 true JPS6124176B2 (enrdf_load_stackoverflow) 1986-06-10

Family

ID=13535899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7404882A Granted JPS58191153A (ja) 1982-04-30 1982-04-30 エポキシ樹脂銅張積層板

Country Status (1)

Country Link
JP (1) JPS58191153A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW326423B (en) * 1993-08-06 1998-02-11 Gould Inc Metallic foil with adhesion promoting layer

Also Published As

Publication number Publication date
JPS58191153A (ja) 1983-11-08

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