JPS61235150A - 電気回路配線用基板の製造方法 - Google Patents

電気回路配線用基板の製造方法

Info

Publication number
JPS61235150A
JPS61235150A JP60077247A JP7724785A JPS61235150A JP S61235150 A JPS61235150 A JP S61235150A JP 60077247 A JP60077247 A JP 60077247A JP 7724785 A JP7724785 A JP 7724785A JP S61235150 A JPS61235150 A JP S61235150A
Authority
JP
Japan
Prior art keywords
adhesive
film
metal foil
adhesive layer
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60077247A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0464307B2 (enExample
Inventor
清水　規之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikkan Industries Co Ltd
Original Assignee
Nikkan Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikkan Industries Co Ltd filed Critical Nikkan Industries Co Ltd
Priority to JP60077247A priority Critical patent/JPS61235150A/ja
Publication of JPS61235150A publication Critical patent/JPS61235150A/ja
Publication of JPH0464307B2 publication Critical patent/JPH0464307B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP60077247A 1985-04-11 1985-04-11 電気回路配線用基板の製造方法 Granted JPS61235150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60077247A JPS61235150A (ja) 1985-04-11 1985-04-11 電気回路配線用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077247A JPS61235150A (ja) 1985-04-11 1985-04-11 電気回路配線用基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61235150A true JPS61235150A (ja) 1986-10-20
JPH0464307B2 JPH0464307B2 (enExample) 1992-10-14

Family

ID=13628526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077247A Granted JPS61235150A (ja) 1985-04-11 1985-04-11 電気回路配線用基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61235150A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001074962A1 (fr) * 2000-03-31 2001-10-11 Hitachi Chemical Co., Ltd. Composition adhesive, son procede de preparation, film adhesif dans lequel ladite composition est utilisee, substrat pour semiconducteur et dispositif a semiconducteur

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001074962A1 (fr) * 2000-03-31 2001-10-11 Hitachi Chemical Co., Ltd. Composition adhesive, son procede de preparation, film adhesif dans lequel ladite composition est utilisee, substrat pour semiconducteur et dispositif a semiconducteur
US7070670B2 (en) 2000-03-31 2006-07-04 Hitachi Chemical Co., Ltd. Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
KR100815314B1 (ko) 2000-03-31 2008-03-19 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착필름, 반도체 탑재용 기판 및 반도체 장치

Also Published As

Publication number Publication date
JPH0464307B2 (enExample) 1992-10-14

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