JPS6122462B2 - - Google Patents

Info

Publication number
JPS6122462B2
JPS6122462B2 JP55155342A JP15534280A JPS6122462B2 JP S6122462 B2 JPS6122462 B2 JP S6122462B2 JP 55155342 A JP55155342 A JP 55155342A JP 15534280 A JP15534280 A JP 15534280A JP S6122462 B2 JPS6122462 B2 JP S6122462B2
Authority
JP
Japan
Prior art keywords
capillary
semiconductor element
thermocompression bonding
thin metal
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55155342A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5779630A (en
Inventor
Kazuo Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55155342A priority Critical patent/JPS5779630A/ja
Publication of JPS5779630A publication Critical patent/JPS5779630A/ja
Publication of JPS6122462B2 publication Critical patent/JPS6122462B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H10W72/07141—
    • H10W72/073—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5522—
    • H10W72/884—

Landscapes

  • Wire Bonding (AREA)
JP55155342A 1980-11-05 1980-11-05 Assembling of semiconductor device Granted JPS5779630A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55155342A JPS5779630A (en) 1980-11-05 1980-11-05 Assembling of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55155342A JPS5779630A (en) 1980-11-05 1980-11-05 Assembling of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5779630A JPS5779630A (en) 1982-05-18
JPS6122462B2 true JPS6122462B2 (enExample) 1986-05-31

Family

ID=15603789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55155342A Granted JPS5779630A (en) 1980-11-05 1980-11-05 Assembling of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5779630A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334764U (enExample) * 1989-08-10 1991-04-04

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51430A (ja) * 1974-06-22 1976-01-06 Goro Nishizawa Shitsunaigorufujugiho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334764U (enExample) * 1989-08-10 1991-04-04

Also Published As

Publication number Publication date
JPS5779630A (en) 1982-05-18

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