JPH0510357Y2 - - Google Patents

Info

Publication number
JPH0510357Y2
JPH0510357Y2 JP1985125498U JP12549885U JPH0510357Y2 JP H0510357 Y2 JPH0510357 Y2 JP H0510357Y2 JP 1985125498 U JP1985125498 U JP 1985125498U JP 12549885 U JP12549885 U JP 12549885U JP H0510357 Y2 JPH0510357 Y2 JP H0510357Y2
Authority
JP
Japan
Prior art keywords
workpiece
bonding
temperature
heater block
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985125498U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234430U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985125498U priority Critical patent/JPH0510357Y2/ja
Publication of JPS6234430U publication Critical patent/JPS6234430U/ja
Application granted granted Critical
Publication of JPH0510357Y2 publication Critical patent/JPH0510357Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP1985125498U 1985-08-17 1985-08-17 Expired - Lifetime JPH0510357Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985125498U JPH0510357Y2 (enExample) 1985-08-17 1985-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985125498U JPH0510357Y2 (enExample) 1985-08-17 1985-08-17

Publications (2)

Publication Number Publication Date
JPS6234430U JPS6234430U (enExample) 1987-02-28
JPH0510357Y2 true JPH0510357Y2 (enExample) 1993-03-15

Family

ID=31018447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985125498U Expired - Lifetime JPH0510357Y2 (enExample) 1985-08-17 1985-08-17

Country Status (1)

Country Link
JP (1) JPH0510357Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021257748A1 (en) * 2020-06-18 2021-12-23 Kulicke And Soffa Industries, Inc. Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605125U (ja) * 1983-05-31 1985-01-14 ロ−ム株式会社 半導体装置組み立て用ヒ−タブロツク
JPH0732168B2 (ja) * 1983-07-08 1995-04-10 株式会社東芝 半導体装置の製造方法
JPS60167336A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 加熱装置

Also Published As

Publication number Publication date
JPS6234430U (enExample) 1987-02-28

Similar Documents

Publication Publication Date Title
JPH0510357Y2 (enExample)
JPH0448738A (ja) ダイボンド装置
JPS63310146A (ja) リ−ドフレ−ムの製造方法
JPS6231129A (ja) 半導体装置組立てボンダ−用ワ−ク加熱装置
JPS6228066A (ja) スパツタリング用タ−ゲツトの製造方法
JPS6122462B2 (enExample)
JPS6355214B2 (enExample)
JPS6013991U (ja) 整経時のワキシング装置
JPH0138727Y2 (enExample)
JPH047102B2 (enExample)
JPS5948699B2 (ja) ハンダ接着方法
JPS6380544A (ja) Ｉｃワイヤ−ボンダ−の加熱装置
JPS5836464Y2 (ja) ペデスタルウエルドチツプの構造
JPS63232438A (ja) ワイヤボンデイング方法
JPH0650751B2 (ja) ボンディング装置
JPH0269950A (ja) ワイヤボンディング装置
JPS60242964A (ja) 研磨用ピツチ皿の形成方法
JPH01120839A (ja) 化合物半導体素子吸着用コレット
JPS61201208A (ja) 光フアイバ−結合構造
JPH0229526U (enExample)
JPH0587976B2 (enExample)
JPH03296230A (ja) ワーク加熱装置
JPS58175887U (ja) 気体レ−ザ加工装置
JPS5989315U (ja) 眼鏡における鼻あての支持装置
JP2001053104A (ja) ワイヤボンディング装置