JPS6122461B2 - - Google Patents
Info
- Publication number
- JPS6122461B2 JPS6122461B2 JP55137471A JP13747180A JPS6122461B2 JP S6122461 B2 JPS6122461 B2 JP S6122461B2 JP 55137471 A JP55137471 A JP 55137471A JP 13747180 A JP13747180 A JP 13747180A JP S6122461 B2 JPS6122461 B2 JP S6122461B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- plastic deformation
- leads
- degree
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55137471A JPS5762550A (en) | 1980-10-01 | 1980-10-01 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55137471A JPS5762550A (en) | 1980-10-01 | 1980-10-01 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5762550A JPS5762550A (en) | 1982-04-15 |
| JPS6122461B2 true JPS6122461B2 (enExample) | 1986-05-31 |
Family
ID=15199376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55137471A Granted JPS5762550A (en) | 1980-10-01 | 1980-10-01 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5762550A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102040U (enExample) * | 1984-12-10 | 1986-06-28 | ||
| JPH01104031U (enExample) * | 1987-12-25 | 1989-07-13 | ||
| US4842662A (en) * | 1988-06-01 | 1989-06-27 | Hewlett-Packard Company | Process for bonding integrated circuit components |
-
1980
- 1980-10-01 JP JP55137471A patent/JPS5762550A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5762550A (en) | 1982-04-15 |
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