JPS5762550A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5762550A
JPS5762550A JP55137471A JP13747180A JPS5762550A JP S5762550 A JPS5762550 A JP S5762550A JP 55137471 A JP55137471 A JP 55137471A JP 13747180 A JP13747180 A JP 13747180A JP S5762550 A JPS5762550 A JP S5762550A
Authority
JP
Japan
Prior art keywords
lead
connection
electrode
substrate
plastically deformed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55137471A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6122461B2 (enExample
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55137471A priority Critical patent/JPS5762550A/ja
Publication of JPS5762550A publication Critical patent/JPS5762550A/ja
Publication of JPS6122461B2 publication Critical patent/JPS6122461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads

Landscapes

  • Wire Bonding (AREA)
JP55137471A 1980-10-01 1980-10-01 Semiconductor device Granted JPS5762550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55137471A JPS5762550A (en) 1980-10-01 1980-10-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55137471A JPS5762550A (en) 1980-10-01 1980-10-01 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5762550A true JPS5762550A (en) 1982-04-15
JPS6122461B2 JPS6122461B2 (enExample) 1986-05-31

Family

ID=15199376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55137471A Granted JPS5762550A (en) 1980-10-01 1980-10-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5762550A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102040U (enExample) * 1984-12-10 1986-06-28
JPH01104031U (enExample) * 1987-12-25 1989-07-13
JPH02119153A (ja) * 1988-06-01 1990-05-07 Hewlett Packard Co <Hp> 集積回路用ボンディング方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102040U (enExample) * 1984-12-10 1986-06-28
JPH01104031U (enExample) * 1987-12-25 1989-07-13
JPH02119153A (ja) * 1988-06-01 1990-05-07 Hewlett Packard Co <Hp> 集積回路用ボンディング方法

Also Published As

Publication number Publication date
JPS6122461B2 (enExample) 1986-05-31

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