JPS61223199A - リードフレームのメツキ処理装置 - Google Patents
リードフレームのメツキ処理装置Info
- Publication number
- JPS61223199A JPS61223199A JP4299986A JP4299986A JPS61223199A JP S61223199 A JPS61223199 A JP S61223199A JP 4299986 A JP4299986 A JP 4299986A JP 4299986 A JP4299986 A JP 4299986A JP S61223199 A JPS61223199 A JP S61223199A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating
- rollers
- treatment
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 35
- 238000011282 treatment Methods 0.000 title abstract description 14
- 238000012545 processing Methods 0.000 claims description 34
- 239000007788 liquid Substances 0.000 abstract description 6
- 230000003449 preventive effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000002203 pretreatment Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011328 necessary treatment Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4299986A JPS61223199A (ja) | 1986-02-28 | 1986-02-28 | リードフレームのメツキ処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4299986A JPS61223199A (ja) | 1986-02-28 | 1986-02-28 | リードフレームのメツキ処理装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56141649A Division JPS5845399A (ja) | 1981-09-10 | 1981-09-10 | メツキ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61223199A true JPS61223199A (ja) | 1986-10-03 |
JPH0122357B2 JPH0122357B2 (enrdf_load_stackoverflow) | 1989-04-26 |
Family
ID=12651711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4299986A Granted JPS61223199A (ja) | 1986-02-28 | 1986-02-28 | リードフレームのメツキ処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61223199A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02159400A (ja) * | 1988-12-07 | 1990-06-19 | Chemcut Corp | 金属シート基材から保護被覆を電気分解により除去する方法及び装置 |
EP3232568A4 (en) * | 2014-12-11 | 2018-08-08 | Hitachi Metals, Ltd. | Method for manufacturing hermetic-sealing lid member, hermetic-sealing lid member, and method for manufacturing electronic component storing package |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5429063A (en) * | 1977-08-08 | 1979-03-03 | Tokyo Shibaura Electric Co | Electroplating apparatus for print wire substrate |
-
1986
- 1986-02-28 JP JP4299986A patent/JPS61223199A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5429063A (en) * | 1977-08-08 | 1979-03-03 | Tokyo Shibaura Electric Co | Electroplating apparatus for print wire substrate |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02159400A (ja) * | 1988-12-07 | 1990-06-19 | Chemcut Corp | 金属シート基材から保護被覆を電気分解により除去する方法及び装置 |
EP3232568A4 (en) * | 2014-12-11 | 2018-08-08 | Hitachi Metals, Ltd. | Method for manufacturing hermetic-sealing lid member, hermetic-sealing lid member, and method for manufacturing electronic component storing package |
US10461001B2 (en) | 2014-12-11 | 2019-10-29 | Hitachi Metals, Ltd. | Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package |
Also Published As
Publication number | Publication date |
---|---|
JPH0122357B2 (enrdf_load_stackoverflow) | 1989-04-26 |
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