JPS61222151A - 半導体搭載用プリント配線板の製造方法 - Google Patents

半導体搭載用プリント配線板の製造方法

Info

Publication number
JPS61222151A
JPS61222151A JP60064599A JP6459985A JPS61222151A JP S61222151 A JPS61222151 A JP S61222151A JP 60064599 A JP60064599 A JP 60064599A JP 6459985 A JP6459985 A JP 6459985A JP S61222151 A JPS61222151 A JP S61222151A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
mounting
sheet
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60064599A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0452623B2 (enExample
Inventor
Kenro Kimata
木俣　賢朗
Katsumi Mabuchi
勝美 馬渕
Hajime Yatsu
矢津　一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60064599A priority Critical patent/JPS61222151A/ja
Publication of JPS61222151A publication Critical patent/JPS61222151A/ja
Publication of JPH0452623B2 publication Critical patent/JPH0452623B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60064599A 1985-03-27 1985-03-27 半導体搭載用プリント配線板の製造方法 Granted JPS61222151A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60064599A JPS61222151A (ja) 1985-03-27 1985-03-27 半導体搭載用プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60064599A JPS61222151A (ja) 1985-03-27 1985-03-27 半導体搭載用プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS61222151A true JPS61222151A (ja) 1986-10-02
JPH0452623B2 JPH0452623B2 (enExample) 1992-08-24

Family

ID=13262876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60064599A Granted JPS61222151A (ja) 1985-03-27 1985-03-27 半導体搭載用プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS61222151A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274056A (ja) * 1988-09-09 1990-03-14 Matsushita Electric Ind Co Ltd チップキャリア及びチップキャリアアレイ
JPH0567694A (ja) * 1991-09-09 1993-03-19 Nec Corp リードレスチツプキヤリア用フレーム基板
JP2000340698A (ja) * 1999-06-01 2000-12-08 New Japan Radio Co Ltd リードレスチップキャリア用基板及びリードレスチップキャリア
JP2002334951A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体素子搭載用基板及び半導体パッケージ
JP2002334950A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体パッケージの製造法及び半導体パッケージ
JP2002334948A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体パッケージ、半導体素子搭載用基板及びそれらの製造方法
JP2002334949A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体パッケージ及び半導体素子搭載用基板の製造方法
KR100400949B1 (ko) * 1994-12-05 2003-12-06 모토로라 인코포레이티드 볼-그리드어레이조립들을위한멀티-스트랜드기판및방법
US6686226B1 (en) 1994-02-10 2004-02-03 Hitachi, Ltd. Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame
US6746897B2 (en) 1994-03-18 2004-06-08 Naoki Fukutomi Fabrication process of semiconductor package and semiconductor package
DE19802575B4 (de) * 1997-01-25 2005-10-13 LG Semicon Co., Ltd., Cheongju Verfahren zum Herstellen einer Einheit für ein Ball-Grid-Array-Halbleiterbauteil und zum Herstellen eines Ball-Grid-Array-Halbleiterbauteils
CN103531554A (zh) * 2013-08-05 2014-01-22 日月光半导体制造股份有限公司 半导体组件及其制造方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274056A (ja) * 1988-09-09 1990-03-14 Matsushita Electric Ind Co Ltd チップキャリア及びチップキャリアアレイ
JPH0567694A (ja) * 1991-09-09 1993-03-19 Nec Corp リードレスチツプキヤリア用フレーム基板
US6686226B1 (en) 1994-02-10 2004-02-03 Hitachi, Ltd. Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame
US6861294B2 (en) 1994-02-10 2005-03-01 Renesas Technology Corp. Semiconductor devices and methods of making the devices
US6746897B2 (en) 1994-03-18 2004-06-08 Naoki Fukutomi Fabrication process of semiconductor package and semiconductor package
US7187072B2 (en) 1994-03-18 2007-03-06 Hitachi Chemical Company, Ltd. Fabrication process of semiconductor package and semiconductor package
JP2002334949A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体パッケージ及び半導体素子搭載用基板の製造方法
JP2002334948A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体パッケージ、半導体素子搭載用基板及びそれらの製造方法
JP2002334950A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体パッケージの製造法及び半導体パッケージ
EP1213755A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
JP2002334951A (ja) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd 半導体素子搭載用基板及び半導体パッケージ
US6710265B2 (en) 1994-12-05 2004-03-23 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
KR100400949B1 (ko) * 1994-12-05 2003-12-06 모토로라 인코포레이티드 볼-그리드어레이조립들을위한멀티-스트랜드기판및방법
US7199306B2 (en) 1994-12-05 2007-04-03 Freescale Semiconductor, Inc. Multi-strand substrate for ball-grid array assemblies and method
US7397001B2 (en) 1994-12-05 2008-07-08 Freescale Semiconductor, Inc. Multi-strand substrate for ball-grid array assemblies and method
US20080289867A1 (en) * 1994-12-05 2008-11-27 Freescale Semiconductor, Inc. Multi-strand substrate for ball-grid array assemblies and method
DE19802575B4 (de) * 1997-01-25 2005-10-13 LG Semicon Co., Ltd., Cheongju Verfahren zum Herstellen einer Einheit für ein Ball-Grid-Array-Halbleiterbauteil und zum Herstellen eines Ball-Grid-Array-Halbleiterbauteils
JP2000340698A (ja) * 1999-06-01 2000-12-08 New Japan Radio Co Ltd リードレスチップキャリア用基板及びリードレスチップキャリア
CN103531554A (zh) * 2013-08-05 2014-01-22 日月光半导体制造股份有限公司 半导体组件及其制造方法
CN106098661A (zh) * 2013-08-05 2016-11-09 日月光半导体制造股份有限公司 半导体组件及其制造方法

Also Published As

Publication number Publication date
JPH0452623B2 (enExample) 1992-08-24

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