JPS61220332A - エッチング終点判定方法 - Google Patents
エッチング終点判定方法Info
- Publication number
- JPS61220332A JPS61220332A JP6061985A JP6061985A JPS61220332A JP S61220332 A JPS61220332 A JP S61220332A JP 6061985 A JP6061985 A JP 6061985A JP 6061985 A JP6061985 A JP 6061985A JP S61220332 A JPS61220332 A JP S61220332A
- Authority
- JP
- Japan
- Prior art keywords
- end point
- point determination
- etching
- plasma light
- conversion means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6061985A JPS61220332A (ja) | 1985-03-27 | 1985-03-27 | エッチング終点判定方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6061985A JPS61220332A (ja) | 1985-03-27 | 1985-03-27 | エッチング終点判定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61220332A true JPS61220332A (ja) | 1986-09-30 |
JPH0455329B2 JPH0455329B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-09-03 |
Family
ID=13147473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6061985A Granted JPS61220332A (ja) | 1985-03-27 | 1985-03-27 | エッチング終点判定方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61220332A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01226153A (ja) * | 1988-03-07 | 1989-09-08 | Hitachi Ltd | エッチング終点判定装置 |
JPH01235336A (ja) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | エッチング終点判定装置 |
JPH01241127A (ja) * | 1988-03-23 | 1989-09-26 | Hitachi Ltd | エッチング終点判定方法 |
JPH0348423A (ja) * | 1989-07-17 | 1991-03-01 | Hitachi Ltd | 終点判定方法および装置 |
JPH05267224A (ja) * | 1992-03-19 | 1993-10-15 | Nec Yamaguchi Ltd | ドライエッチング装置 |
US5374327A (en) * | 1992-04-28 | 1994-12-20 | Tokyo Electron Limited | Plasma processing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5563830A (en) * | 1978-11-08 | 1980-05-14 | Chiyou Lsi Gijutsu Kenkyu Kumiai | End point detection method and its apparatus |
JPS56133466A (en) * | 1980-03-24 | 1981-10-19 | Anelva Corp | Plasma spectrum monitoring apparatus |
JPS58215030A (ja) * | 1982-06-08 | 1983-12-14 | Kokusai Electric Co Ltd | 半導体基板のドライエツチング終了時点検出装置 |
JPS58216423A (ja) * | 1982-06-10 | 1983-12-16 | Hitachi Ltd | エツチング終点検出装置 |
-
1985
- 1985-03-27 JP JP6061985A patent/JPS61220332A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5563830A (en) * | 1978-11-08 | 1980-05-14 | Chiyou Lsi Gijutsu Kenkyu Kumiai | End point detection method and its apparatus |
JPS56133466A (en) * | 1980-03-24 | 1981-10-19 | Anelva Corp | Plasma spectrum monitoring apparatus |
JPS58215030A (ja) * | 1982-06-08 | 1983-12-14 | Kokusai Electric Co Ltd | 半導体基板のドライエツチング終了時点検出装置 |
JPS58216423A (ja) * | 1982-06-10 | 1983-12-16 | Hitachi Ltd | エツチング終点検出装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01226153A (ja) * | 1988-03-07 | 1989-09-08 | Hitachi Ltd | エッチング終点判定装置 |
JPH01235336A (ja) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | エッチング終点判定装置 |
JPH01241127A (ja) * | 1988-03-23 | 1989-09-26 | Hitachi Ltd | エッチング終点判定方法 |
JPH0348423A (ja) * | 1989-07-17 | 1991-03-01 | Hitachi Ltd | 終点判定方法および装置 |
JPH05267224A (ja) * | 1992-03-19 | 1993-10-15 | Nec Yamaguchi Ltd | ドライエッチング装置 |
US5374327A (en) * | 1992-04-28 | 1994-12-20 | Tokyo Electron Limited | Plasma processing method |
Also Published As
Publication number | Publication date |
---|---|
JPH0455329B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-09-03 |